Heat Pipe Design and Modeling TechniquesThis article is based on ACT's Heat Pipe Design and Modeling Techniques and focuses on heat pipe modeling techniques and methods for reference.A liquid cooling technology exchange group has been established, which is suitable for R&D personnel, product manager Read More

The advent of 5G technology has revolutionized mobile connectivity, enabling faster data speeds, lower latency, and enhanced user experiences. However, this leap forward comes with a significant challenge: heat. As smartphones evolve to support 5G’s high-performance demands, advanced thermal managem Read More

IntroductionVapor chamber heat spreaders, also known as vapor chambers or VC, are advanced thermal management components used to dissipate heat from high-power electronic devices. They operate on the principle of phase change heat transfer, similar to traditional heat pipes but in a two-dimensional Read More

Current Air-Cooling Limits for High-TDP CPUsThe feasibility of air-cooling solutions for modern high-TDP CPUs in 1U and 2U servers is a critical challenge in data center infrastructure. Current industry benchmarks indicate that dual-socket 2U servers can support air-cooled CPUs with power consumptio Read More

Thermal Management Challenges in the 5G EraWith the widespread adoption of 5G technology, the power consumption and heat generation of smartphones have increased dramatically. 5G phones need to support more frequency bands, higher data transfer rates, and complex RF modules (e.g., Massive MIMO), lea Read More