 |
CP003
| Quantity: | |
|---|---|
The CP003 is a high-performance liquid cold plate purpose-built for cooling Broadcom Tomahawk 5 switch chips in compact Ethernet switch platforms. Manufactured via diffusion bonding, it delivers exceptional thermal performance within an ultra-compact 78.2 × 48.6 × 12.1 mm envelope.
The diffusion bonding process creates a monolithic structure — no braze filler, no O-rings, no gaskets — eliminating leak paths and delivering higher pressure tolerance, better thermal uniformity, and superior long-term reliability compared to conventional brazed cold plates. This enables the CP003 to dissipate up to 500 W from the Tomahawk 5 ASIC, a critical thermal requirement for next-generation 800G and 1.6T Ethernet switches.
The nickel-plated surface provides corrosion protection when using water-glycol coolants, while the sand blast finish enhances thermal interface material (TIM) adhesion and product aesthetics.
Broadcom's Tomahawk 5 is the highest-performance switching silicon in the StrataXGS family, delivering 51.2 Tbps throughput. This bandwidth comes at a thermal cost — the chip can generate up to 500 W of heat within a die area measured in square centimeters, translating to extreme heat flux densities.
The challenge is compounded by the end-equipment form factor: compact fixed-configuration Ethernet switches demand that cooling solutions fit within severely constrained internal volumes. Traditional air-cooled heatsinks cannot achieve the thermal resistance required at these power levels within the available space envelope. Liquid cooling becomes essential — and the cold plate must be small enough to mount directly atop the switch ASIC without interfering with surrounding components while delivering sufficient thermal performance to keep junction temperatures within safe limits.
CP003 addresses this by packing an efficient micro-channel liquid cooling circuit into a 12.1 mm thin profile, utilizing diffusion bonding to create internal flow channels with minimal thermal resistance between the liquid coolant and the chip surface.
Diffusion bonded monolithic construction — No braze joints, no O-rings, no gaskets; eliminates leak paths and thermal interface losses at internal joints
500 W thermal capacity — Engineered to handle the full thermal output of Broadcom Tomahawk 5 switching silicon
Ultra-compact 78.2 × 48.6 × 12.1 mm — Fits directly within the tight PCB-to-enclosure clearance of space-constrained Ethernet switches
Nickel-plated surface with sand blast finish — Corrosion-resistant exterior with controlled surface roughness for optimal TIM adhesion
Internal micro-channel architecture — High surface-area-to-volume ratio for maximum heat transfer efficiency
Liquid cooling ready — Designed for integration into pumped liquid cooling loops with standard fittings
Data center reliability — Built for 24/7 continuous operation in demanding network infrastructure environments
| Parameter | Detail |
|---|---|
| Model | CP003 |
| Type | Diffusion Bonded Liquid Cold Plate |
| Manufacturing Process | Diffusion Bonding |
| Dimensions | 78.2 × 48.6 × 12.1 mm |
| Surface Treatment | Nickel Plating + Sand Blast |
| Cooling Mode | Liquid Cooling (Pumped Loop) |
| Thermal Capacity | 500 W |
| Application Chip | Broadcom Tomahawk 5 Switch ASIC |
| Application Equipment | Compact Fixed-Configuration Ethernet Switch |
Diffusion bonding is a solid-state welding process where two precision-machined metal plates are pressed together under high temperature and pressure in a controlled atmosphere. At the atomic level, material diffuses across the interface, creating a seamless, monolithic bond — no filler metal, no braze alloy, no mechanical fasteners.
For liquid cold plates, this process enables:
Zero internal leak risk — No brazed joints or O-ring seals that can fail over thermal cycling
Minimal thermal resistance — The bonded interface achieves near-parent-material thermal conductivity, unlike brazed joints where filler alloys can act as thermal barriers
Fine micro-channel geometries — Diffusion bonding preserves precision-machined internal channel features without the risk of braze alloy wicking into and blocking narrow passages
Uniform material properties — The entire cold plate behaves as a single piece of metal, eliminating differential thermal expansion concerns at joints
In high-heat-flux applications like Tomahawk 5 cooling, where every millikelvin of thermal resistance matters, diffusion bonding provides a measurable advantage over conventional cold plate manufacturing methods.
| Comparison | Diffusion Bonded (CP003) | Brazed Cold Plate |
|---|---|---|
| Bond Mechanism | Atomic diffusion — monolithic structure | Filler alloy melting and solidification |
| Internal Joints | None — single continuous metal body | Braze joints at plate interfaces |
| Thermal Resistance at Joints | Near-parent-material | Braze alloy can introduce thermal barrier |
| Leak Path Risk | Virtually zero | Joints susceptible to thermal cycling fatigue |
| Micro-Channel Precision | Machined features fully preserved | Braze alloy may wick into narrow channels |
Broadcom Tomahawk 5 chips in 800G / 1.6T Ethernet switches
Compact high-performance network switches
Data center switching infrastructure
High-density ASIC cooling in telecom equipment
High-performance switching platforms with severe z-height constraints
Any high-power ASIC cooling scenario demanding ultra-compact cold plate form factors
| Value Dimension | Description |
|---|---|
| Diffusion Bonded | Monolithic structure — no braze filler, no leak paths |
| High Power Density | 500 W cooling within 78.2 × 48.6 × 12.1 mm |
| Corrosion Resistant | Nickel plating compatible with water-glycol coolants |
| Surface Optimized | Sand blast finish enhances TIM adhesion |
| Compact Integration | 12.1 mm ultra-thin profile fits the tightest switch chassis clearances |
| Proven Silicon Compatibility | Designed specifically for Broadcom Tomahawk 5 thermal requirements |
Greatminds Thermal Technology offers OEM customization for cold plates based on the CP003 platform:
Chip compatibility — Adaptation for other high-power switch ASICs (Tomahawk series, Jericho series, or custom silicon)
Dimension customization — Cold plate footprint and thickness adjusted to specific PCB layouts and chassis constraints
Thermal performance tuning — Internal channel geometry, flow path, and fin density optimized for target thermal resistance and pressure drop requirements
Surface treatment options — Alternative plating materials, anodizing, or passivation based on coolant chemistry and environmental requirements
Manifold and fitting integration — Custom inlet/outlet configurations with standard or proprietary connector options
Contact our engineering team to discuss your high-power switch chip cooling requirements. Greatminds Thermal Technology — Precision Liquid Cooling for Next-Generation Network Silicon.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
