As switch chips evolve, higher-performance nodes like 5nm process technology reduce power consumption per unit of computing power. However, as switch chip bandwidth scales to 51.2Tbps, single-chip power consumption rises to approximately 900W. Similarly, optical modules have seen power increases—fro Read More

Here is a restructured English version of the article "Phase-Change Cold Plates & Hybrid Air-Liquid Cooling Technology," incorporating technical details and logical flow improvements:Phase-Change Cold Plate Technology: Revolutionizing High-Density CoolingCore Principle: Fluorinated coolants (e.g., R Read More

Current Air-Cooling Limits for High-TDP CPUsThe feasibility of air-cooling solutions for modern high-TDP CPUs in 1U and 2U servers is a critical challenge in data center infrastructure. Current industry benchmarks indicate that dual-socket 2U servers can support air-cooled CPUs with power consumptio Read More

1. IntroductionThe exponential growth of AI computing power has ushered in unprecedented thermal challenges for modern data centers. High-performance AI accelerators like NVIDIA’s Blackwell GB200 and Meta’s Catalina platforms now demand cooling solutions capable of dissipating 4,000W+ per processor— Read More

After reading this passage, you will know what are the cooling technologies in the data center. Read More