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HP006
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Dual-Path Balanced Cooling Architecture: Employs a centrally symmetrical heat pipe layout, with four Ø5mm heat pipes distributed mirror-image style, providing completely symmetrical 80W per path cooling capacity for two CFP DCO modules, ensuring temperature uniformity ΔT < 3°C.
Economies of Scale Manufacturing Optimization: Symmetrical design enables mold and fixture reuse, reducing manufacturing costs by 35% compared to independent cooling solutions, while increasing production efficiency by 40%.
Modular Scalability: Design supports side-by-side installation of multiple units, achieving linear scaling of cooling capacity through shared heat pipes, supporting high-density configurations like 4-module, 6-module setups.
High Thermal Conductivity Pure Copper Baseplate: Uses C1100 high-purity electrolytic copper plate (thermal conductivity 398 W/m·K), thickness 3mm, surface flatness < 0.03mm, ensuring perfect thermal contact with optical module housings.
Dual Contact Surface Precision Machining: Both module contact surfaces use CNC precision machining, parallelism < 0.05mm, surface roughness Ra < 0.8μm, enabling direct installation without additional processing.
Structural Strength Optimization: Internal reinforcement rib structure in the copper baseplate limits deformation to < 0.1mm under 50g vibration conditions, meeting telecom equipment anti-vibration requirements.
Short-Distance Efficient Heat Transfer: Heat pipe length optimized to 45mm effective heat transfer section, thermal resistance < 0.08°C/W, improving heat transfer efficiency by 25% over traditional solutions.
Anti-Gravity Orientation Design: Heat pipe internal composite sintered wick structure supports any installation orientation, performance variation < 5% in vertical, horizontal, or tilted states.
Redundant Heat Transfer Paths: Each module is served by 2 independent heat pipes + 1 shared heat pipe, maintaining > 70% cooling capacity even if a single heat pipe fails.
Telecom-Grade Environmental Protection: Chromate passivation treatment forms a 1-2μm dense oxide layer on the copper surface, passing 96-hour salt spray tests, meeting GR-487/GR-63 standards.
Long-Term Thermal Stability: Passivation layer offers stable thermal resistance, performance degradation < 2% under temperature cycling from -40°C to +85°C, ensuring service life over 10 years.
Installation Compatibility: Treated surface maintains good solderability, supporting customer needs to solder ground wires or mounting brackets at specific locations.
Scenario Characteristics: Next-gen optical transmission equipment uses CFP DCO modules for 400G/800G high-speed transmission, single module power 60-80W, equipment needs to support multi-module high-density deployment.
HP006 Value: Symmetrical dual-path design meets cooling needs of adjacent modules; compact size adapts to internal chassis space constraints; economies of scale cost advantage supports equipment manufacturers in enhancing price competitiveness.
Scenario Characteristics: Data center spine/leaf switches use CFP DCO modules for high-speed inter-rack interconnection, modules are densely deployed, cooling solutions must ensure long-term reliability.
HP006 Value: Passivation treatment adapts to data center temperature/humidity environment; heat pipe redundancy design improves system reliability; modular scalability supports 8-16 module high-density configurations.
Scenario Characteristics: Telecom-grade core routers require 7x24 continuous operation, cooling solutions must meet NEBS Level 3 requirements, support ambient temperature range -5°C to +55°C.
HP006 Value: Passes GR-63 vibration tests; supports wide temperature operating range; long-life design meets equipment lifespan requirements over 10 years.
Shorten R&D Cycle: Provides complete thermal design package (including 3D models, thermal simulation data, installation guide), reducing customer thermal design time by over 50%.
Reduce Design Risk: Field-validated cooling solution in telecom equipment, deployed in multiple operator networks, cumulative runtime exceeds 3 million hours.
Technical Support System: Experienced telecom industry FAE team provides full-process support from concept design to mass production.
Improve Production Efficiency: Symmetrical design simplifies installation process, assembly line time reduces by 30%; standardized packaging supports automated feeding.
Optimize Procurement Cost: Compared to purchasing two independent heatsinks, material cost reduces by 25-30%; economies of scale purchasing enjoys further price advantages.
Quality Assurance System: ISO9001:2015 certified, implements comprehensive SPC statistical process control, supports customer incoming inspection exemption.
Product Differentiation: Supports customer promotion of "efficient dual-path cooling", "cost-optimized design" and other product advantages.
Reduce Total Cost of Ownership: Through cooling solution optimization, customer equipment cooling system cost reduces by 20%, enhancing product price competitiveness.
Support Global Certification: Provides complete RoHS, REACH, NEBS test reports, supporting customer product global market access.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
Dual-Path Balanced Cooling Architecture: Employs a centrally symmetrical heat pipe layout, with four Ø5mm heat pipes distributed mirror-image style, providing completely symmetrical 80W per path cooling capacity for two CFP DCO modules, ensuring temperature uniformity ΔT < 3°C.
Economies of Scale Manufacturing Optimization: Symmetrical design enables mold and fixture reuse, reducing manufacturing costs by 35% compared to independent cooling solutions, while increasing production efficiency by 40%.
Modular Scalability: Design supports side-by-side installation of multiple units, achieving linear scaling of cooling capacity through shared heat pipes, supporting high-density configurations like 4-module, 6-module setups.
High Thermal Conductivity Pure Copper Baseplate: Uses C1100 high-purity electrolytic copper plate (thermal conductivity 398 W/m·K), thickness 3mm, surface flatness < 0.03mm, ensuring perfect thermal contact with optical module housings.
Dual Contact Surface Precision Machining: Both module contact surfaces use CNC precision machining, parallelism < 0.05mm, surface roughness Ra < 0.8μm, enabling direct installation without additional processing.
Structural Strength Optimization: Internal reinforcement rib structure in the copper baseplate limits deformation to < 0.1mm under 50g vibration conditions, meeting telecom equipment anti-vibration requirements.
Short-Distance Efficient Heat Transfer: Heat pipe length optimized to 45mm effective heat transfer section, thermal resistance < 0.08°C/W, improving heat transfer efficiency by 25% over traditional solutions.
Anti-Gravity Orientation Design: Heat pipe internal composite sintered wick structure supports any installation orientation, performance variation < 5% in vertical, horizontal, or tilted states.
Redundant Heat Transfer Paths: Each module is served by 2 independent heat pipes + 1 shared heat pipe, maintaining > 70% cooling capacity even if a single heat pipe fails.
Telecom-Grade Environmental Protection: Chromate passivation treatment forms a 1-2μm dense oxide layer on the copper surface, passing 96-hour salt spray tests, meeting GR-487/GR-63 standards.
Long-Term Thermal Stability: Passivation layer offers stable thermal resistance, performance degradation < 2% under temperature cycling from -40°C to +85°C, ensuring service life over 10 years.
Installation Compatibility: Treated surface maintains good solderability, supporting customer needs to solder ground wires or mounting brackets at specific locations.
Scenario Characteristics: Next-gen optical transmission equipment uses CFP DCO modules for 400G/800G high-speed transmission, single module power 60-80W, equipment needs to support multi-module high-density deployment.
HP006 Value: Symmetrical dual-path design meets cooling needs of adjacent modules; compact size adapts to internal chassis space constraints; economies of scale cost advantage supports equipment manufacturers in enhancing price competitiveness.
Scenario Characteristics: Data center spine/leaf switches use CFP DCO modules for high-speed inter-rack interconnection, modules are densely deployed, cooling solutions must ensure long-term reliability.
HP006 Value: Passivation treatment adapts to data center temperature/humidity environment; heat pipe redundancy design improves system reliability; modular scalability supports 8-16 module high-density configurations.
Scenario Characteristics: Telecom-grade core routers require 7x24 continuous operation, cooling solutions must meet NEBS Level 3 requirements, support ambient temperature range -5°C to +55°C.
HP006 Value: Passes GR-63 vibration tests; supports wide temperature operating range; long-life design meets equipment lifespan requirements over 10 years.
Shorten R&D Cycle: Provides complete thermal design package (including 3D models, thermal simulation data, installation guide), reducing customer thermal design time by over 50%.
Reduce Design Risk: Field-validated cooling solution in telecom equipment, deployed in multiple operator networks, cumulative runtime exceeds 3 million hours.
Technical Support System: Experienced telecom industry FAE team provides full-process support from concept design to mass production.
Improve Production Efficiency: Symmetrical design simplifies installation process, assembly line time reduces by 30%; standardized packaging supports automated feeding.
Optimize Procurement Cost: Compared to purchasing two independent heatsinks, material cost reduces by 25-30%; economies of scale purchasing enjoys further price advantages.
Quality Assurance System: ISO9001:2015 certified, implements comprehensive SPC statistical process control, supports customer incoming inspection exemption.
Product Differentiation: Supports customer promotion of "efficient dual-path cooling", "cost-optimized design" and other product advantages.
Reduce Total Cost of Ownership: Through cooling solution optimization, customer equipment cooling system cost reduces by 20%, enhancing product price competitiveness.
Support Global Certification: Provides complete RoHS, REACH, NEBS test reports, supporting customer product global market access.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
