 |
CP003
| Quantity: | |
|---|---|
As data centers and edge computing demand ever-increasing power density and spatial efficiency from network equipment, integrating multiple high-performance switch chips within standard 1U/2U racks has become the norm. The Tomahawk 5 chip's high thermal design power (TDP) of 500W presents a severe heat flux density challenge within the confines of a compact switch chassis. Traditional air cooling or small heatsinks are inadequate, while conventional liquid cooling solutions struggle with integration due to size limitations.
CP003 solves this core contradiction: How to provide sustained, stable, and efficient heat extraction for a 500W-class heat source under extreme spatial constraints.
Ultimate Space Utilization: Employs a multi-layer microchannel flow path design and an ultra-thin cavity structure, maximizing the heat exchange area within a millimeter-scale thickness. Perfectly adapts to the PCB layout of compact switches.
Optimized for Tomahawk 5: The heat source contact surface is precisely matched to the Tomahawk 5 chip's dimensions and heat distribution, ensuring heat is rapidly captured and uniformly spread across the entire cold plate.
High-Efficiency Liquid Cooling Performance: The optimized flow path hydraulic design ensures a high convective heat transfer coefficient while maintaining low flow resistance, guaranteeing the chip junction temperature is strictly controlled within safe limits under a 500W thermal load.
Reliability & Compatibility: Utilizes high-reliability sealing processes and is compatible with common data center coolants. The structural design balances mechanical strength with lightweight requirements, meeting the vibration and reliability test standards for network equipment.
Unlocks Design Freedom: Enables customers to design switches with higher port density or greater processing power within the same space, or achieve a smaller device footprint for equivalent performance.
Ensures System Stability: Eliminates risks associated with insufficient cooling, such as chip throttling, performance fluctuations, or premature failure, enhancing long-term product operational reliability.
Accelerates Time-to-Market: Provides a ready-to-use, validated cooling solution based on simulation and testing, significantly shortening the customer's thermal design verification cycle.
Optimizes Total Cost of Ownership : Efficient cooling may reduce system requirements for air conditioning and lower operational costs due to higher reliability.
Product Model: Liquid Cold Plate CP003
Target Thermal Load: Supports up to 500W continuous heat dissipation (based on typical Tomahawk 5 chip operating conditions)
Core Process: Precision Brazing / Friction Stir Welding sealing process
Primary Material: Copper alloy or aluminum alloy (options available)
Interface Standards: Supports common liquid cooling interfaces (e.g., G1/4, quick-disconnect connectors), customizable.
Customization Service: Supports full-custom design based on customer's PCB dimensions, chip layout, chassis airflow, and mounting requirements.
Full-Process Support: Provides complete engineering services from thermal simulation analysis (CFD), rapid prototyping, performance testing to mass production introduction (NPI).
Our thermal design experts possess deep knowledge of the cooling challenges in high-performance network equipment and have successfully assisted customers with CP003.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
