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ZH005
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The ZH005 is a zipper fin heatsink with embedded heat pipes and copper base plate, purpose-engineered for the thermal demands of Intel Whitely platform processors deployed in standard 2U rack-mount server chassis.
At the core of ZH005's design is a three-element hybrid thermal architecture that combines:
A solid copper base sheet for rapid heat spreading from the CPU IHS (Integrated Heat Spreader)
High-performance heat pipes that efficiently transport heat from the CPU contact zone into the fin field
A dense zipper fin array that maximizes air-to-metal contact surface within the tight 64 mm height budget of a 2U enclosure
This is not a one-size-fits-all server cooler — it is a solution specifically designed for Intel Whitely (Ice Lake-SP) server processors, engineered to deliver stable thermal performance within the mechanical constraints of standard 2U chassis.
The nickel plating surface finish across all exposed surfaces provides corrosion resistance suitable for data center environments.
With compact dimensions of 108 × 78 × 64 mm, ZH005 fits within the processor keep-out zone of standard Intel LGA4189 socket layouts in 2U chassis, designed to leave necessary clearance for adjacent DIMM slots, VRM heatsinks, and chassis lid closure.
| Parameter | Details |
|---|---|
| Model | ZH005 |
| Category | Zipper Fin Heatsink with Embedded Heat Pipes |
| Core Technology | Zipper Fin + Heat Pipe + Copper Sheet |
| Dimensions (L × W × H) | 108 × 78 × 64 mm |
| Surface Treatment | Nickel Plating |
| Thermal Capacity | Up to 270 W |
| Form Factor | 2U Rack-Mount Server |
| Platform Compatibility | Intel Whitely |
| Application Scenario | Intel Whitely server heatsink in standard 2U chassis |
The ZH005 employs a zipper fin (bonded/folded fin) construction for its air-side heat exchanger. Compared to traditional extruded aluminum heatsinks, zipper fin technology allows significantly thinner individual fins and higher fin density within the same volume envelope. This means more heat-dissipating surface area in the same 108 × 78 × 64 mm form factor — a critical advantage when working within the strict height constraints of a 2U chassis.
The folded fin geometry also creates natural airflow turbulence, which enhances convective heat transfer efficiency compared to smooth-walled extruded fin channels at equivalent air velocities.
The heat pipes embedded within ZH005 utilize two-phase phase-change heat transfer — an internal working fluid evaporates at the CPU contact zone, travels as vapor along the pipe, condenses at the cooler fin zone, and returns via internal wick capillary action. This mechanism achieves effective thermal conductivities orders of magnitude beyond solid metal conduction, enabling heat to be transported rapidly from the CPU hot spot to the full extent of the fin array.
The solid copper base plate provides superior heat spreading from the CPU IHS compared to the aluminum bases found on most commodity server heatsinks. Copper's inherently higher thermal conductivity reduces the lateral temperature gradient across the CPU contact area, ensuring that heat pipes receive thermal load more uniformly and that no localized hot spot develops under the processor die.
The full nickel plating applied to ZH005 provides a uniform protective layer that:
Guards against corrosion in data center environments with fluctuating humidity levels
Protects against galvanic corrosion at copper-aluminum interfaces (where copper heat pipes meet aluminum fins)
Preserves surface integrity through repeated CPU installation and removal cycles
Maintains consistent thermal interface material (TIM) contact performance over the product's service life
Intel Whitely platform servers — 2U chassis deployments with Intel Xeon Scalable processors
Data center server cooling — High-density rack-mount server environments
Enterprise server deployments — 24/7 continuous operation workloads
High-performance computing (HPC) — Compute nodes under sustained multi-core workloads
Virtualization and cloud servers — Multi-VM host environments with continuous CPU load
For server deployments utilizing Intel Whitely platform processors in standard 2U chassis, the ZH005 zipper fin heatsink with embedded heat pipes and copper base offers a purpose-built thermal solution. By combining the heat spreading capability of a solid copper base, the efficient heat transport of embedded heat pipes, and the high surface area density of zipper fin technology, ZH005 addresses the core thermal challenges of cooling high-TDP server CPUs within the tightly constrained 2U form factor.
Interested in evaluating ZH005 for your server platform? Contact our thermal engineering team for application analysis, samples, and technical consultation.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
