Situation
A consumer electronics device manufacturer was developing a desktop laser engraver. They needed an efficient and low-noise thermal management solution for desktop laser equipment within an extremely compact mechanical space (103×56×56mm) for a 20W laser diode. They sought a thermal partner with integrated OEM/ODM cooling module development and manufacturing capabilities.
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The math is brutal: for every 10°C above optimal junction temperature, an IGBT module loses roughly 1% conversion efficiency. In a 100MW solar farm, that's equivalent to shutting down 1MW of generation capacity—permanently.Yet thermal management remains the most overlooked bottleneck in power electr Read More

Our thermal engineering service identified a critical 30W limit in client's heatsink design. Through heat pipe upgrade & optimization, we achieved 60W stable performance, mitigating mass production risks. Partner with us for reliable OEM thermal solutions. Read More

Situation：Overcoming the 800W Thermal Barrier in 4U Core Switches
Network equipment manufacturers face a critical challenge when developing next-generation data center core switches: dissipating 800W of thermal power from a single Broadcom Tomahawk 5 chip within a compact 4U form factor. The requirement to achieve ultra-low thermal resistance below 0.045°C/W under 500CFM forced air cooling represented a near-limit performance demand for air cooling technology, necessitating a partnership with an advanced thermal solution provider. Read More

A server manufacturer faced significant thermal challenges while developing its next-generation high-density GPU computing platform. The design required integrating four NVIDIA A-Series high-power chips in a 2×2 array layout within a confined space, with each chip dissipating 500W. The client stipulated that the case temperature (Tcase) of each chip must remain below 80°C, and the temperature differential between the front and rear chip groups must be controlled within 3°C to ensure system stability and computational consistency under sustained high loads. Read More

A globally leading Tier-1 communications equipment client encountered critical thermal management challenges during the development of their next-generation coherent optical modules. The module contains two heat sources, each operating at 13W with a compact size of 27×13mm, while the system's permissible air cooling capacity is limited to only 10CFM. The client required the overall thermal resistance to be strictly maintained within 0.6°C/W and sought comprehensive thermal technology support spanning thermal design, prototype development, testing, and mass production. Read More

CPU Cooler Thermal Resistance Guide: Understanding the Core Metric of Cooling PerformanceThermal resistance (Thermal Resistance, abbreviated as θ) is the key metric for measuring a CPU cooler's heat dissipation capability. It represents the resistance that heat encounters when traveling from the CPU Read More

You've hit the height limit. Now what?In heatsink selection, the conventional wisdom goes: extruded aluminum is cheap and reliable; bonded fins offer more surface area but introduce vibration sensitivity. That framing works — until your thermal budget tightens and your enclosure won't budge.When hei Read More

In mass production of heatsinks for data centers (servers, cloud providers), test efficiency dictates delivery pace.When our 12-channel test system first launched, testing a single module took 10 minutes – bottlenecking the line and stressing deliveries. But we couldn’t cut corners; reliability for Read More

IntroductionEfficient thermal management is critical in high-power applications such as electric vehicles (EVs), data centers, and advanced electronics. Liquid cooling plates with phase-change capabilities (liquid-to-gas transition) offer superior heat dissipation compared to traditional single-phas Read More