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HP003
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High-Performance 1U Server Platforms: Optimized for Intel Whitley platform 1U server systems, supporting Xeon SP 3rd generation processors
High-Density Data Center Deployments: 1U server configurations pursuing extreme rack density in hyperscale data centers
Edge Computing and Telecom Equipment: 5G edge servers, high-performance computing nodes in space-constrained telecom rooms
Enterprise Virtualization Platforms: Enterprise-grade virtualization hosts requiring high compute density and energy efficiency optimization
Modern 1U servers face three core thermal challenges while pursuing high-performance computing:
Extreme Space Constraints: Standard 1U chassis height is only 44.5mm, with actual available cooling height inside less than 35mm
High Heat Flux Density Problem: New-generation Xeon processors have heat flux densities exceeding 75W/cm², difficult for traditional cooling solutions
Stringent Reliability Requirements: Data center 7x24 continuous operation requires cooling solutions to meet 5+ years service life
Balancing Cooling Performance and Noise: Achieving efficient cooling while controlling noise levels within limited space
Traditional Aluminum Extrusion Heatsinks: Limited cooling area cannot meet 270W+ cooling requirements
Standard Heat Pipe Layouts: Limited by 1U height, heat pipes cannot achieve full efficiency
Insufficient Airflow Management: Complex airflow paths in 1U space easily create hotspots
Poor Maintainability: Traditional designs make field maintenance and cleaning difficult
We employ three-dimensional heat pipe layout and zipper fin composite technology to break through 1U cooling performance limits:
Space Breakthrough Design: Achieves maximum heat pipe efficiency within 32mm height through precision-bent Z-shaped heat pipe layout
Maximum Space Utilization:
Traditional Solution: Heat pipes can only be arranged linearly, utilization ~60%
HP003 Innovation: Z-shaped layout increases space utilization to 85%
Performance Improvement: Heat pipe effective length increases by 40% in same space
High-Density Cooling Array: 0.12mm ultra-thin aluminum sheets in zipper arrangement achieve maximum cooling area per unit volume
Aerodynamic Innovation:
Integrated Air Guide: Ensures all airflow passes through cooling fins, reducing bypass
Air Pressure Optimization: Fin angle micro-adjustments adapt to 1U space pressure characteristics
Turbulence Enhancement: Fin surface microstructures promote turbulence, improving heat transfer coefficient by 18%
Adaptive Installation Technology: 4-point independent spring pressure system ensures optimal contact under various installation conditions
Data Center Grade Protection: 6-10μm electroplated nickel layer + chromate passivation treatment
Optimizes 1U server internal airflow paths through professional CFD analysis
Establish precise thermal resistance network model predicting temperature distribution at each node
Comprehensive reliability testing ensures product meets data center requirements
Computing Density Revolution: Achieves cooling performance approaching 2U servers within 1U space
Virtualization Performance Breakthrough:
VM Density: Single server supports 15-20% more virtual machines
Application Performance: Database and virtualization application performance improved by 10-15%
Response Time: Application response time reduced by 8-12%
Standardization Compatibility: Fully compatible with standard 1U server architecture, no redesign needed
Fast Time-to-Market Advantages:
Development Cycle: Shortens development time by 3-4 months compared to in-house solutions
Certification Support: Provides complete test data and certification support
Risk Reduction: Validated design solution reduces technical risks
Total Cost of Ownership (TCO) Optimization: Full lifecycle cost optimization from procurement to operation
Market Differentiation Advantages:
Product Positioning: High-performance 1U servers, filling market gaps
Technical Highlights: 2U-level cooling performance within 1U space
Customer Value: Provides optimal solution for high-density deployment
Rack Density Revolution: Achieves higher server density within standard 42U racks
Economic Benefit Calculation:
Additional Revenue: $2,500-$3,500 annual revenue per additional server
Space Savings: $1,200-$1,800 annual savings per saved rack position
Overall Benefit: $5,000-$7,000 increased annual revenue per rack
PUE Improvement Contribution: Reduces cooling energy consumption through efficient cooling system
Carbon Emission Reduction:
Annual Electricity Savings per Rack: Approximately 1,200-1,800kWh
CO₂ Reduction: Approximately 800-1,200kg CO₂ reduction per rack annually
Sustainable Development: Supports green data center construction goals
System Availability Enhancement: Reduces cooling-related failure risks
Maintenance Cost Optimization:
Preventive Maintenance: 50% reduction in regular maintenance requirements
Failure Handling: Reduced on-site service frequency and costs
Spare Parts Inventory: Standardized design reduces spare parts variety
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
High-Performance 1U Server Platforms: Optimized for Intel Whitley platform 1U server systems, supporting Xeon SP 3rd generation processors
High-Density Data Center Deployments: 1U server configurations pursuing extreme rack density in hyperscale data centers
Edge Computing and Telecom Equipment: 5G edge servers, high-performance computing nodes in space-constrained telecom rooms
Enterprise Virtualization Platforms: Enterprise-grade virtualization hosts requiring high compute density and energy efficiency optimization
Modern 1U servers face three core thermal challenges while pursuing high-performance computing:
Extreme Space Constraints: Standard 1U chassis height is only 44.5mm, with actual available cooling height inside less than 35mm
High Heat Flux Density Problem: New-generation Xeon processors have heat flux densities exceeding 75W/cm², difficult for traditional cooling solutions
Stringent Reliability Requirements: Data center 7x24 continuous operation requires cooling solutions to meet 5+ years service life
Balancing Cooling Performance and Noise: Achieving efficient cooling while controlling noise levels within limited space
Traditional Aluminum Extrusion Heatsinks: Limited cooling area cannot meet 270W+ cooling requirements
Standard Heat Pipe Layouts: Limited by 1U height, heat pipes cannot achieve full efficiency
Insufficient Airflow Management: Complex airflow paths in 1U space easily create hotspots
Poor Maintainability: Traditional designs make field maintenance and cleaning difficult
We employ three-dimensional heat pipe layout and zipper fin composite technology to break through 1U cooling performance limits:
Space Breakthrough Design: Achieves maximum heat pipe efficiency within 32mm height through precision-bent Z-shaped heat pipe layout
Maximum Space Utilization:
Traditional Solution: Heat pipes can only be arranged linearly, utilization ~60%
HP003 Innovation: Z-shaped layout increases space utilization to 85%
Performance Improvement: Heat pipe effective length increases by 40% in same space
High-Density Cooling Array: 0.12mm ultra-thin aluminum sheets in zipper arrangement achieve maximum cooling area per unit volume
Aerodynamic Innovation:
Integrated Air Guide: Ensures all airflow passes through cooling fins, reducing bypass
Air Pressure Optimization: Fin angle micro-adjustments adapt to 1U space pressure characteristics
Turbulence Enhancement: Fin surface microstructures promote turbulence, improving heat transfer coefficient by 18%
Adaptive Installation Technology: 4-point independent spring pressure system ensures optimal contact under various installation conditions
Data Center Grade Protection: 6-10μm electroplated nickel layer + chromate passivation treatment
Optimizes 1U server internal airflow paths through professional CFD analysis
Establish precise thermal resistance network model predicting temperature distribution at each node
Comprehensive reliability testing ensures product meets data center requirements
Computing Density Revolution: Achieves cooling performance approaching 2U servers within 1U space
Virtualization Performance Breakthrough:
VM Density: Single server supports 15-20% more virtual machines
Application Performance: Database and virtualization application performance improved by 10-15%
Response Time: Application response time reduced by 8-12%
Standardization Compatibility: Fully compatible with standard 1U server architecture, no redesign needed
Fast Time-to-Market Advantages:
Development Cycle: Shortens development time by 3-4 months compared to in-house solutions
Certification Support: Provides complete test data and certification support
Risk Reduction: Validated design solution reduces technical risks
Total Cost of Ownership (TCO) Optimization: Full lifecycle cost optimization from procurement to operation
Market Differentiation Advantages:
Product Positioning: High-performance 1U servers, filling market gaps
Technical Highlights: 2U-level cooling performance within 1U space
Customer Value: Provides optimal solution for high-density deployment
Rack Density Revolution: Achieves higher server density within standard 42U racks
Economic Benefit Calculation:
Additional Revenue: $2,500-$3,500 annual revenue per additional server
Space Savings: $1,200-$1,800 annual savings per saved rack position
Overall Benefit: $5,000-$7,000 increased annual revenue per rack
PUE Improvement Contribution: Reduces cooling energy consumption through efficient cooling system
Carbon Emission Reduction:
Annual Electricity Savings per Rack: Approximately 1,200-1,800kWh
CO₂ Reduction: Approximately 800-1,200kg CO₂ reduction per rack annually
Sustainable Development: Supports green data center construction goals
System Availability Enhancement: Reduces cooling-related failure risks
Maintenance Cost Optimization:
Preventive Maintenance: 50% reduction in regular maintenance requirements
Failure Handling: Reduced on-site service frequency and costs
Spare Parts Inventory: Standardized design reduces spare parts variety
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
