Views: 30 Author: Site Editor Publish Time: 2025-12-12 Origin: Site
A globally leading Tier-1 communications equipment client encountered critical thermal management challenges during the development of their next-generation coherent optical modules. The module contains two heat sources, each operating at 13W with a compact size of 27×13mm, while the system's permissible air cooling capacity is limited to only 10CFM. The client required the overall thermal resistance to be strictly maintained within 0.6°C/W and sought comprehensive thermal technology support spanning thermal design, prototype development, testing, and mass production.
Design an efficient thermal structure for dual heat sources within stringent spatial and airflow constraints.
Ensure the module’s overall thermal resistance remains ≤0.6°C/W through systematic thermal design.
Provide a manufacturable, testable, and cost-effective thermal solution.
Architecture Design
In response to the client's spatial limitations, we innovatively proposed a mirror-symmetric dual-heatsink layout, integrated via a unified bracket structure to maximize heat exchange efficiency under restricted airflow conditions.
Dual-Technology Parallel Development
Vapor Chamber Solution: Utilized high-performance vapor chambers as the core conductive component, paired with copper fins to achieve efficient heat spreading and vertical thermal transfer.
Heat Pipe Solution: Simultaneously developed an alternative architecture centered on heat pipes, combined with aluminum fins for lightweight and cost-optimized design.
Simulation Validation and Optimization
Employed Computational Fluid Dynamics (CFD) and thermal simulation tools to conduct multiple rounds of comparative analysis on thermal resistance, flow resistance, weight, and cost for various layouts of copper and aluminum fins, driving rapid iterative improvements in the design.
Testing and Iterative Optimization
Completed engineering prototypes for both solutions and conducted rigorous testing under the client-specified airflow and operational conditions to ensure full compliance with thermal performance and reliability requirements.
Manufacturability Support
Assisted the client in optimizing the Design for Manufacturability (DFM) of the thermal module and facilitated the implementation of supply chain and production processes.
The Vapor Chamber Solution successfully passed all client testing and verification phases and was smoothly transitioned into mass production, delivering stable thermal performance in high-power-density scenarios.
The Heat Pipe Solution fully met performance requirements while significantly reducing overall costs for the client, providing a competitive alternative thermal path in the market.
This project comprehensively showcased our systematic ODM capabilities in the optical communications thermal management domain—encompassing thermal design and simulation, multi-solution development and validation, rapid prototyping, testing support, and mass production delivery. We provided the client with a reliable, efficient, and cost-competitive end-to-end thermal management solution.
