With AMD's 5th Gen EPYC processors surpassing the 500W Thermal Design Power , data centers face a critical choice: adopt complex liquid cooling systems with inherent leakage risks, or seek more reliable and cost-effective air-cooled alternatives. A leading global server manufacturer, while developing its next-generation high-performance computing platform, explicitly required achieving cooling performance comparable to liquid cooling through innovative air-cooling technology. This aimed to reduce Total Cost of Ownership and simplify operations for their end-customers, all while maintaining system stability. Read More

Intel's 5th Gen Xeon Scalable Processors deliver powerful performance, but their sustained power of up to 350W on the Eagle Stream platform poses dual pressures on both thermal design and the Total Cost of Ownership for data center servers. A leading server manufacturer needed to find a thermal solution for its next-generation 1U/2U servers that not only met extreme cooling performance requirements but also offered excellent cost-effectiveness and manufacturability, all while ensuring long-term system reliability. Read More

As a professional optical module thermal system B2B service provider, we collaborated with a communication equipment manufacturer to develop a QSFPDD optical module thermal solution for their OTN equipment. The client required not only that the heatsink design meet stringent thermal performance requirements but also that the heatsink be integrated and assembled with the optical module Cage for shipment. This project faced two major challenges: translating the conceptual thermal structure into a manufacturable solution, and the client's lack of optical module Cage supply chain resources. Read More

Executive Summary: A Common Engineering Challenge
As high-speed optical modules evolve towards higher density and miniaturization, the conflict between thermal performance and mechanical structure has become a widespread industry pain point. Mature form factors like CFP2 often face the fundamental contradiction between "enhanced cooling requiring space" and "fixed system layout space." This article systematically deconstructs, through a typical case study, how to achieve dual breakthroughs in performance and compatibility without altering the main system architecture, via innovative thermal conduction processes and co-design of structures. Read More

Situation
A consumer electronics device manufacturer was developing a desktop laser engraver. They needed an efficient and low-noise thermal management solution for desktop laser equipment within an extremely compact mechanical space (103×56×56mm) for a 20W laser diode. They sought a thermal partner with integrated OEM/ODM cooling module development and manufacturing capabilities.
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In an era of concurrent energy transition and digital transformation, high-power equipment faces a common challenge: how to stably and efficiently convert every kilowatt-hour of electricity into reliable output. Whether it’s IGBT modules in renewable energy power stations or GPU clusters in data centers, thermal bottlenecks are increasingly becoming critical constraints on performance delivery and long-term reliability. We specialize in addressing this core pain point, providing comprehensive thermal management solutions for critical equipment—from chips to systems. Read More

Our thermal engineering service identified a critical 30W limit in client's heatsink design. Through heat pipe upgrade & optimization, we achieved 60W stable performance, mitigating mass production risks. Partner with us for reliable OEM thermal solutions. Read More

Situation：Overcoming the 800W Thermal Barrier in 4U Core Switches
Network equipment manufacturers face a critical challenge when developing next-generation data center core switches: dissipating 800W of thermal power from a single Broadcom Tomahawk 5 chip within a compact 4U form factor. The requirement to achieve ultra-low thermal resistance below 0.045°C/W under 500CFM forced air cooling represented a near-limit performance demand for air cooling technology, necessitating a partnership with an advanced thermal solution provider. Read More

A server manufacturer faced significant thermal challenges while developing its next-generation high-density GPU computing platform. The design required integrating four NVIDIA A-Series high-power chips in a 2×2 array layout within a confined space, with each chip dissipating 500W. The client stipulated that the case temperature (Tcase) of each chip must remain below 80°C, and the temperature differential between the front and rear chip groups must be controlled within 3°C to ensure system stability and computational consistency under sustained high loads. Read More

A globally leading Tier-1 communications equipment client encountered critical thermal management challenges during the development of their next-generation coherent optical modules. The module contains two heat sources, each operating at 13W with a compact size of 27×13mm, while the system's permissible air cooling capacity is limited to only 10CFM. The client required the overall thermal resistance to be strictly maintained within 0.6°C/W and sought comprehensive thermal technology support spanning thermal design, prototype development, testing, and mass production. Read More