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ZH002
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The ZH002 is a high-performance zipper fin heatsink specifically designed for Intel Eagle Stream platform 1U servers. Utilizing zipper fin, heat pipe, and copper baseplate composite technology, it achieves 205W stable cooling capacity within standard 1U chassis space. As a professional server thermal solution provider, we help server manufacturers unleash the full performance potential of Intel EGS platform processors within compact 1U space.
Intel EGS Platform Dedicated: Optimized for Intel Eagle Stream platform 1U servers.
205W Cooling Capacity: Stable heat dissipation within standard 1U space.
Composite Cooling Technology: Zipper fins + heat pipes + copper baseplate, industry-leading efficiency.
Compact Dimensions: 118×78×25.5mm, perfect fit for 1U chassis.
Nickel Plating Surface Treatment: Oxidation and corrosion resistant, adapting to data center environments.
OEM Customization Services: Complete solutions for server manufacturers.
Zipper Fin Process: Precision zipper-style interlocking arrangement technology maximizes cooling area within the 25.5mm height limit. 0.15mm ultra-thin aluminum sheets arranged alternately create unique airflow turbulence channels, increasing heat transfer coefficient by over 25%. The zipper structure also enhances the structural strength of the fin array, providing excellent vibration resistance.
Heat Pipe Efficient Conduction: Four high-performance heat pipes are optimized for the thermal distribution of Intel EGS platform processors. The heat pipes feature flattened bend designs, achieving rapid and uniform heat transfer within the 1U height restriction, ensuring quick heat extraction from CPU hotspot areas.
Copper Baseplate Precision Machining: High-purity copper baseplate with thermal conductivity of 398W/m·K. Baseplate surface flatness <0.05mm ensures perfect contact with the CPU IHS. Precision milling minimizes contact thermal resistance, maximizing the cooling efficiency of the heat pipes and fins.
Nickel Plating Surface Treatment: The 8-12μm electroplated nickel layer passes salt spray testing, meeting data center environmental requirements. The nickel-plated surface resists oxidation and corrosion, maintaining excellent cooling performance over long-term use and extending product service life.
Scenario Requirements: Data center 1U servers deployed in racks追求极致 computing density, requiring support for 205W Intel EGS platform processors within limited space while ensuring 7×24 continuous operation reliability.
25.5mm ultra-thin design, perfectly fitting standard 1U chassis space.
Zipper fin + heat pipe composite technology, 205W cooling capacity meeting full-load processor operation.
Nickel plating surface treatment, oxidation and corrosion resistant, adapting to long-term data center operating environments.
Supports 42 servers per 42U rack, maximizing computing density.
Ensures stable full-core turbo boost operation, fully releasing processor performance.
Reduces performance degradation risks caused by overheating, improving return on investment.
Scenario Requirements: Enterprise data center virtualization hosts require 7×24 continuous operation with extremely high demands for cooling system reliability, while supporting full-load operation of high-core-count processors.
Heat pipe + zipper fin composite technology, industry-leading cooling efficiency.
Nickel plating treatment for oxidation resistance, stable long-term performance.
Compact dimensions adapting to standard server chassis.
Increased VM density, single server supporting more virtualization applications.
System availability improved to 99.99%, ensuring business continuity.
Long-life design reducing maintenance frequency and operational costs.
Scenario Requirements: Edge computing nodes have limited space and variable environmental conditions, requiring compact and efficient cooling solutions adaptable to different deployment scenarios while supporting high-performance computing needs.
118×78×25.5mm compact dimensions, adapting to limited edge node space.
205W cooling capacity, supporting high-performance edge computing applications.
Nickel plating surface treatment, adapting to different environmental conditions.
Enhanced edge node performance, supporting more edge AI applications.
Simplified system design, reduced deployment complexity.
Adaptability to broader deployment environments, improving solution flexibility.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
The ZH002 is a high-performance zipper fin heatsink specifically designed for Intel Eagle Stream platform 1U servers. Utilizing zipper fin, heat pipe, and copper baseplate composite technology, it achieves 205W stable cooling capacity within standard 1U chassis space. As a professional server thermal solution provider, we help server manufacturers unleash the full performance potential of Intel EGS platform processors within compact 1U space.
Intel EGS Platform Dedicated: Optimized for Intel Eagle Stream platform 1U servers.
205W Cooling Capacity: Stable heat dissipation within standard 1U space.
Composite Cooling Technology: Zipper fins + heat pipes + copper baseplate, industry-leading efficiency.
Compact Dimensions: 118×78×25.5mm, perfect fit for 1U chassis.
Nickel Plating Surface Treatment: Oxidation and corrosion resistant, adapting to data center environments.
OEM Customization Services: Complete solutions for server manufacturers.
Zipper Fin Process: Precision zipper-style interlocking arrangement technology maximizes cooling area within the 25.5mm height limit. 0.15mm ultra-thin aluminum sheets arranged alternately create unique airflow turbulence channels, increasing heat transfer coefficient by over 25%. The zipper structure also enhances the structural strength of the fin array, providing excellent vibration resistance.
Heat Pipe Efficient Conduction: Four high-performance heat pipes are optimized for the thermal distribution of Intel EGS platform processors. The heat pipes feature flattened bend designs, achieving rapid and uniform heat transfer within the 1U height restriction, ensuring quick heat extraction from CPU hotspot areas.
Copper Baseplate Precision Machining: High-purity copper baseplate with thermal conductivity of 398W/m·K. Baseplate surface flatness <0.05mm ensures perfect contact with the CPU IHS. Precision milling minimizes contact thermal resistance, maximizing the cooling efficiency of the heat pipes and fins.
Nickel Plating Surface Treatment: The 8-12μm electroplated nickel layer passes salt spray testing, meeting data center environmental requirements. The nickel-plated surface resists oxidation and corrosion, maintaining excellent cooling performance over long-term use and extending product service life.
Scenario Requirements: Data center 1U servers deployed in racks追求极致 computing density, requiring support for 205W Intel EGS platform processors within limited space while ensuring 7×24 continuous operation reliability.
25.5mm ultra-thin design, perfectly fitting standard 1U chassis space.
Zipper fin + heat pipe composite technology, 205W cooling capacity meeting full-load processor operation.
Nickel plating surface treatment, oxidation and corrosion resistant, adapting to long-term data center operating environments.
Supports 42 servers per 42U rack, maximizing computing density.
Ensures stable full-core turbo boost operation, fully releasing processor performance.
Reduces performance degradation risks caused by overheating, improving return on investment.
Scenario Requirements: Enterprise data center virtualization hosts require 7×24 continuous operation with extremely high demands for cooling system reliability, while supporting full-load operation of high-core-count processors.
Heat pipe + zipper fin composite technology, industry-leading cooling efficiency.
Nickel plating treatment for oxidation resistance, stable long-term performance.
Compact dimensions adapting to standard server chassis.
Increased VM density, single server supporting more virtualization applications.
System availability improved to 99.99%, ensuring business continuity.
Long-life design reducing maintenance frequency and operational costs.
Scenario Requirements: Edge computing nodes have limited space and variable environmental conditions, requiring compact and efficient cooling solutions adaptable to different deployment scenarios while supporting high-performance computing needs.
118×78×25.5mm compact dimensions, adapting to limited edge node space.
205W cooling capacity, supporting high-performance edge computing applications.
Nickel plating surface treatment, adapting to different environmental conditions.
Enhanced edge node performance, supporting more edge AI applications.
Simplified system design, reduced deployment complexity.
Adaptability to broader deployment environments, improving solution flexibility.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
