Our thermal engineering service identified a critical 30W limit in client's heatsink design. Through heat pipe upgrade & optimization, we achieved 60W stable performance, mitigating mass production risks. Partner with us for reliable OEM thermal solutions. Read More

Situation：Overcoming the 800W Thermal Barrier in 4U Core Switches
Network equipment manufacturers face a critical challenge when developing next-generation data center core switches: dissipating 800W of thermal power from a single Broadcom Tomahawk 5 chip within a compact 4U form factor. The requirement to achieve ultra-low thermal resistance below 0.045°C/W under 500CFM forced air cooling represented a near-limit performance demand for air cooling technology, necessitating a partnership with an advanced thermal solution provider. Read More

A server manufacturer faced significant thermal challenges while developing its next-generation high-density GPU computing platform. The design required integrating four NVIDIA A-Series high-power chips in a 2×2 array layout within a confined space, with each chip dissipating 500W. The client stipulated that the case temperature (Tcase) of each chip must remain below 80°C, and the temperature differential between the front and rear chip groups must be controlled within 3°C to ensure system stability and computational consistency under sustained high loads. Read More

A globally leading Tier-1 communications equipment client encountered critical thermal management challenges during the development of their next-generation coherent optical modules. The module contains two heat sources, each operating at 13W with a compact size of 27×13mm, while the system's permissible air cooling capacity is limited to only 10CFM. The client required the overall thermal resistance to be strictly maintained within 0.6°C/W and sought comprehensive thermal technology support spanning thermal design, prototype development, testing, and mass production. Read More

In mass production of heatsinks for data centers (servers, cloud providers), test efficiency dictates delivery pace.When our 12-channel test system first launched, testing a single module took 10 minutes – bottlenecking the line and stressing deliveries. But we couldn’t cut corners; reliability for Read More

IntroductionEfficient thermal management is critical in high-power applications such as electric vehicles (EVs), data centers, and advanced electronics. Liquid cooling plates with phase-change capabilities (liquid-to-gas transition) offer superior heat dissipation compared to traditional single-phas Read More

As switch chips evolve, higher-performance nodes like 5nm process technology reduce power consumption per unit of computing power. However, as switch chip bandwidth scales to 51.2Tbps, single-chip power consumption rises to approximately 900W. Similarly, optical modules have seen power increases—fro Read More

Heat Pipe Design and Modeling TechniquesThis article is based on ACT's Heat Pipe Design and Modeling Techniques and focuses on heat pipe modeling techniques and methods for reference.A liquid cooling technology exchange group has been established, which is suitable for R&D personnel, product manager Read More

Here is a restructured English version of the article "Phase-Change Cold Plates & Hybrid Air-Liquid Cooling Technology," incorporating technical details and logical flow improvements:Phase-Change Cold Plate Technology: Revolutionizing High-Density CoolingCore Principle: Fluorinated coolants (e.g., R Read More

Thermal grease, or thermal interface material (TIM), is a critical component in modern electronics cooling systems, ensuring efficient heat transfer between components like CPUs and heat sinks. However, testing its thermal performance is far more complex than it seems. Companies like Thermal Grizzly Read More