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CP002
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Application Scenario: Thermal management for next-generation, high-density data center servers.
Core Challenge: As computational density within standard rack units continues to increase, the physical footprint of thermal solutions becomes a critical bottleneck. Traditional air-cooled heatsinks often force designers to compromise between thermal performance and server chassis thickness.
Our Solution: The CP002 Liquid Cold Plate is engineered specifically to break this limitation. Featuring an innovative micro-channel and optimized flow path design, it efficiently conducts the high heat flux generated by AMD EPYC processors into the liquid cooling loop, significantly reducing dependency on internal chassis airflow and heatsink height. This enables our customers—server OEMs and ODMs—to develop thinner, more compact 1U servers without sacrificing thermal headroom or reliability.
Enable Ultra-Compact Server Form Factors: Directly facilitates the design of thinner 1U high-density servers, maximizing compute density and energy efficiency per rack.
Superior Thermal Performance for AMD EPYC Platforms: Specifically optimized for the heat flux profile of AMD EPYC processors (especially the 7004/8004 series), ensuring efficient heat extraction and sustained full-load operational stability.
Design Flexibility & System Integration: We provide B2B liquid cooling engineering services. Cold plate dimensions, port locations, and tubing layouts can be deeply customized to your specific motherboard and chassis architecture, positioning us as a key innovation partner in your mechanical and thermal design process.
Reliability for Mass Production: Adheres strictly to Design for Manufacturability principles, ensuring consistent performance and high quality in large-scale production, making us your reliable dedicated liquid cooling component supplier.
| Comparison Dimension | CP002 Liquid Cold Plate | High-End 1U Server Air Cooling | Advantage with CP002 |
|---|---|---|---|
| Cooling Capacity in 1U Space | 400W+ | 180-220W | Cooling capacity increased by >80%, supports higher TDP processors |
| Requirement for Internal Chassis Airflow | Very Low | Very High, requires strong airflow & clear path | Reduces fan speed & power consumption, improves system energy efficiency |
| Noise Level | < 35 dB(A) | 55-65 dB(A) | Creates a quiet data center environment |
| Restriction on Server Layout | Small, mainly influenced by tubing layout | Large, requires space for large airflow channels | Provides greater freedom for motherboard component layout |
| Maintenance & Reliability | No moving parts in contact with CPU, simple maintenance | Fans have wear and failure risk | Reduces operational costs, increases system MTBF |
Focus on High Heat Flux Challenges: We specialize in solving extreme heat flux problems from CPUs/GPUs; CP002 embodies this core expertise.
Deep ODM Collaboration Experience: We understand the design processes and quality control requirements of server ODMs, enabling seamless integration into your development cycle.
Full-Stack Capability from Design to Mass Production: We offer not just products, but a complete service package including thermal simulation, reliability validation, and supply chain management.
Customer-Centric Customizability: We view every project as a partnership, committed to delivering solutions that best fit your specific needs.
Contact our thermal engineering team today to explore how the CP002 Liquid Cold Plate can be integrated into your next-generation high-density server design.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
Application Scenario: Thermal management for next-generation, high-density data center servers.
Core Challenge: As computational density within standard rack units continues to increase, the physical footprint of thermal solutions becomes a critical bottleneck. Traditional air-cooled heatsinks often force designers to compromise between thermal performance and server chassis thickness.
Our Solution: The CP002 Liquid Cold Plate is engineered specifically to break this limitation. Featuring an innovative micro-channel and optimized flow path design, it efficiently conducts the high heat flux generated by AMD EPYC processors into the liquid cooling loop, significantly reducing dependency on internal chassis airflow and heatsink height. This enables our customers—server OEMs and ODMs—to develop thinner, more compact 1U servers without sacrificing thermal headroom or reliability.
Enable Ultra-Compact Server Form Factors: Directly facilitates the design of thinner 1U high-density servers, maximizing compute density and energy efficiency per rack.
Superior Thermal Performance for AMD EPYC Platforms: Specifically optimized for the heat flux profile of AMD EPYC processors (especially the 7004/8004 series), ensuring efficient heat extraction and sustained full-load operational stability.
Design Flexibility & System Integration: We provide B2B liquid cooling engineering services. Cold plate dimensions, port locations, and tubing layouts can be deeply customized to your specific motherboard and chassis architecture, positioning us as a key innovation partner in your mechanical and thermal design process.
Reliability for Mass Production: Adheres strictly to Design for Manufacturability principles, ensuring consistent performance and high quality in large-scale production, making us your reliable dedicated liquid cooling component supplier.
| Comparison Dimension | CP002 Liquid Cold Plate | High-End 1U Server Air Cooling | Advantage with CP002 |
|---|---|---|---|
| Cooling Capacity in 1U Space | 400W+ | 180-220W | Cooling capacity increased by >80%, supports higher TDP processors |
| Requirement for Internal Chassis Airflow | Very Low | Very High, requires strong airflow & clear path | Reduces fan speed & power consumption, improves system energy efficiency |
| Noise Level | < 35 dB(A) | 55-65 dB(A) | Creates a quiet data center environment |
| Restriction on Server Layout | Small, mainly influenced by tubing layout | Large, requires space for large airflow channels | Provides greater freedom for motherboard component layout |
| Maintenance & Reliability | No moving parts in contact with CPU, simple maintenance | Fans have wear and failure risk | Reduces operational costs, increases system MTBF |
Focus on High Heat Flux Challenges: We specialize in solving extreme heat flux problems from CPUs/GPUs; CP002 embodies this core expertise.
Deep ODM Collaboration Experience: We understand the design processes and quality control requirements of server ODMs, enabling seamless integration into your development cycle.
Full-Stack Capability from Design to Mass Production: We offer not just products, but a complete service package including thermal simulation, reliability validation, and supply chain management.
Customer-Centric Customizability: We view every project as a partnership, committed to delivering solutions that best fit your specific needs.
Contact our thermal engineering team today to explore how the CP002 Liquid Cold Plate can be integrated into your next-generation high-density server design.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
