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HP002
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The HP002 is a high-performance heat pipe heatsink specifically designed for Intel Eagle Stream platform 2U servers. Utilizing zipper fin, heat pipe, and copper baseplate composite technology, it achieves exceptional cooling capacity within standard 2U chassis space. Heat pipe technology is based on the phase change of water and capillary action principle,突破 the thermal conductivity limits of solid materials, significantly enhancing air-cooled heatsink performance. As a professional server thermal solution provider, we help server manufacturers fully unleash the performance potential of Intel EGS platform processors within 2U space.
Intel EGS Platform Dedicated: Optimized for Intel Eagle Stream platform 2U servers.
Heat Pipe Phase Change Technology: Utilizing water phase change and capillary action, thermal efficiency far exceeds solid materials.
Composite Cooling Technology: Zipper fins + heat pipes + copper baseplate, industry-leading efficiency.
Compact Dimensions: 118×78×64mm, perfect fit for 2U chassis.
High-Purity Material: C1020 oxygen-free copper, excellent thermal conductivity.
Precision Soldering Process: Ensures perfect bonding between heat pipes and fins.
Dual Surface Treatment: Nickel plating + passivation, oxidation and corrosion resistant for harsh environments.
OEM Customization Services: Complete solutions for server manufacturers.
Heat Pipe Efficient Conduction: Four high-performance heat pipes are optimized for the thermal distribution of Intel EGS platform processors. The heat pipes feature U-shaped bend designs, extending from the CPU center area to both sides of the fin array, utilizing the principles of water phase change and capillary action to achieve rapid and uniform heat transfer, ensuring quick heat extraction from CPU hotspot areas.
Zipper Fin Process: Precision zipper-style interlocking arrangement technology maximizes cooling area within the 64mm height. 0.15mm ultra-thin aluminum sheets arranged alternately create unique airflow turbulence channels, increasing heat transfer coefficient by over 25%. The zipper structure also enhances the structural strength of the fin array, providing excellent vibration resistance.
C1020 Copper Baseplate Precision Machining: High-purity oxygen-free copper baseplate with thermal conductivity of 398W/m·K. Baseplate surface flatness <0.05mm ensures perfect contact with the CPU IHS. Precision milling minimizes contact thermal resistance, maximizing the cooling efficiency of the heat pipes and fins.
Dual Surface Treatment: Nickel plating + passivation dual treatment process, with 8-12μm electroplated nickel layer combined with passivation treatment, passes salt spray testing, meeting the stringent environmental requirements of data centers and telecom equipment. The surface treatment layer resists oxidation and corrosion, maintaining good cooling performance over long-term use and extending product service life.
Technology Integration Advantages: Heat pipe technology perfectly integrates with zipper fins and C1020 copper baseplate. Precision soldering ensures tight bonding between components, while dual surface treatment guarantees long-term reliability, achieving exceptional cooling performance within 2U space and meeting the stringent thermal requirements of Intel EGS platform high-performance processors.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
The HP002 is a high-performance heat pipe heatsink specifically designed for Intel Eagle Stream platform 2U servers. Utilizing zipper fin, heat pipe, and copper baseplate composite technology, it achieves exceptional cooling capacity within standard 2U chassis space. Heat pipe technology is based on the phase change of water and capillary action principle,突破 the thermal conductivity limits of solid materials, significantly enhancing air-cooled heatsink performance. As a professional server thermal solution provider, we help server manufacturers fully unleash the performance potential of Intel EGS platform processors within 2U space.
Intel EGS Platform Dedicated: Optimized for Intel Eagle Stream platform 2U servers.
Heat Pipe Phase Change Technology: Utilizing water phase change and capillary action, thermal efficiency far exceeds solid materials.
Composite Cooling Technology: Zipper fins + heat pipes + copper baseplate, industry-leading efficiency.
Compact Dimensions: 118×78×64mm, perfect fit for 2U chassis.
High-Purity Material: C1020 oxygen-free copper, excellent thermal conductivity.
Precision Soldering Process: Ensures perfect bonding between heat pipes and fins.
Dual Surface Treatment: Nickel plating + passivation, oxidation and corrosion resistant for harsh environments.
OEM Customization Services: Complete solutions for server manufacturers.
Heat Pipe Efficient Conduction: Four high-performance heat pipes are optimized for the thermal distribution of Intel EGS platform processors. The heat pipes feature U-shaped bend designs, extending from the CPU center area to both sides of the fin array, utilizing the principles of water phase change and capillary action to achieve rapid and uniform heat transfer, ensuring quick heat extraction from CPU hotspot areas.
Zipper Fin Process: Precision zipper-style interlocking arrangement technology maximizes cooling area within the 64mm height. 0.15mm ultra-thin aluminum sheets arranged alternately create unique airflow turbulence channels, increasing heat transfer coefficient by over 25%. The zipper structure also enhances the structural strength of the fin array, providing excellent vibration resistance.
C1020 Copper Baseplate Precision Machining: High-purity oxygen-free copper baseplate with thermal conductivity of 398W/m·K. Baseplate surface flatness <0.05mm ensures perfect contact with the CPU IHS. Precision milling minimizes contact thermal resistance, maximizing the cooling efficiency of the heat pipes and fins.
Dual Surface Treatment: Nickel plating + passivation dual treatment process, with 8-12μm electroplated nickel layer combined with passivation treatment, passes salt spray testing, meeting the stringent environmental requirements of data centers and telecom equipment. The surface treatment layer resists oxidation and corrosion, maintaining good cooling performance over long-term use and extending product service life.
Technology Integration Advantages: Heat pipe technology perfectly integrates with zipper fins and C1020 copper baseplate. Precision soldering ensures tight bonding between components, while dual surface treatment guarantees long-term reliability, achieving exceptional cooling performance within 2U space and meeting the stringent thermal requirements of Intel EGS platform high-performance processors.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
