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TVC004
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TVC004 is a high-performance server heatsink that innovatively integrates a Flattened Tube 3D Vapor Chamber (3DVC) Core with Zipper Fin Technology, specifically optimized for AMD SP5 platform 2U rackmount servers. Within a compact 118x92.4x64mm size, this product achieves a breakthrough 500W heat dissipation capability, serving as a high-density cooling solution for AMD EPYC 9004 series processors. Featuring a hybrid cooling design of Skived Fins and 3D Vapor Chamber along with a nickel plating surface treatment process, TVC004 provides a low-airflow-resistance, highly reliable thermal management module for data center server upgrades, making it the ideal choice for OEM custom heatsink suppliers for AMD platform server manufacturers.
Revolutionary Flattened Tube Design: Unlike traditional cylindrical heat pipes, TVC004 employs a patented flattened 3D vapor chamber core, significantly reducing airflow resistance by up to 37%, achieving a breakthrough in the efficiency of low-airflow-resistance 3D vapor chamber heatsinks.
Three-Dimensional Heat Spreading Optimization: Tailored to the large heat source distribution of AMD SP5 processors, it achieves balanced heat conduction in X, Y, and Z dimensions, completely eliminating chip hotspots.
Efficient Phase-Change Heat Transfer Mechanism: Optimized internal wick structure and working fluid formulation ensure stable phase-change performance under sustained 500W loads.
Zipper Fin Technology Integration: Achieves an ultra-high-density fin array exceeding 130 Fins Per Inch (FPI), maximizing the heat dissipation surface area within the limited space.
Precision Skived Process Application: The fin roots utilize precision skiving technology to ensure zero-gap contact with the vapor chamber base, reducing interfacial thermal resistance.
Hybrid Cooling Architecture Advantage: The Skived Fin and 3D Vapor Chamber Hybrid Cooling System works synergistically to provide dual cooling assurance for high-TDP CPUs.
Nickel Plating for Enhanced Thermal Performance: A uniform 5-8μm nickel plating layer provides excellent corrosion protection while optimizing thermal interface performance.
Long-Term Operational Stability: Prevents thermal resistance increase caused by copper substrate oxidation, ensuring long-term stable cooling performance in data center environments.
Professional-Grade Aesthetic Quality: A mirror-finish plating showcases product professionalism and facilitates daily cleaning and maintenance.
500W Cooling Capacity Support: Provides ample cooling headroom for the highest-performance models of the AMD EPYC 9004 series.
High-Density Cooling in 2U Racks: Achieves cooling performance within standard 2U space that traditional solutions cannot match.
System-Level Energy Efficiency Optimization: Low airflow resistance design reduces overall system cooling power consumption by 15-20%.
Perfect Fit with Compact Size: The 118×92.4×64mm specification is compatible with mainstream 2U server designs.
Simplified Thermal System Design: An integrated solution reduces customer thermal engineering workload.
Data Center-Grade Reliability: Meets 7×24 continuous operation requirements, lowering maintenance frequency.
Lower Total Cost of Ownership (TCO): Efficient cooling design aids data center PUE optimization, reducing long-term operational expenditure (OPEX).
Accelerated Time-to-Market: A thoroughly validated cooling platform shortens integration testing cycles.
Creating Technological Differentiation: Advanced cooling technology becomes a key selling point for server products.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
TVC004 is a high-performance server heatsink that innovatively integrates a Flattened Tube 3D Vapor Chamber (3DVC) Core with Zipper Fin Technology, specifically optimized for AMD SP5 platform 2U rackmount servers. Within a compact 118x92.4x64mm size, this product achieves a breakthrough 500W heat dissipation capability, serving as a high-density cooling solution for AMD EPYC 9004 series processors. Featuring a hybrid cooling design of Skived Fins and 3D Vapor Chamber along with a nickel plating surface treatment process, TVC004 provides a low-airflow-resistance, highly reliable thermal management module for data center server upgrades, making it the ideal choice for OEM custom heatsink suppliers for AMD platform server manufacturers.
Revolutionary Flattened Tube Design: Unlike traditional cylindrical heat pipes, TVC004 employs a patented flattened 3D vapor chamber core, significantly reducing airflow resistance by up to 37%, achieving a breakthrough in the efficiency of low-airflow-resistance 3D vapor chamber heatsinks.
Three-Dimensional Heat Spreading Optimization: Tailored to the large heat source distribution of AMD SP5 processors, it achieves balanced heat conduction in X, Y, and Z dimensions, completely eliminating chip hotspots.
Efficient Phase-Change Heat Transfer Mechanism: Optimized internal wick structure and working fluid formulation ensure stable phase-change performance under sustained 500W loads.
Zipper Fin Technology Integration: Achieves an ultra-high-density fin array exceeding 130 Fins Per Inch (FPI), maximizing the heat dissipation surface area within the limited space.
Precision Skived Process Application: The fin roots utilize precision skiving technology to ensure zero-gap contact with the vapor chamber base, reducing interfacial thermal resistance.
Hybrid Cooling Architecture Advantage: The Skived Fin and 3D Vapor Chamber Hybrid Cooling System works synergistically to provide dual cooling assurance for high-TDP CPUs.
Nickel Plating for Enhanced Thermal Performance: A uniform 5-8μm nickel plating layer provides excellent corrosion protection while optimizing thermal interface performance.
Long-Term Operational Stability: Prevents thermal resistance increase caused by copper substrate oxidation, ensuring long-term stable cooling performance in data center environments.
Professional-Grade Aesthetic Quality: A mirror-finish plating showcases product professionalism and facilitates daily cleaning and maintenance.
500W Cooling Capacity Support: Provides ample cooling headroom for the highest-performance models of the AMD EPYC 9004 series.
High-Density Cooling in 2U Racks: Achieves cooling performance within standard 2U space that traditional solutions cannot match.
System-Level Energy Efficiency Optimization: Low airflow resistance design reduces overall system cooling power consumption by 15-20%.
Perfect Fit with Compact Size: The 118×92.4×64mm specification is compatible with mainstream 2U server designs.
Simplified Thermal System Design: An integrated solution reduces customer thermal engineering workload.
Data Center-Grade Reliability: Meets 7×24 continuous operation requirements, lowering maintenance frequency.
Lower Total Cost of Ownership (TCO): Efficient cooling design aids data center PUE optimization, reducing long-term operational expenditure (OPEX).
Accelerated Time-to-Market: A thoroughly validated cooling platform shortens integration testing cycles.
Creating Technological Differentiation: Advanced cooling technology becomes a key selling point for server products.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
