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HP001
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The HP001 is a high-performance heat pipe heatsink specifically designed for Intel Whitley platform 2U servers. Utilizing zipper fin, heat pipe, and copper baseplate composite technology, it achieves 270W stable cooling capacity within standard 2U chassis space. As a professional server thermal solution provider, we help server manufacturers fully unleash the performance potential of Intel Whitley platform processors within 2U space.
Intel Whitley Platform Dedicated: Optimized for Intel Whitley platform 2U servers
270W Cooling Capacity: Stable heat dissipation within standard 2U space
Composite Cooling Technology: Zipper fins + heat pipes + copper baseplate, industry-leading efficiency
Compact Dimensions: 113×78×64mm, perfect fit for 2U chassis
Nickel Plating Surface Treatment: Oxidation and corrosion resistant, adapting to data center environments
OEM Customization Services: Complete solutions for server manufacturers
Zipper Fin Process: Precision zipper-style interlocking arrangement technology maximizes cooling area within the 64mm height. 0.15mm ultra-thin aluminum sheets arranged alternately create unique airflow turbulence channels, increasing heat transfer coefficient by over 25%. The zipper structure also enhances the structural strength of the fin array, providing excellent vibration resistance.
Heat Pipe Efficient Conduction: Four high-performance heat pipes are optimized for the thermal distribution of Intel Whitley platform processors. The heat pipes feature U-shaped bend designs, extending from the CPU center area to both sides of the fin array, achieving rapid and uniform heat transfer and ensuring quick heat extraction from CPU hotspot areas.
Copper Baseplate Precision Machining: High-purity copper baseplate with thermal conductivity of 398W/m·K. Baseplate surface flatness <0.05mm ensures perfect contact with the CPU IHS. Precision milling minimizes contact thermal resistance, maximizing the cooling efficiency of the heat pipes and fins.
Nickel Plating Surface Treatment: 8-12μm electroplated nickel layer passes salt spray testing, meeting data center environmental requirements. The nickel-plated surface resists oxidation and corrosion, maintaining good cooling performance over long-term use and extending product service life.
Scenario Requirements: 2U servers need to support 270W Intel Whitley platform processors within limited space, ensure 7×24 continuous operation reliability, and meet high-density deployment needs.
HP001 Solutions: 64mm height perfectly fits 2U chassis, zipper fin + heat pipe composite technology provides 270W cooling capacity, nickel plating adapts to long-term operating environments.
Customer Value: Supports high-performance computing and virtualization applications, ensures stable full-core turbo boost operation; reduces performance degradation risks caused by overheating; long-life design reduces maintenance frequency.
Scenario Requirements: Virtualization hosts require 7×24 continuous operation with extremely high demands for cooling system reliability, supporting full-load operation of high-core-count processors.
HP001 Solutions: Heat pipe + zipper fin composite technology with industry-leading efficiency, nickel plating ensures stable long-term performance, compact dimensions fit standard 2U chassis.
Customer Value: Increased VM density, single server supporting more applications; system availability up to 99.99%, ensuring business continuity; reduced total cost of ownership.
Scenario Requirements: HPC nodes require CPUs to run at full speed for extended periods; cooling systems must withstand continuous high loads to ensure stable completion of computing tasks.
HP001 Solutions: 270W continuous cooling capacity meets HPC load requirements, heat pipes respond rapidly to load changes, nickel plating ensures long-term reliability.
Customer Value: Shortened computing task completion time; improved node-to-node performance consistency; adaptation to long-term high-load operation.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
The HP001 is a high-performance heat pipe heatsink specifically designed for Intel Whitley platform 2U servers. Utilizing zipper fin, heat pipe, and copper baseplate composite technology, it achieves 270W stable cooling capacity within standard 2U chassis space. As a professional server thermal solution provider, we help server manufacturers fully unleash the performance potential of Intel Whitley platform processors within 2U space.
Intel Whitley Platform Dedicated: Optimized for Intel Whitley platform 2U servers
270W Cooling Capacity: Stable heat dissipation within standard 2U space
Composite Cooling Technology: Zipper fins + heat pipes + copper baseplate, industry-leading efficiency
Compact Dimensions: 113×78×64mm, perfect fit for 2U chassis
Nickel Plating Surface Treatment: Oxidation and corrosion resistant, adapting to data center environments
OEM Customization Services: Complete solutions for server manufacturers
Zipper Fin Process: Precision zipper-style interlocking arrangement technology maximizes cooling area within the 64mm height. 0.15mm ultra-thin aluminum sheets arranged alternately create unique airflow turbulence channels, increasing heat transfer coefficient by over 25%. The zipper structure also enhances the structural strength of the fin array, providing excellent vibration resistance.
Heat Pipe Efficient Conduction: Four high-performance heat pipes are optimized for the thermal distribution of Intel Whitley platform processors. The heat pipes feature U-shaped bend designs, extending from the CPU center area to both sides of the fin array, achieving rapid and uniform heat transfer and ensuring quick heat extraction from CPU hotspot areas.
Copper Baseplate Precision Machining: High-purity copper baseplate with thermal conductivity of 398W/m·K. Baseplate surface flatness <0.05mm ensures perfect contact with the CPU IHS. Precision milling minimizes contact thermal resistance, maximizing the cooling efficiency of the heat pipes and fins.
Nickel Plating Surface Treatment: 8-12μm electroplated nickel layer passes salt spray testing, meeting data center environmental requirements. The nickel-plated surface resists oxidation and corrosion, maintaining good cooling performance over long-term use and extending product service life.
Scenario Requirements: 2U servers need to support 270W Intel Whitley platform processors within limited space, ensure 7×24 continuous operation reliability, and meet high-density deployment needs.
HP001 Solutions: 64mm height perfectly fits 2U chassis, zipper fin + heat pipe composite technology provides 270W cooling capacity, nickel plating adapts to long-term operating environments.
Customer Value: Supports high-performance computing and virtualization applications, ensures stable full-core turbo boost operation; reduces performance degradation risks caused by overheating; long-life design reduces maintenance frequency.
Scenario Requirements: Virtualization hosts require 7×24 continuous operation with extremely high demands for cooling system reliability, supporting full-load operation of high-core-count processors.
HP001 Solutions: Heat pipe + zipper fin composite technology with industry-leading efficiency, nickel plating ensures stable long-term performance, compact dimensions fit standard 2U chassis.
Customer Value: Increased VM density, single server supporting more applications; system availability up to 99.99%, ensuring business continuity; reduced total cost of ownership.
Scenario Requirements: HPC nodes require CPUs to run at full speed for extended periods; cooling systems must withstand continuous high loads to ensure stable completion of computing tasks.
HP001 Solutions: 270W continuous cooling capacity meets HPC load requirements, heat pipes respond rapidly to load changes, nickel plating ensures long-term reliability.
Customer Value: Shortened computing task completion time; improved node-to-node performance consistency; adaptation to long-term high-load operation.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
