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CP001
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Target Platform: Intel Eagle Stream Architecture (1U Rack Servers)
Core Problem: As Intel Xeon Scalable processors push performance boundaries within compact 1U form factors, traditional air cooling reaches its physical and thermal limits. The resulting extremely high heat flux density creates hotspots that throttle performance, reduce reliability, and increase operational costs.
The CP001 Liquid Cold Plate represents the future of thermal management for high-density servers. Utilizing advanced micro-channel and flow optimization technology, this custom liquid cooling solution for Eagle Stream platforms directly addresses the thermal bottleneck, enabling sustained maximum processor performance without compromising server density or reliability.
Direct Contact Optimization: Specifically designed for Intel Xeon processor IHS (Integrated Heat Spreader) topology and heat flux distribution patterns
Ultra-Low Thermal Resistance: Advanced interface materials and micro-channel design achieve thermal resistance as low as 0.10°C/W
Pressure-Optimized Mounting: Engineered mounting mechanisms ensure optimal contact pressure for maximum heat transfer efficiency
350W+ Continuous Cooling Capacity: Designed to handle peak thermal loads of next-generation Intel processors
Temperature Uniformity: Advanced flow distribution ensures surface temperature variations under 3°C across the entire CPU
Transient Load Performance: Rapid response to sudden processor power spikes prevents thermal throttling
1U Form Factor Compliance: Engineered specifically for standard 1U server chassis (44.45mm height)
Standardized Connections: G1/4" quick-disconnect fittings compatible with industry-standard liquid cooling infrastructure
Simplified Installation: Tool-less or minimal-tool installation designed for manufacturing efficiency
| Solution Aspect | CP001-2 Liquid Cooling | High-End Air Cooling | Alternative Liquid Solutions |
|---|---|---|---|
| Thermal Performance | 0.10-0.15 °C/W | 0.25-0.40 °C/W | 0.18-0.25 °C/W |
| Acoustic Footprint | < 35 dB(A) | 55-70 dB(A) | 40-50 dB(A) |
| Form Factor Impact | Minimal Height | Large HSF Assembly | Moderate Height |
| Energy Efficiency | Reduces System PUE | Increases System PUE | Moderately Reduces PUE |
| Reliability | No Moving Parts at CPU | Fan Failure Risk | Pump Dependency |
| Server Density | Maximum Compute/Rack | Limited by Airflow | Improved over Air |
| Total Cost of Ownership | Optimized 3-Year ROI | Lower Capex, Higher Opex | Balanced Capex/Opex |
Intel Platform Expertise: Specialized knowledge of Intel processor thermal characteristics and requirements
Volume Manufacturing Capability: Proven capacity for high-volume production with consistent quality
End-to-End Support: Comprehensive services from initial concept through volume production
Proven Server Industry Experience: Successful deployments with leading server OEMs and ODMs
Ready to optimize your Intel Eagle Stream server designs with advanced liquid cooling technology?
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
Target Platform: Intel Eagle Stream Architecture (1U Rack Servers)
Core Problem: As Intel Xeon Scalable processors push performance boundaries within compact 1U form factors, traditional air cooling reaches its physical and thermal limits. The resulting extremely high heat flux density creates hotspots that throttle performance, reduce reliability, and increase operational costs.
The CP001 Liquid Cold Plate represents the future of thermal management for high-density servers. Utilizing advanced micro-channel and flow optimization technology, this custom liquid cooling solution for Eagle Stream platforms directly addresses the thermal bottleneck, enabling sustained maximum processor performance without compromising server density or reliability.
Direct Contact Optimization: Specifically designed for Intel Xeon processor IHS (Integrated Heat Spreader) topology and heat flux distribution patterns
Ultra-Low Thermal Resistance: Advanced interface materials and micro-channel design achieve thermal resistance as low as 0.10°C/W
Pressure-Optimized Mounting: Engineered mounting mechanisms ensure optimal contact pressure for maximum heat transfer efficiency
350W+ Continuous Cooling Capacity: Designed to handle peak thermal loads of next-generation Intel processors
Temperature Uniformity: Advanced flow distribution ensures surface temperature variations under 3°C across the entire CPU
Transient Load Performance: Rapid response to sudden processor power spikes prevents thermal throttling
1U Form Factor Compliance: Engineered specifically for standard 1U server chassis (44.45mm height)
Standardized Connections: G1/4" quick-disconnect fittings compatible with industry-standard liquid cooling infrastructure
Simplified Installation: Tool-less or minimal-tool installation designed for manufacturing efficiency
| Solution Aspect | CP001-2 Liquid Cooling | High-End Air Cooling | Alternative Liquid Solutions |
|---|---|---|---|
| Thermal Performance | 0.10-0.15 °C/W | 0.25-0.40 °C/W | 0.18-0.25 °C/W |
| Acoustic Footprint | < 35 dB(A) | 55-70 dB(A) | 40-50 dB(A) |
| Form Factor Impact | Minimal Height | Large HSF Assembly | Moderate Height |
| Energy Efficiency | Reduces System PUE | Increases System PUE | Moderately Reduces PUE |
| Reliability | No Moving Parts at CPU | Fan Failure Risk | Pump Dependency |
| Server Density | Maximum Compute/Rack | Limited by Airflow | Improved over Air |
| Total Cost of Ownership | Optimized 3-Year ROI | Lower Capex, Higher Opex | Balanced Capex/Opex |
Intel Platform Expertise: Specialized knowledge of Intel processor thermal characteristics and requirements
Volume Manufacturing Capability: Proven capacity for high-volume production with consistent quality
End-to-End Support: Comprehensive services from initial concept through volume production
Proven Server Industry Experience: Successful deployments with leading server OEMs and ODMs
Ready to optimize your Intel Eagle Stream server designs with advanced liquid cooling technology?
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
