Situation: The Challenge of 1U Server Cooling Capacity Enhancement
1U server cooling capacity is inherently limited by its compact chassis space, and traditional air-cooling solutions often fall short when facing the deployment demands of high-density servers.
A Russian server manufacturer, while developing a next-generation high-performance 1U server for data center clients, encountered a difficult technical challenge: The client required stable operation under high load for Intel's 3rd Gen Xeon Scalable Processors (Ice Lake), but the cramped space of a 1U server simply could not accommodate conventional high-power cooling solutions. After attempting multiple traditional designs, CPU temperatures remained excessive, putting the project at risk of delay. How to achieve 1U server cooling capacity enhancement within extreme spatial limits became the core technical challenge that the client had to overcome. Read More

With AMD's 5th Gen EPYC processors surpassing the 500W Thermal Design Power , data centers face a critical choice: adopt complex liquid cooling systems with inherent leakage risks, or seek more reliable and cost-effective air-cooled alternatives. A leading global server manufacturer, while developing its next-generation high-performance computing platform, explicitly required achieving cooling performance comparable to liquid cooling through innovative air-cooling technology. This aimed to reduce Total Cost of Ownership and simplify operations for their end-customers, all while maintaining system stability. Read More

Intel's 5th Gen Xeon Scalable Processors deliver powerful performance, but their sustained power of up to 350W on the Eagle Stream platform poses dual pressures on both thermal design and the Total Cost of Ownership for data center servers. A leading server manufacturer needed to find a thermal solution for its next-generation 1U/2U servers that not only met extreme cooling performance requirements but also offered excellent cost-effectiveness and manufacturability, all while ensuring long-term system reliability. Read More

A server manufacturer faced significant thermal challenges while developing its next-generation high-density GPU computing platform. The design required integrating four NVIDIA A-Series high-power chips in a 2×2 array layout within a confined space, with each chip dissipating 500W. The client stipulated that the case temperature (Tcase) of each chip must remain below 80°C, and the temperature differential between the front and rear chip groups must be controlled within 3°C to ensure system stability and computational consistency under sustained high loads. Read More