Views: 33 Author: Site Editor Publish Time: 2026-03-03 Origin: Site
1U server cooling capacity is inherently limited by its compact chassis space, and traditional air-cooling solutions often fall short when facing the deployment demands of high-density servers.
The client required stable operation under high load for Intel's 3rd Gen Xeon Scalable Processors (Ice Lake), but the cramped space of a 1U server simply could not accommodate conventional high-power cooling solutions. After attempting multiple traditional designs, CPU temperatures remained excessive, putting the project at risk of delay. How to achieve 1U server cooling capacity enhancement within extreme spatial limits became the core technical challenge that the client had to overcome.
Cooling Performance: Achieve stable cooling under sustained high-power loads within the 1U space constraint, ensuring CPU temperatures remain below Intel's official specifications to prevent throttling
Space Utilization: Fully utilize the limited chassis space to maximize the cooling surface area
Validation Support: Provide comprehensive simulation data and test reports to support the client's rapid product launch
Mass Production Readiness: The solution must have good manufacturability and support volume delivery
Drawing inspiration from the EVAC structure concept found in Intel's standard heatsinks, we employed high-density server heat pipe cooling technology to efficiently conduct CPU heat to extended fin regions
Innovatively designed an extended heat pipe layout, deploying the fin array into available idle areas on the motherboard, significantly increasing the effective cooling surface area
Optimized heat pipe diameter, quantity, and bend angles based on the thermal characteristics of the Ice Lake processor to maximize heat transfer efficiency
This EVAC structure heatsink application case study fully validates the feasibility of this structural innovation
During the initial design phase, we built a complete airflow and thermal simulation model integrated with the client's 1U server system
Conducted multiple rounds of CFD simulations to accurately predict temperature distribution and airflow patterns under high-power operating conditions
Through simulation iterations, we optimized fin spacing, heat pipe layout, and mounting positions to find the optimal balance between thermal performance and airflow resistance
Simulation results confirmed that the solution could maintain CPU temperatures within specifications under high-power loads
Fabricated fully functional engineering prototypes, designated HP003, for system-level testing in a standard wind tunnel laboratory
Deployed high-precision thermocouples and an infrared thermal imaging camera to comprehensively monitor the temperature distribution across the heatsink surface
Conducted stability tests under high-power load conditions to verify the correlation between thermal performance and simulation results
Performed multiple comparative tests to ensure the solution's reliability across different ambient temperatures
| Cooling Performance | Space Value | Mass Production Validation |
|---|---|---|
| ✓ Stable operation under sustained high power | ✓ Higher computing density in 1U form factor | ✓ Mass production delivered |
| ✓ CPU temperatures meet specifications | ✓ Reduced rack space occupancy | ✓ Deployed in Russian data centers |
| ✓ No additional system power consumption | ✓ TCO savings | ✓ Passed all client validations |
The HP003 heat pipe heatsink successfully supports sustained high-power loads within the 1U space, significantly pushing the limits of 1U heatsink capability
Measured CPU core temperatures fully comply with Intel's Ice Lake processor specifications, ensuring stable server operation under full load
Heatsink airflow resistance was controlled within the supportable range of the client's system fans, requiring no additional system power consumption
Enabled the client to achieve a computing density previously requiring larger servers, without altering the 1U server form factor
Significantly reduced the client's rack space occupancy and overall Total Cost of Ownership
Comprehensive simulation and test reports facilitated the client's swift end-user validation process
This EVAC structure heatsink application case study provides a reusable design paradigm for the industry
The HP003 has passed all client validation stages and has entered mass production
The solution is now deployed in the client's high-performance computing and edge computing nodes targeting the Russian data center market
Successfully validated the reliability and commercial value of high-density server heat pipe cooling technology in high-power scenarios
| Case Study | Core Highlights |
|---|---|
| Overcoming the 500W EPYC Cooling Bottleneck: 3D Vapor Chamber Air Cooling Solution | 500W air cooling replaces liquid cooling, thermal resistance 0.077°C/W |
| Xeon 350W Cooling Optimization: 3D Vapor Chamber Solution Achieves 0.095°C/W | 3DVC technology, 22% airflow resistance reduction |
We specialize in providing high-power 1U server cooling solutions and Intel Ice Lake heatsink customization services for high-performance servers. If you are facing challenges with 1U server cooling capacity enhancement or are interested in learning from proven EVAC structure heatsink application case studies, please contact us for professional technical support and customized solutions.
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Email: info@greatminds.com.cn
