Situation: The Cooling Challenge of Wafer-Scale AI ChipsAir Cooling Fails. Conventional Liquid Cooling Cannot Cover the Area.Our client, a global leader in AI accelerator development, has created a wafer-scale AI chip with side length exceeding 20cm and single-chip power consumption reaching several Read More

The ChallengeA leading industrial computer manufacturer faced a critical dilemma: their embedded systems required increasingly powerful processors, but space constraints and noise regulations made traditional cooling solutions impractical. Their existing CPU cooler—measuring 30mm in height and gener Read More

Situation: 400 Watts. 44.5mm of Space. A PCB Full of ObstaclesA globally leading Tier-1 communications equipment manufacturer came to us at a critical juncture in their next-generation high-density network switch development program. The engineering team faced two compounding challenges that were pu Read More

The Problem That Brought Them to UsHere's a scenario that's becoming all too familiar in the optical module world:Power keeps climbing. The form factor? Locked in concrete.As the industry races from 400G to 800G and beyond, power consumption has exploded—from a few watts to 15W, 20W, even higher. Bu Read More

A Real Case from Russia: ICE LAKE Running at 270W with No ThrottlingA Few Honest Words Up FrontIf you work on server cooling, you've probably noticed the same trend: CPUs are getting hotter.We used to say the limit for a 1U server cooling solution was around 150W. Now customers come to us asking for Read More

Situation: The Challenge of 1U Server Cooling Capacity Enhancement
1U server cooling capacity is inherently limited by its compact chassis space, and traditional air-cooling solutions often fall short when facing the deployment demands of high-density servers.
A Russian server manufacturer, while developing a next-generation high-performance 1U server for data center clients, encountered a difficult technical challenge: The client required stable operation under high load for Intel's 3rd Gen Xeon Scalable Processors (Ice Lake), but the cramped space of a 1U server simply could not accommodate conventional high-power cooling solutions. After attempting multiple traditional designs, CPU temperatures remained excessive, putting the project at risk of delay. How to achieve 1U server cooling capacity enhancement within extreme spatial limits became the core technical challenge that the client had to overcome. Read More

With AMD's 5th Gen EPYC processors surpassing the 500W Thermal Design Power , data centers face a critical choice: adopt complex liquid cooling systems with inherent leakage risks, or seek more reliable and cost-effective air-cooled alternatives. A leading global server manufacturer, while developing its next-generation high-performance computing platform, explicitly required achieving cooling performance comparable to liquid cooling through innovative air-cooling technology. This aimed to reduce Total Cost of Ownership and simplify operations for their end-customers, all while maintaining system stability. Read More

Intel's 5th Gen Xeon Scalable Processors deliver powerful performance, but their sustained power of up to 350W on the Eagle Stream platform poses dual pressures on both thermal design and the Total Cost of Ownership for data center servers. A leading server manufacturer needed to find a thermal solution for its next-generation 1U/2U servers that not only met extreme cooling performance requirements but also offered excellent cost-effectiveness and manufacturability, all while ensuring long-term system reliability. Read More

As a professional optical module thermal system B2B service provider, we collaborated with a communication equipment manufacturer to develop a QSFPDD optical module thermal solution for their OTN equipment. The client required not only that the heatsink design meet stringent thermal performance requirements but also that the heatsink be integrated and assembled with the optical module Cage for shipment. This project faced two major challenges: translating the conceptual thermal structure into a manufacturable solution, and the client's lack of optical module Cage supply chain resources. Read More

Executive Summary: A Common Engineering Challenge
As high-speed optical modules evolve towards higher density and miniaturization, the conflict between thermal performance and mechanical structure has become a widespread industry pain point. Mature form factors like CFP2 often face the fundamental contradiction between "enhanced cooling requiring space" and "fixed system layout space." This article systematically deconstructs, through a typical case study, how to achieve dual breakthroughs in performance and compatibility without altering the main system architecture, via innovative thermal conduction processes and co-design of structures. Read More