| Air Coonling Simuation Assessment Information Input Form | |
| Environmental Definition | Ambient Temperature (C ) Altitude (m) Gravity Direction Usage Environment (Indoor and Outdoor) |
| Installation Method | Installation Method Locking Force Requirements Avoidance Requirements |
| Size Information | Appearance Size Requirements (mm) |
| Power Consumption Information | Heat Source Power (W) Heat Source $pecifications (Quantity, Size, Location), Preferably Provide Chip Model and Datasheet Maximum Allowable Chip Jection Temperature Maximum Allowable Chip Temperature |
| Fan Specifications | Airflow(CFM) |
| Related component information | PCB Material and Thickness TlM Specifications Chassis Specifications (material, thickness, surface treatment) Heatsink Material and Surface Treatment Requirements |
| Cooling Method | Natural Cooling/Forced Air Cooling/Liquid Cooling |