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HP009
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High-performance heat pipes are optimized for the thermal characteristics of the i9-14900K processor. Heat pipes rapidly absorb CPU heat and transfer it to the large-area cooling fins, ensuring quick heat extraction from hotspot areas and maintaining sustained full-load operation.
Extruded Base: High-thermal-conductivity extruded base rapidly absorbs CPU heat
Skived Fins: High-density fins precision-skived from the base, eliminating interface thermal resistance
Composite Structure: Optimal combination of both technologies achieves极致 cooling performance within limited space
Fully Dustproof: Reliable operation in dusty environments
Waterproof: Suitable for humid conditions
High Temperature & Humidity Resistance: Optimized for harsh operating conditions
Long-Life Design: High-quality bearings, MTBF > 70,000 hours
Intelligent Speed Control: PWM control balances performance and noise
Nickel Plating: Electroplated nickel layer provides oxidation and corrosion resistance
Passivation Treatment: Forms a dense protective layer for enhanced weather resistance
Industrial Environment Adaptability: Suitable for high temperature, high humidity, salt spray, and other harsh conditions
Industrial computers deployed in factory workshops, outdoor cabinets, and other environments face challenges including high temperature, high humidity, and dust. Traditional cooling solutions struggle to ensure long-term reliability.
IP68 high-protection fan, fully dustproof and waterproof
Nickel plating + passivation surface treatment, corrosion and weather resistant
275W cooling capacity meets full-load requirements of i9-14900K
Stable operation of industrial computers in harsh environments
Reduced on-site maintenance frequency, lower operational costs
Ensures continuous reliability of mission-critical systems
Edge computing nodes are distributed across various locations with difficult maintenance access, requiring highly reliable cooling solutions.
IP68 protection suitable for outdoor and semi-outdoor environments
Compact dimensions fit the limited space of edge nodes
Efficient cooling supports high-performance computing requirements
Reduced edge node maintenance costs
Adaptable to diverse deployment environments
Ensures stable execution of edge computing tasks
High-performance embedded systems have compact space with limited cooling capacity, requiring efficient and reliable cooling solutions.
90×96.5×118.3mm compact dimensions
Composite process maximizes cooling area
Multiple protection measures suit various installation environments
Simplified embedded system cooling design
Increased system integration flexibility
Ensures long-term operational reliability
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
