Situation：Overcoming the 800W Thermal Barrier in 4U Core Switches
Network equipment manufacturers face a critical challenge when developing next-generation data center core switches: dissipating 800W of thermal power from a single Broadcom Tomahawk 5 chip within a compact 4U form factor. The requirement to achieve ultra-low thermal resistance below 0.045°C/W under 500CFM forced air cooling represented a near-limit performance demand for air cooling technology, necessitating a partnership with an advanced thermal solution provider. Read More

A server manufacturer faced significant thermal challenges while developing its next-generation high-density GPU computing platform. The design required integrating four NVIDIA A-Series high-power chips in a 2×2 array layout within a confined space, with each chip dissipating 500W. The client stipulated that the case temperature (Tcase) of each chip must remain below 80°C, and the temperature differential between the front and rear chip groups must be controlled within 3°C to ensure system stability and computational consistency under sustained high loads. Read More

A globally leading Tier-1 communications equipment client encountered critical thermal management challenges during the development of their next-generation coherent optical modules. The module contains two heat sources, each operating at 13W with a compact size of 27×13mm, while the system's permissible air cooling capacity is limited to only 10CFM. The client required the overall thermal resistance to be strictly maintained within 0.6°C/W and sought comprehensive thermal technology support spanning thermal design, prototype development, testing, and mass production. Read More