LED lighting technology continues to develop towards higher luminous efficacy, intelligent dimming, and integration. The increasing power density of COB packaging and drive circuits makes heat dissipation a key factor affecting lifespan and lumen depreciation.

Low thermal resistance heat dissipation must be achieved within constraints of design and space, ensuring long-term stability of luminous efficacy and color temperature.

• Die-Cast Aluminum Integrated Heatsinks: Combined with aerodynamic surface design, they enhance natural convection efficiency.
• Microchannel Liquid Cooling Heat Sinks: Enable precise temperature control, suitable for cooling high-power LED chips.