 |
HP005
| Quantity: | |
|---|---|
The HP005 is a high-performance air-cooled heat pipe heatsink purpose-built for Intel's next-generation Birch Stream server platform. Engineered for the LGA7529 socket in standard 2U chassis configurations, the HP005 delivers a maximum cooling capacity of 400W — meeting the escalating thermal demands of Intel's latest Xeon processors designed for AI-accelerated, cloud-native, and high-density data center workloads.
With dimensions of 126.8 × 97.8 × 64 mm, the HP005 features an enlarged copper baseplate precisely matched to the LGA7529 integrated heat spreader (IHS) footprint. The extra base area — wider and longer than previous-generation EGS heatsinks — ensures full IHS contact and minimizes spreading resistance for the 400W-class TDP envelope. The 64 mm height respects the 2U mechanical constraint, leaving adequate clearance for system fan airflow.
The HP005 combines zipper fin technology, multiple embedded copper heat pipes, and a solid copper baseplate into a single nickel-plated and passivated assembly. The integrated heat pipes rapidly transport heat from the CPU IHS to the dense zipper fin array, where system airflow carries it away. The dual-stage surface treatment — nickel plating plus chemical passivation — provides multi-layered corrosion protection, making the HP005 suitable for data center environments with varying humidity, temperature cycling, and 24/7 continuous operation.
Intel Birch Stream represents a significant generational leap over Eagle Stream (EGS), introducing the LGA7529 socket with a substantially larger IHS footprint to accommodate higher core counts, larger cache hierarchies, and integrated accelerators. Key thermal challenges include:
Significantly larger IHS area — The LGA7529 IHS is notably larger than LGA4677 (EGS), requiring an equivalently scaled baseplate to avoid contact gaps and thermal spreading bottlenecks
400W+ TDP envelope — Birch Stream processors push air-cooling limits in the 2U form factor, demanding optimized heat pipe count, routing, and fin density
2U mechanical ceiling — At 64 mm height, every millimeter of fin stack matters; the zipper fin architecture maximizes surface area within this constraint
Extended service life in mixed environments — As Birch Stream deployments span AI training, inference, cloud computing, and edge data centers, corrosion protection must go beyond standard nickel plating
The HP005 addresses all four challenges through a combination of an oversize copper baseplate, dense zipper fin geometry, strategically routed heat pipes, and the nickel-plus-passivation dual treatment.
Certified for 400W continuous heat dissipation — sufficient for the highest-TDP SKUs in the Intel Birch Stream Xeon family. The embedded copper heat pipes transfer heat directly from the baseplate to the fin array with minimal interface thermal resistance.
The 126.8 × 97.8 mm baseplate is engineered to fully cover the enlarged LGA7529 IHS, avoiding partial-contact hot spots that occur when legacy EGS-sized heatsinks are retrofitted.
The interlocking zipper fin design achieves fin density significantly higher than conventional stacked-fin or extruded solutions, converting the limited 2U height budget into maximum convective surface area.
Unlike standard heatsinks that rely on nickel plating alone, the HP005 adds a chemical passivation treatment — a controlled oxidation process that forms a dense chromium-rich passive layer on the nickel surface. This dual treatment resists pitting, crevice corrosion, and galvanic effects in humid or temperature-cycling data center environments.
Fin pitch, fin thickness, and overall flow resistance are tuned for the pressure-flow characteristics of standard 2U chassis system fans (typically 60–80 mm axial fans operating in the 3–8 mm H₂O static pressure range), ensuring efficient heat rejection without excessive bypass.
| Parameter | Details |
|---|---|
| Model | HP005 |
| Type | Heat Pipe Heatsink (Air-Cooled) |
| Core Technology | Zipper Fin + Heat Pipe + Copper Sheet Baseplate |
| Dimensions | 126.8 × 97.8 × 64 mm |
| Baseplate Material | Copper (C1020) |
| Fin Material | Aluminum Alloy |
| Heat Pipe | Embedded Copper Heat Pipes |
| Surface Treatment | Nickel Plating + Chemical Passivation |
| Socket Compatibility | Intel LGA7529 |
| Platform | Intel Birch Stream 2U Server |
| Cooling Capacity | 400 W |
| Form Factor | 2U Rack-Mount, System Fan Assisted |
The HP005 employs a two-stage surface finishing process that distinguishes it from conventional single-layer nickel-plated heatsinks:
| Stage | Process | Function |
|---|---|---|
| Stage 1: Nickel Plating | Electroless or electrolytic nickel deposition over the entire copper baseplate and heat pipe assembly | Provides a uniform corrosion barrier; prevents copper oxidation; ensures compatibility with thermal interface materials (TIM) |
| Stage 2: Chemical Passivation | Controlled chemical oxidation forming a thin chromium-rich passive film on the nickel surface | Seals micro-porosity in the nickel layer; enhances resistance to pitting corrosion from airborne chlorides, sulfides, and humidity; extends service life in non-conditioned data center environments |
This dual treatment is particularly valuable for Birch Stream deployments in edge data centers, telecom colocation facilities, and high-humidity geographic regions — environments where standard nickel plating alone may be insufficient over a 5–7 year server lifecycle.
| Performance Metric | Value |
|---|---|
| Maximum Cooling Capacity | 400 W |
| Socket Compatibility | Intel LGA7529 (Birch Stream) |
| Thermal Resistance (junction-to-air) | Optimized for 2U system fan airflow at 400W TDP |
| Recommended TIM | High-performance thermal grease or phase-change material |
| Flow Configuration | Designed for front-to-rear 2U chassis airflow |
Performance data is based on engineering validation using Birch Stream reference platforms. Actual thermal resistance varies with system fan speed, ambient temperature, TIM application, and chassis airflow design.
Intel Birch Stream platform 2U servers (LGA7529)
AI-accelerated cloud computing nodes
High-density data center rack servers
Enterprise high-performance computing (HPC)
Edge data center and colocation deployments
Next-generation Xeon-based storage and networking appliances
| Value Dimension | Description |
|---|---|
| Birch Stream Ready | Purpose-built for Intel LGA7529 — no retrofit compromises |
| 400W Air Cooling | Handles the highest Birch Stream TDP SKUs in 2U form factor |
| Oversize Baseplate | 126.8×97.8mm — full LGA7529 IHS coverage, minimal spreading resistance |
| Dual Corrosion Protection | Nickel plating + passivation for extended data center service life |
| Zipper Fin Density | Maximizes surface area within the 64mm 2U height budget |
| OEM Customization | Baseplate geometry, fin stack tuning, and TIM recommendations for server manufacturers |
Greatminds provides customization options for server OEMs and system integrators:
Baseplate footprint adjustments for non-standard motherboard layouts
Fin stack tuning — fin pitch, thickness, and density optimization for specific chassis airflow profiles
Heat pipe routing variations to accommodate component keep-out zones
Surface treatment options — alternative plating materials for specialized coolant environments
TIM pre-application — factory-applied thermal interface material for streamlined assembly
Custom mounting mechanisms — spring-loaded or threaded fasteners to match OEM retention designs
Contact our engineering team to discuss your Birch Stream thermal requirements.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
