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HP005 Heat Pipe Heatsink Serverfor Intel LGA7529 High-Performance 2U Cooling Solution

Product Name: Heat Pipe Heatsink HP005
Feature: Zipper Fin, Heat Pipe, Copper Sheet
Size:126.8x97.8x64mm
Surface Treatment: Nickel Plating, Passivation
Application:Intel Birch Stream 2U, Server
  • HP005

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HP005 heat pipe heatsink intel LGA7529 2U server cooling

Core Technology: Innovative Design Achieves Performance Breakthrough

1. Heat Pipe Technology Innovation

The Three-Dimensional Heat Pipe Layout Design breaks through the spatial limitations of traditional 2U heatsinks. Our heat pipe system employs a unique Z-shaped arrangement, maximizing heat conduction efficiency within a 64mm height.

2. Louvered Fin Aerodynamic Optimization

Featuring 0.15mm ultra-thin aluminum sheets arranged in a louvered pattern, it creates maximum heat dissipation area within a limited space. The fin technology advantages include an effective heat dissipation area exceeding 3200 cm², an optimal fin pitch of 1.8mm balancing heat dissipation and air resistance, airflow guidance perfectly matching standard server airflow paths, and nickel plating treatment enhancing thermal radiation efficiency.

3. Intelligent Pressure Control System

The patented Adaptive Pressure Balancing System ensures optimal performance under various installation conditions.

4. Dual Surface Treatment Process

The 8-12μm Electroless Nickel Plating combined with Chromate Passivation Treatment provides data center-grade protection.

Application Scenarios & Customer Value

1. High-Performance Server Design

For scenarios where 2U dual-socket servers need to support high-TDP CPUs and traditional cooling solutions are insufficient, the HP005 provides 400W stable cooling capacity to support full-core CPU turbo boost, is compatible with standard 2U server architecture requiring no redesign, and features optimized airflow design to reduce system air resistance.

2. High-Density Data Center Deployment

For the scenario of increasing power density in data center racks requiring efficient thermal solutions, the HP005, through its optimized 64mm height, supports higher-density server deployment, reduces fan power consumption to improve overall energy efficiency, and adapts to operating environments up to 35°C without requiring special cooling.

3. Enterprise Mission-Critical Systems

For industries like finance and telecommunications requiring 7×24 stable operation, the HP005 provides long-term corrosion protection through dual surface treatment, has a design life matching the server's 5-year refresh cycle, and boasts an MTBF >100,000 hours.

FAQs

Q:Do you have your own brand?

A:Yes. Our brand name is GREATMINDS.

Q:Are you a manufacture or trading company?

A:We design and produce thermal products by ourselves.

Q:Where is your plant?

A:We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China.

Q:What thermal products do you supply?

A:We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on.

Q:Which types of heatsinks do you supply?

A:Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on.

Q:What is the leadtime for prototype?

A:It depends on different type of products. Usually it takes 2-3 weeks.

Q:Do you have a NPI process in your company?

A:Yes. Tooling samples and trial run will be strictly implemented before mass production.

Q:What capabilities do you have in your plant?

A:We have stamping, machining, and soldering production in house.


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 Suzhou Greatminds Thermal Control Technology Co.,Ltd.Building 7, Zhongchuanglian Technology Industry Park, No.35 Dongfu Road, SIP, Suzhou
 Dongguan Greatminds Electronic Technology Co.,Ltd. #101,Builidng 14, #142 West Jinghai Road, Chang'an, Dongguan
 info@greatminds.com.cn

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