Situation: 400 Watts. 44.5mm of Space. A PCB Full of ObstaclesA globally leading Tier-1 communications equipment manufacturer came to us at a critical juncture in their next-generation high-density network switch development program. The engineering team faced two compounding challenges that were pu Read More

Situation：Overcoming the 800W Thermal Barrier in 4U Core Switches
Network equipment manufacturers face a critical challenge when developing next-generation data center core switches: dissipating 800W of thermal power from a single Broadcom Tomahawk 5 chip within a compact 4U form factor. The requirement to achieve ultra-low thermal resistance below 0.045°C/W under 500CFM forced air cooling represented a near-limit performance demand for air cooling technology, necessitating a partnership with an advanced thermal solution provider. Read More