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TVC002
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TVC002 is a high-performance server heatsink that utilizes 3D Vapor Chamber (3DVC) technology combined with a zipper fin structure, specifically optimized for Intel EGS (Eagle Stream) platform 2U rackmount servers. This product, featuring an advanced nickel plating surface treatment process, provides an excellent high-efficiency thermal solution for Intel Xeon Scalable processors with LGA4677 sockets, meeting data center demands for 24/7 continuous operation reliability. As a custom heatsink supplier for server OEM/ODM manufacturers, we provide server makers with enhanced airflow designs and easy-maintenance installation solutions, ensuring balanced server thermal management and long operational lifespan.
Three-Dimensional Thermal Architecture: Unique 3D Vapor Chamber technology enables efficient dual-side cooling within the confined 2U space, ensuring rapid and uniform heat dissipation from Intel Xeon Scalable processors.
Low Thermal Resistance Cooling Module Design: Optimized internal wick structure and soldering processes achieve thermal resistance below 0.12°C/W, fully unleashing the computational potential of high-TDP processors.
Balanced Server Thermal Management: Precise heat flow distribution ensures temperature equilibrium across processor cores, enhancing system stability and performance consistency.
2U Chassis Optimized Design: The zipper-style fin structure achieves over 120 Fins Per Inch (FPI) density within standard 2U space, maximizing heat dissipation area and airflow efficiency.
Enhanced Airflow Design: Interleaved fin arrangement breaks up laminar airflow, improving heat exchange efficiency by over 30% while reducing system air resistance and noise.
Simple Maintenance and Installation Structure: Modular design with standardized interfaces supports quick installation and replacement, reducing data center operational complexity.
Durable Corrosion Protection: Uniform nickel plating effectively resists corrosive substances common in data center environments, ensuring long-term durability under 24/7 data center operating conditions.
Thermal Interface Stability: Prevents performance degradation caused by base material oxidation, maintaining stable long-term thermal conductivity.
Professional Aesthetic Quality: Mirror-finish plating enhances product professionalism while facilitating easy cleaning and maintenance.
Supports High-TDP Intel CPUs: Provides ample cooling headroom for 350W+ processors, ensuring full-core turbo stability.
24/7 Continuous Operation Reliability: Rigorous environmental and lifespan testing meets data center non-stop operation requirements.
Balanced Server Thermal Management: Uniform temperature distribution improves system stability and extends component lifespan.
Simple Structure for Easy Maintenance and Installation: Modular design supports rapid deployment and replacement, reducing server downtime.
Enhanced Airflow Design Reduces Power Consumption: Optimized airflow paths reduce system resistance, aiding data center PUE optimization.
Standardized Interfaces Simplify Supply Chain: Unified specifications reduce spare part variety, lowering inventory and management costs.
Flexible Partnership as an OEM/ODM Supplier: Supports comprehensive cooperation from standard products to deep customization.
Accelerated Product Time-to-Market: Mature cooling platform reduces validation time, shortening product launch cycles by 2-3 months.
Lower Total Cost of Ownership (TCO): Achieves positive return on investment within a 3-year operational cycle, reducing TCO by 15-20%.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
TVC002 is a high-performance server heatsink that utilizes 3D Vapor Chamber (3DVC) technology combined with a zipper fin structure, specifically optimized for Intel EGS (Eagle Stream) platform 2U rackmount servers. This product, featuring an advanced nickel plating surface treatment process, provides an excellent high-efficiency thermal solution for Intel Xeon Scalable processors with LGA4677 sockets, meeting data center demands for 24/7 continuous operation reliability. As a custom heatsink supplier for server OEM/ODM manufacturers, we provide server makers with enhanced airflow designs and easy-maintenance installation solutions, ensuring balanced server thermal management and long operational lifespan.
Three-Dimensional Thermal Architecture: Unique 3D Vapor Chamber technology enables efficient dual-side cooling within the confined 2U space, ensuring rapid and uniform heat dissipation from Intel Xeon Scalable processors.
Low Thermal Resistance Cooling Module Design: Optimized internal wick structure and soldering processes achieve thermal resistance below 0.12°C/W, fully unleashing the computational potential of high-TDP processors.
Balanced Server Thermal Management: Precise heat flow distribution ensures temperature equilibrium across processor cores, enhancing system stability and performance consistency.
2U Chassis Optimized Design: The zipper-style fin structure achieves over 120 Fins Per Inch (FPI) density within standard 2U space, maximizing heat dissipation area and airflow efficiency.
Enhanced Airflow Design: Interleaved fin arrangement breaks up laminar airflow, improving heat exchange efficiency by over 30% while reducing system air resistance and noise.
Simple Maintenance and Installation Structure: Modular design with standardized interfaces supports quick installation and replacement, reducing data center operational complexity.
Durable Corrosion Protection: Uniform nickel plating effectively resists corrosive substances common in data center environments, ensuring long-term durability under 24/7 data center operating conditions.
Thermal Interface Stability: Prevents performance degradation caused by base material oxidation, maintaining stable long-term thermal conductivity.
Professional Aesthetic Quality: Mirror-finish plating enhances product professionalism while facilitating easy cleaning and maintenance.
Supports High-TDP Intel CPUs: Provides ample cooling headroom for 350W+ processors, ensuring full-core turbo stability.
24/7 Continuous Operation Reliability: Rigorous environmental and lifespan testing meets data center non-stop operation requirements.
Balanced Server Thermal Management: Uniform temperature distribution improves system stability and extends component lifespan.
Simple Structure for Easy Maintenance and Installation: Modular design supports rapid deployment and replacement, reducing server downtime.
Enhanced Airflow Design Reduces Power Consumption: Optimized airflow paths reduce system resistance, aiding data center PUE optimization.
Standardized Interfaces Simplify Supply Chain: Unified specifications reduce spare part variety, lowering inventory and management costs.
Flexible Partnership as an OEM/ODM Supplier: Supports comprehensive cooperation from standard products to deep customization.
Accelerated Product Time-to-Market: Mature cooling platform reduces validation time, shortening product launch cycles by 2-3 months.
Lower Total Cost of Ownership (TCO): Achieves positive return on investment within a 3-year operational cycle, reducing TCO by 15-20%.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
