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HP002
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The HP002 is a high-performance heat pipe heatsink engineered for Intel Eagle Stream (EGS) platform servers using the LGA4677 socket. Measuring 118×78×64mm, it is purpose-built for standard 2U server chassis that rely on system fans for active airflow, delivering a verified cooling capacity of 270W within the mechanical constraints of a 2U rack-mount enclosure.
The HP002 combines three proven thermal technologies — zipper fin arrays, embedded heat pipes, and a copper base sheet — into a compact, mechanically robust assembly. The nickel-plated finish provides corrosion resistance and a professional appearance suited for high-reliability data center deployments.
Intel's Eagle Stream platform (Xeon Scalable 4th Gen / Sapphire Rapids) introduced processors with significantly elevated TDP ratings, demanding heatsinks capable of sustained high-load operation in space-constrained environments.
The 2U server form factor imposes a strict height limitation — typically 55–80mm — leaving minimal room for conventional extruded or skived fin stacks. At the same time, the LGA4677 socket features a large IHS contact area, making uniform heat spreading across the base a critical design requirement.
The HP002 addresses these constraints through:
Thin zipper fins for maximized surface area within the 64mm height envelope
Multiple heat pipes for rapid lateral heat spreading from the copper base to the full fin array
Copper sheet base for direct, low-resistance thermal contact with the processor IHS
Individually formed fin segments are "zipped" together to create an ultra-dense array with controlled fin pitch. This manufacturing technique achieves a higher fin density than stamped or extruded fins, maximizing convective surface area within the 118×78×64mm envelope. The open fin structure promotes unobstructed airflow from the 2U system fans, critical for sustained cooling performance under full CPU load.
Multiple copper heat pipes are sintered directly into the base, providing high-conductance thermal pathways from the heat source (processor IHS) to the full span of the fin array. Heat pipe technology enables near-isothermal temperature distribution across the fin stack, eliminating localized hot spots that would degrade processor performance or trigger thermal throttling.
The copper base sheet provides direct metallic contact with the LGA4677 processor IHS. Copper's thermal conductivity (~385 W/m·K) ensures minimal conduction resistance between the processor and the heat pipe evaporator section, contributing to the heatsink's ability to sustain 270W continuous dissipation.
The entire heatsink assembly — including the copper base and heat pipe surfaces — receives a uniform nickel plating treatment. Nickel plating:
Prevents copper oxidation and surface tarnishing over the product lifecycle
Resists corrosion in server environments with variable humidity
Provides a uniform, professional finish consistent with data center hardware standards
At 64mm height, the HP002 fits comfortably within standard 2U server chassis that provide 80mm of heatsink clearance. The 118×78mm footprint is matched to the LGA4677 socket keep-out zone, ensuring compatibility with Intel reference board layouts and major OEM server platforms.
| Parameter | Value |
|---|---|
| Model | HP002 |
| Heatsink Type | Active (system fan assisted) |
| Construction | Zipper Fin + Heat Pipe + Copper Sheet Base |
| Dimensions (L×W×H) | 118 × 78 × 64 mm |
| Base Material | Copper Sheet |
| Fin Material | Copper (zipper fin construction) |
| Heat Pipe Material | Copper |
| Surface Treatment | Nickel Plating |
| Socket Compatibility | Intel LGA4677 (EGS / Eagle Stream) |
| Server Form Factor | Standard 2U |
| Cooling Type | Active — system fan assisted |
| Verified Cooling Capacity | 270W |
| Airflow Requirement | System fans provided by server chassis |
The HP002 achieves a verified cooling capacity of 270W within a standard 2U server chassis equipped with system fans. This performance level covers the full TDP range of Intel Xeon Scalable processors on the Eagle Stream platform, including high-performance SKUs operating under sustained data center workloads.
Key performance contributors:
Zipper fin density maximizes convective area within the 64mm height constraint
Heat pipes ensure uniform temperature distribution across the entire fin array
Copper base sheet minimizes interfacial thermal resistance at the processor contact surface
Nickel-plated surfaces maintain long-term thermal performance by preventing oxidation-related resistance degradation
| Application | Details |
|---|---|
| 2U Enterprise Servers | Intel LGA4677 Xeon Scalable platform (Eagle Stream) |
| Cloud & Hyperscale Data Centers | High-density rack servers requiring compact, reliable CPU cooling |
| Edge Computing Servers | 2U systems deployed in space-constrained edge infrastructure |
| High-Performance Computing (HPC) | 2U HPC nodes with sustained high-TDP CPU operation |
| Telecom Infrastructure Servers | Carrier-grade 2U servers in telecom data center environments |
| OEM Server Manufacturing | Custom thermal solutions for LGA4677-based server platforms |
| Value Dimension | Detail |
|---|---|
| 270W Verified Capacity | Confirmed performance for Intel EGS platform full-TDP operation |
| 2U Form Factor Optimized | 64mm height fits standard 2U chassis without mechanical modification |
| Zipper Fin Density | Higher surface area than extruded or stamped alternatives at equivalent height |
| Heat Pipe Technology | Eliminates hot spots; near-isothermal fin temperature distribution |
| Nickel-Plated Durability | Oxidation-resistant finish for long service life in data center environments |
| LGA4677 Direct Fit | Designed for Intel Eagle Stream socket geometry and keep-out zone |
| System Fan Compatible | Integrates with standard 2U chassis fan configurations — no dedicated fan assembly required |
Greatminds provides OEM heat pipe heatsink manufacturing services for server and data center hardware developers:
Custom dimensions for non-standard 2U chassis or proprietary form factors
Alternative surface treatments including electroless nickel, hard anodizing, or bare copper
Different socket configurations for AMD SP5, LGA4189, LGA3647, or next-generation platforms
Fin pitch optimization for specific airflow rates and pressure drop constraints
Heat pipe quantity and diameter adjustments for different TDP targets
Prototype-to-volume production with full thermal validation support
Contact us to discuss your specific server cooling requirements
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
