 |
HP004
| Quantity: | |
|---|---|
The HP004 is a 2U server cooling solution specifically designed for AMD EPYC 9004 series processors, delivering industry-leading 400W heat dissipation within standard chassis space. As an AMD platform cooling specialist, we provide targeted optimization based on the unique thermal characteristics of the SP5 socket, helping server manufacturers unlock the full performance potential of EPYC processors.
Dedicated for AMD Platform: Optimized for EPYC 9004 series, not a general-purpose solution
400W Cooling Capacity: Excellent performance in 2U space, supporting full-core turbo boost
Zipper Fin + Heat Pipe Composite Technology: Industry-leading cooling efficiency
Dual Surface Treatment: Nickel plating + passivation for harsh data center environments
OEM Customization Services: Complete solutions for server manufacturers
EPYC-Dedicated Heat Pipe Layout Technology: The HP004 heat pipe system is specifically optimized for the thermal distribution characteristics of AMD EPYC 9004 series chips. The configuration features 8 Ø6mm high-performance sintered heat pipes, with the layout designed for the EPYC multi-chip module architecture—high-density heat pipes are arranged in core computing chip areas, while peripheral heat pipes ensure temperature uniformity for I/O regions. Startup characteristics achieve full operation from cold state in less than 5 seconds, with total heat transfer capacity exceeding 500W providing ample margin. Compared to general-purpose cooling solutions, HP004 improves thermal conduction efficiency by 25% in EPYC's typical hotspot areas, ensuring consistent temperatures across all cores.
Zipper Fin Aerodynamic Optimization Design: Utilizing 0.15mm ultra-thin aluminum sheets in a zipper arrangement maximizes cooling area within limited space—effective cooling area exceeds 3000cm² with fin thickness of only 0.15mm. The 1.8mm optimized spacing balances heat dissipation and airflow resistance, with airflow guidance perfectly matching server front-to-back airflow paths. Surface microstructures promote turbulence formation, increasing heat transfer coefficient by 18%. Within the 63.7mm height constraint, cooling area is maximized, achieving 35% higher volumetric cooling efficiency compared to traditional designs.
SP5-Dedicated Intelligent Pressure System: A dedicated retention mechanism developed for the unique installation requirements of the AMD SP5 socket. The 4-point independent spring design ensures pressure distribution uniformity greater than 85%, with installation torque of 35-40 lb·in optimized for SP5. The system automatically adapts to CPU package thickness variations of ±0.15mm. After 100 installation cycle tests, performance retention exceeds 95%, with pressure indication design facilitating production line quality control. Optimal contact between heatsink and EPYC processor IHS is ensured, with contact thermal resistance less than 0.03°C/W, preventing performance loss due to installation deviations.
Dual Surface Treatment Process: An 8-12μm electroplated nickel layer combined with chromate passivation treatment provides data center-grade protection. Salt spray testing of 96 hours achieves Class 10 protection level, with thermal cycling performance degradation less than 3% annually. Surface roughness Ra <0.8μm ensures optimized thermal contact. The hydrophobic surface facilitates easy cleaning and maintenance, while the matte metallic finish enhances product appearance. In data center 7×24 operating environments, service life exceeds 5 years with reduced maintenance frequency.
High-Performance Computing Clusters: HPC nodes require CPUs to run at full speed for extended periods; cooling systems must withstand continuous high loads. HP004 provides 400W continuous cooling capacity, supporting EPYC processors at full-core turbo boost. Fast thermal response adapts to rapid computing load changes, while excellent temperature uniformity ensures consistent performance across all cores. Customer value is reflected in 15-20% overall cluster performance improvement, shortened computation task completion times, and enhanced node-to-node performance consistency.
Enterprise Virtualization Platforms: Virtualized environments require stable CPU performance, as temperature fluctuations affect VM performance and reliability. HP004 achieves temperature fluctuation < ±3°C, delivering stable and predictable performance. It supports high-core-count EPYC processors under full load, with reliability design ensuring 7×24 stable operation. Customer value includes 20% increase in VM density, improved SLA achievement rates, and enhanced business continuity assurance.
Data Center Density Optimization: Limited data center rack space requires maximizing computing capacity per rack. With its 63.7mm height, HP004 perfectly fits standard 2U chassis, supporting 20+ servers per 42U rack. High cooling efficiency reduces thermal interference. Customer value is reflected in 12-15% increase in computing density, $4,000-$5,000 additional annual revenue per rack, and 0.005-0.01 PUE improvement.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
The HP004 is a 2U server cooling solution specifically designed for AMD EPYC 9004 series processors, delivering industry-leading 400W heat dissipation within standard chassis space. As an AMD platform cooling specialist, we provide targeted optimization based on the unique thermal characteristics of the SP5 socket, helping server manufacturers unlock the full performance potential of EPYC processors.
Dedicated for AMD Platform: Optimized for EPYC 9004 series, not a general-purpose solution
400W Cooling Capacity: Excellent performance in 2U space, supporting full-core turbo boost
Zipper Fin + Heat Pipe Composite Technology: Industry-leading cooling efficiency
Dual Surface Treatment: Nickel plating + passivation for harsh data center environments
OEM Customization Services: Complete solutions for server manufacturers
EPYC-Dedicated Heat Pipe Layout Technology: The HP004 heat pipe system is specifically optimized for the thermal distribution characteristics of AMD EPYC 9004 series chips. The configuration features 8 Ø6mm high-performance sintered heat pipes, with the layout designed for the EPYC multi-chip module architecture—high-density heat pipes are arranged in core computing chip areas, while peripheral heat pipes ensure temperature uniformity for I/O regions. Startup characteristics achieve full operation from cold state in less than 5 seconds, with total heat transfer capacity exceeding 500W providing ample margin. Compared to general-purpose cooling solutions, HP004 improves thermal conduction efficiency by 25% in EPYC's typical hotspot areas, ensuring consistent temperatures across all cores.
Zipper Fin Aerodynamic Optimization Design: Utilizing 0.15mm ultra-thin aluminum sheets in a zipper arrangement maximizes cooling area within limited space—effective cooling area exceeds 3000cm² with fin thickness of only 0.15mm. The 1.8mm optimized spacing balances heat dissipation and airflow resistance, with airflow guidance perfectly matching server front-to-back airflow paths. Surface microstructures promote turbulence formation, increasing heat transfer coefficient by 18%. Within the 63.7mm height constraint, cooling area is maximized, achieving 35% higher volumetric cooling efficiency compared to traditional designs.
SP5-Dedicated Intelligent Pressure System: A dedicated retention mechanism developed for the unique installation requirements of the AMD SP5 socket. The 4-point independent spring design ensures pressure distribution uniformity greater than 85%, with installation torque of 35-40 lb·in optimized for SP5. The system automatically adapts to CPU package thickness variations of ±0.15mm. After 100 installation cycle tests, performance retention exceeds 95%, with pressure indication design facilitating production line quality control. Optimal contact between heatsink and EPYC processor IHS is ensured, with contact thermal resistance less than 0.03°C/W, preventing performance loss due to installation deviations.
Dual Surface Treatment Process: An 8-12μm electroplated nickel layer combined with chromate passivation treatment provides data center-grade protection. Salt spray testing of 96 hours achieves Class 10 protection level, with thermal cycling performance degradation less than 3% annually. Surface roughness Ra <0.8μm ensures optimized thermal contact. The hydrophobic surface facilitates easy cleaning and maintenance, while the matte metallic finish enhances product appearance. In data center 7×24 operating environments, service life exceeds 5 years with reduced maintenance frequency.
High-Performance Computing Clusters: HPC nodes require CPUs to run at full speed for extended periods; cooling systems must withstand continuous high loads. HP004 provides 400W continuous cooling capacity, supporting EPYC processors at full-core turbo boost. Fast thermal response adapts to rapid computing load changes, while excellent temperature uniformity ensures consistent performance across all cores. Customer value is reflected in 15-20% overall cluster performance improvement, shortened computation task completion times, and enhanced node-to-node performance consistency.
Enterprise Virtualization Platforms: Virtualized environments require stable CPU performance, as temperature fluctuations affect VM performance and reliability. HP004 achieves temperature fluctuation < ±3°C, delivering stable and predictable performance. It supports high-core-count EPYC processors under full load, with reliability design ensuring 7×24 stable operation. Customer value includes 20% increase in VM density, improved SLA achievement rates, and enhanced business continuity assurance.
Data Center Density Optimization: Limited data center rack space requires maximizing computing capacity per rack. With its 63.7mm height, HP004 perfectly fits standard 2U chassis, supporting 20+ servers per 42U rack. High cooling efficiency reduces thermal interference. Customer value is reflected in 12-15% increase in computing density, $4,000-$5,000 additional annual revenue per rack, and 0.005-0.01 PUE improvement.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
