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ZH003
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The ZH003 is a high-performance 1U server heatsink specifically designed for AMD EPYC 9004 series processors. Utilizing zipper fin, heat pipe, and copper base plate composite technology, it achieves breakthrough 260W cooling capacity within the standard 1U chassis space. As an AMD platform thermal expert, we provide targeted optimization for the unique thermal characteristics of the SP5 socket, helping server manufacturers unleash the full performance potential of EPYC processors within the 1U form factor.
1U Space Performance Breakthrough: Achieves 260W stable cooling within 25mm height, approaching 2U heatsink performance
AMD Platform Dedicated: Optimized specifically for EPYC 9004 series and SP5 socket, not a general-purpose solution
Composite Thermal Technology: Zipper fin + heat pipe + copper base plate, industry-leading thermal efficiency
Data Center-Grade Reliability: Nickel-plated treatment, adaptable to harsh environments
OEM Customization Service: Complete solutions provided for server manufacturers
1U Space Optimized Heat Pipe Layout: Addressing the 25mm height limitation of 1U servers, the ZH003 employs flattened heat pipe layout technology. The configuration features 6 Ø6mm high-performance sintered heat pipes optimized for hotspot coverage based on the EPYC multi-chip module architecture. The flattened bend design achieves maximum heat conduction within the 25mm height. Total heat pipe conduction capacity exceeds 350W, providing ample margin. Compared to general-purpose 1U cooling solutions, ZH003 improves thermal conduction efficiency by 30% in EPYC's typical hotspot areas, ensuring consistent temperatures across all cores.
High-Density Zipper Fin Design: Utilizing 0.15mm ultra-thin aluminum sheets in a zipper interlocking arrangement creates maximum cooling area within limited height. Effective cooling area exceeds 2800cm² with fin thickness of only 0.15mm. The optimized 1.6mm spacing balances heat dissipation and airflow resistance. Airflow guidance perfectly matches 1U server front-to-back airflow paths, while surface microstructures promote turbulence, increasing heat transfer coefficient by 18%. Within the 25mm height constraint, cooling area is maximized, achieving 35% higher volumetric cooling efficiency compared to traditional designs.
SP5 Dedicated Intelligent Retention System: A specialized retention mechanism developed for the unique installation requirements of the AMD SP5 socket. The 4-point independent spring design ensures pressure distribution uniformity greater than 85%. Installation torque of 35-40 lb·in is optimized for SP5. The system automatically adapts to CPU package thickness variations of ±0.15mm. After 50 installation cycle tests, performance retention exceeds 95%. Pressure indication design facilitates production line quality control, ensuring optimal contact between heatsink and EPYC processor IHS with contact thermal resistance less than 0.03°C/W, preventing performance loss due to installation deviations.
Nickel Plating Surface Treatment Process: An 8-12μm electroplated nickel layer provides data center-grade protection. Salt spray testing of 96 hours shows no corrosion. Long-term stability demonstrates thermal performance degradation less than 3% annually. Thermal contact optimization achieves surface roughness Ra less than 0.8μm. The oxidation-resistant surface is maintenance-friendly and easy to clean. Consistent appearance with matte metallic finish enhances product quality. In data center 7×24 operating environments, service life exceeds 5 years with reduced maintenance frequency.
High-Density Data Center Deployment: Scenario requirements involve hyperscale data centers pursuing极致 rack density, requiring 1U servers to support higher TDP EPYC processors. The ZH003 solution includes a 25mm ultra-thin design supporting 42 servers per 42U rack. 260W cooling capacity supports full-load operation of high-core-count EPYC 9004 processors. Low airflow resistance design reduces system fan power consumption. Customer value体现在 15% computing density increase from 36 to 42 servers per rack. Annual revenue increase per rack is approximately $4,000 to $5,000. PUE improvement of 0.005 to 0.01 reduces operational costs.
Edge Computing Nodes: Scenario requirements involve limited edge facility space requiring high-performance servers for AI and 5G applications. The ZH003 solution includes standard 1U dimensions suitable for edge rack deployment. 260W cooling capacity supports high-core-count EPYC processors. Nickel plating adapts to edge environmental temperature and humidity variations. Customer value includes 20% edge node performance improvement with reduced node count. Single nodes support more edge applications. Overall edge site total cost of ownership is reduced.
Enterprise Virtualization Platforms: Scenario requirements involve enterprise data centers needing stable and reliable virtualization hosts supporting 7×24 operation. The ZH003 solution includes temperature fluctuation less than ±3°C for stable and predictable performance. Long-life design achieves MTBF greater than 100,000 hours. Nickel plating adapts to enterprise server room environments. Customer value includes 15% to 20% increase in VM density. System availability reaches 99.99% with less than 1 hour annual downtime. Maintenance frequency is reduced by 50%, lowering operational costs.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
The ZH003 is a high-performance 1U server heatsink specifically designed for AMD EPYC 9004 series processors. Utilizing zipper fin, heat pipe, and copper base plate composite technology, it achieves breakthrough 260W cooling capacity within the standard 1U chassis space. As an AMD platform thermal expert, we provide targeted optimization for the unique thermal characteristics of the SP5 socket, helping server manufacturers unleash the full performance potential of EPYC processors within the 1U form factor.
1U Space Performance Breakthrough: Achieves 260W stable cooling within 25mm height, approaching 2U heatsink performance
AMD Platform Dedicated: Optimized specifically for EPYC 9004 series and SP5 socket, not a general-purpose solution
Composite Thermal Technology: Zipper fin + heat pipe + copper base plate, industry-leading thermal efficiency
Data Center-Grade Reliability: Nickel-plated treatment, adaptable to harsh environments
OEM Customization Service: Complete solutions provided for server manufacturers
1U Space Optimized Heat Pipe Layout: Addressing the 25mm height limitation of 1U servers, the ZH003 employs flattened heat pipe layout technology. The configuration features 6 Ø6mm high-performance sintered heat pipes optimized for hotspot coverage based on the EPYC multi-chip module architecture. The flattened bend design achieves maximum heat conduction within the 25mm height. Total heat pipe conduction capacity exceeds 350W, providing ample margin. Compared to general-purpose 1U cooling solutions, ZH003 improves thermal conduction efficiency by 30% in EPYC's typical hotspot areas, ensuring consistent temperatures across all cores.
High-Density Zipper Fin Design: Utilizing 0.15mm ultra-thin aluminum sheets in a zipper interlocking arrangement creates maximum cooling area within limited height. Effective cooling area exceeds 2800cm² with fin thickness of only 0.15mm. The optimized 1.6mm spacing balances heat dissipation and airflow resistance. Airflow guidance perfectly matches 1U server front-to-back airflow paths, while surface microstructures promote turbulence, increasing heat transfer coefficient by 18%. Within the 25mm height constraint, cooling area is maximized, achieving 35% higher volumetric cooling efficiency compared to traditional designs.
SP5 Dedicated Intelligent Retention System: A specialized retention mechanism developed for the unique installation requirements of the AMD SP5 socket. The 4-point independent spring design ensures pressure distribution uniformity greater than 85%. Installation torque of 35-40 lb·in is optimized for SP5. The system automatically adapts to CPU package thickness variations of ±0.15mm. After 50 installation cycle tests, performance retention exceeds 95%. Pressure indication design facilitates production line quality control, ensuring optimal contact between heatsink and EPYC processor IHS with contact thermal resistance less than 0.03°C/W, preventing performance loss due to installation deviations.
Nickel Plating Surface Treatment Process: An 8-12μm electroplated nickel layer provides data center-grade protection. Salt spray testing of 96 hours shows no corrosion. Long-term stability demonstrates thermal performance degradation less than 3% annually. Thermal contact optimization achieves surface roughness Ra less than 0.8μm. The oxidation-resistant surface is maintenance-friendly and easy to clean. Consistent appearance with matte metallic finish enhances product quality. In data center 7×24 operating environments, service life exceeds 5 years with reduced maintenance frequency.
High-Density Data Center Deployment: Scenario requirements involve hyperscale data centers pursuing极致 rack density, requiring 1U servers to support higher TDP EPYC processors. The ZH003 solution includes a 25mm ultra-thin design supporting 42 servers per 42U rack. 260W cooling capacity supports full-load operation of high-core-count EPYC 9004 processors. Low airflow resistance design reduces system fan power consumption. Customer value体现在 15% computing density increase from 36 to 42 servers per rack. Annual revenue increase per rack is approximately $4,000 to $5,000. PUE improvement of 0.005 to 0.01 reduces operational costs.
Edge Computing Nodes: Scenario requirements involve limited edge facility space requiring high-performance servers for AI and 5G applications. The ZH003 solution includes standard 1U dimensions suitable for edge rack deployment. 260W cooling capacity supports high-core-count EPYC processors. Nickel plating adapts to edge environmental temperature and humidity variations. Customer value includes 20% edge node performance improvement with reduced node count. Single nodes support more edge applications. Overall edge site total cost of ownership is reduced.
Enterprise Virtualization Platforms: Scenario requirements involve enterprise data centers needing stable and reliable virtualization hosts supporting 7×24 operation. The ZH003 solution includes temperature fluctuation less than ±3°C for stable and predictable performance. Long-life design achieves MTBF greater than 100,000 hours. Nickel plating adapts to enterprise server room environments. Customer value includes 15% to 20% increase in VM density. System availability reaches 99.99% with less than 1 hour annual downtime. Maintenance frequency is reduced by 50%, lowering operational costs.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
