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ZH004
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The ZH004 is a specialized high-performance heatsink designed for Broadcom Trident 3 series switch chips, featuring zipper fin, heat pipe, and copper baseplate composite technology to deliver excellent cooling performance within a compact 160×85×23mm footprint. As a networking equipment thermal specialist, we help switch manufacturers ensure Trident 3 chips operate stably in data center environments, preventing performance degradation caused by overheating.
Broadcom Platform Dedicated: Optimized specifically for Trident 3 series switch chips
Composite Cooling Technology: Zipper fins + heat pipes + copper baseplate for maximum efficiency
Data Center Grade Reliability: Nickel plating for harsh environments
Temperature Stability Assurance: Ensures switches operate within stable temperature ranges
OEM Customization Services: Complete solutions for switch manufacturers
Zipper Fin Process: Precision interlocking arrangement technology maximizes cooling area within limited space. 0.15mm ultra-thin aluminum sheets arranged alternately create unique airflow turbulence channels, increasing heat transfer coefficient by over 25%. The zipper structure also enhances structural strength of the fin array, providing excellent vibration resistance.
Heat Pipe Efficient Conduction: Four high-performance sintered heat pipes optimized for Trident 3 chip thermal distribution. C-shaped bend design extends from chip center to both sides of the fin array, enabling rapid and uniform heat distribution. Each heat pipe delivers >50W thermal conductivity, with total capacity exceeding 200W.
Copper Baseplate Precision Machining: 3mm thick C1100 high-purity copper baseplate with thermal conductivity 398W/m·K. Baseplate surface flatness <0.05mm ensures perfect contact with chip IHS. Precision milling minimizes contact thermal resistance.
Nickel Plating Surface Treatment: 8-12μm electroplated nickel layer passes 96-hour salt spray testing, meeting data center environmental requirements. Nickel-plated surface resists oxidation and corrosion, maintaining cooling performance over long-term use.
Data Center Ethernet Switches: Trident 3 chips are widely used in 25G/100G data center switches. ZH004 ensures stable chip operation at 40°C ambient temperature, supporting high-density port configurations and preventing packet loss and performance degradation caused by overheating.
Enterprise Core Switches: Enterprise network core equipment requires 7×24 stable operation. ZH004's nickel plating adapts to enterprise server room environments, with long-life design reducing maintenance frequency and ensuring core network reliability.
Campus Network Aggregation Switches: Campus environments experience significant temperature fluctuations, demanding robust thermal solutions. ZH004's wide temperature adaptability ensures stable equipment performance through seasonal temperature changes.
Performance Assurance: Ensures Trident 3 chips operate stably at full load, preventing throttling.
Density Enhancement: Compact design supports higher port density switches.
Reliability Improvement: Reduces cooling-related failures, enhances network availability.
Energy Efficiency Optimization: Low airflow resistance design reduces fan power consumption.
Fast Time-to-Market: Standardized solution shortens switch development cycles.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
The ZH004 is a specialized high-performance heatsink designed for Broadcom Trident 3 series switch chips, featuring zipper fin, heat pipe, and copper baseplate composite technology to deliver excellent cooling performance within a compact 160×85×23mm footprint. As a networking equipment thermal specialist, we help switch manufacturers ensure Trident 3 chips operate stably in data center environments, preventing performance degradation caused by overheating.
Broadcom Platform Dedicated: Optimized specifically for Trident 3 series switch chips
Composite Cooling Technology: Zipper fins + heat pipes + copper baseplate for maximum efficiency
Data Center Grade Reliability: Nickel plating for harsh environments
Temperature Stability Assurance: Ensures switches operate within stable temperature ranges
OEM Customization Services: Complete solutions for switch manufacturers
Zipper Fin Process: Precision interlocking arrangement technology maximizes cooling area within limited space. 0.15mm ultra-thin aluminum sheets arranged alternately create unique airflow turbulence channels, increasing heat transfer coefficient by over 25%. The zipper structure also enhances structural strength of the fin array, providing excellent vibration resistance.
Heat Pipe Efficient Conduction: Four high-performance sintered heat pipes optimized for Trident 3 chip thermal distribution. C-shaped bend design extends from chip center to both sides of the fin array, enabling rapid and uniform heat distribution. Each heat pipe delivers >50W thermal conductivity, with total capacity exceeding 200W.
Copper Baseplate Precision Machining: 3mm thick C1100 high-purity copper baseplate with thermal conductivity 398W/m·K. Baseplate surface flatness <0.05mm ensures perfect contact with chip IHS. Precision milling minimizes contact thermal resistance.
Nickel Plating Surface Treatment: 8-12μm electroplated nickel layer passes 96-hour salt spray testing, meeting data center environmental requirements. Nickel-plated surface resists oxidation and corrosion, maintaining cooling performance over long-term use.
Data Center Ethernet Switches: Trident 3 chips are widely used in 25G/100G data center switches. ZH004 ensures stable chip operation at 40°C ambient temperature, supporting high-density port configurations and preventing packet loss and performance degradation caused by overheating.
Enterprise Core Switches: Enterprise network core equipment requires 7×24 stable operation. ZH004's nickel plating adapts to enterprise server room environments, with long-life design reducing maintenance frequency and ensuring core network reliability.
Campus Network Aggregation Switches: Campus environments experience significant temperature fluctuations, demanding robust thermal solutions. ZH004's wide temperature adaptability ensures stable equipment performance through seasonal temperature changes.
Performance Assurance: Ensures Trident 3 chips operate stably at full load, preventing throttling.
Density Enhancement: Compact design supports higher port density switches.
Reliability Improvement: Reduces cooling-related failures, enhances network availability.
Energy Efficiency Optimization: Low airflow resistance design reduces fan power consumption.
Fast Time-to-Market: Standardized solution shortens switch development cycles.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
