We have a dedicated engineering technical services team with deep expertise in the field of thermal design and simulation, long focused on the thermal management challenges of high-power, high-density, and high-reliability systems. Leveraging professional thermal simulation software platforms, combined with a solid theoretical foundation in heat transfer and extensive practical engineering experience, we provide full-process thermal solutions—from concept design to mass production—for various key industries including electronic equipment, data centers, energy storage systems, industrial lasers, communication base stations, and high-end instrumentation.

Amid the trends of increasing product miniaturization, integration, and higher power consumption, thermal issues have become a core bottleneck restricting performance release and long-term reliability. Traditional "trial-and-error" development relies on repeated prototyping and physical testing, which not only involves long cycles and high costs but also struggles to cover all operational boundaries. High-precision thermal simulation analysis is the key tool to solve this challenge:

Replace numerous physical prototypes with virtual verification, reducing mold modifications, structural rework, and material waste.

Rapidly iterate cooling solutions early in the design phase, identifying thermal risks at the conceptual stage to avoid major changes later.

Utilize parametric modeling, multi-scheme comparison, and automatic optimization algorithms to systematically explore combinations of variables such as fin density, airflow path layout, material selection, and cooling methods, locking in the optimal balance between performance, size, weight, and cost.

• In the field of electronic equipment, we provide efficient cooling solutions for highly integrated motherboards, power modules, industrial control equipment, and consumer electronics within compact spaces, effectively preventing performance throttling, component aging, or functional failure caused by local overheating.

• In the communications industry, we provide thermal simulation support for 5G AAUs, BBUs, micro base stations, and optical transmission equipment, addressing heat dissipation bottlenecks caused by the dense layout of high-power chips, ensuring continuous and stable operation in outdoor high-temperature, sealed, or fanless environments.