Data centers are primarily responsible for supporting the operation of online services, applications, and platforms, encompassing core functions such as data storage, computing, network management, and service delivery. In the future, data centers will continue to evolve towards high-performance computing architectures, utilizing higher density servers, GPUs, and ASIC chips to meet the growing demands for AI training and real-time analytics.

In data centers, server processors are the core components responsible for executing computational tasks and processing data. Graphics Processing Units (GPUs) are indispensable components in areas such as deep learning, machine learning, and large-scale data analysis. Switch chips play a crucial role in data centers, collectively supporting efficient data processing, storage, and transmission.

• Heat Pipe Heatsinks: The stamped fin with heat pipe is widely used in the cooling solutions for servers and switches.
• Vapor chamber Heatsinks: vapor chambers effectively disperse concentrated heat across the entire plane, making them suitable for cooling chips with medium to high heat flux density.
• 3DVC Heatsinks: In the face of ultra-high power GPUs and CPUs, 3D vapor chamber serves as the ultimate air cooling solution, demonstrating its performance capabilities.
• Cold Plates: Liquid cooling systems, relying on powerful convective heat transfer capabilities, are going to become the primary cooling solution for data centers in the future.