TVC003 3D Vapor Chamber Heatsink for Intel Birch Stream 2U Servers

Product Overview: High-Density Thermal Management Solution for Next-Generation Intel Platforms

TVC003 is a high-performance 2U server heatsink specifically designed for the Intel Birch Stream platform. Utilizing an innovative flattened-tube 3D vapor chamber core technology, it achieves exceptional 500W cooling capacity within the standard 2U rack constraints. This product incorporates zipper fin and extrusion process composite technology, combined with professional nickel plating surface treatment. With precise dimensions of 126.8×97.8×65.5mm, it perfectly adapts to the Intel LGA 7529 socket, providing efficient and reliable thermal management for the Intel Xeon 6 processor family. As an OEM custom heatsink supplier for Intel server platform manufacturers, we deliver a complete thermal solution featuring low airflow resistance, high density, and 500W TDP support, achieving optimized airflow design and significantly enhancing data center server deployment overall energy efficiency.

Core Technology: Integration of Flattened-Tube 3DVC and Multiple Technologies

1. Flattened-Tube 3D Vapor Chamber Core Structure

• Significant Airflow Resistance Optimization: The unique flattened-tube 3D vapor chamber core design reduces system airflow resistance by over 35% compared to traditional solutions, enabling low airflow resistance cooling.

• Three-Dimensional Efficient Heat Spreading Mechanism: Specifically optimized for the heat source characteristics of Intel Birch Stream platform processors, achieving balanced heat conduction in three-dimensional space.

• 500W Continuous Cooling Validation: Rigorously tested and verified to stably support 500W TDP processors at full load within 2U height constraints.

2. Zipper Fin and Extrusion Process Collaborative Design

• High-Density Cooling Surface: Combining zipper fin and extrusion process technology to achieve ultra-high fin density exceeding 125 fins per inch.

• Structural Strength and Thermal Contact Optimization: Precision extrusion molding ensures zero-gap contact between fin roots and the vapor chamber base.

• Scientific Airflow Path Design: The composite structure provides optimized airflow design, enhancing overall heat exchange efficiency.

3. Professional Nickel Plating Treatment Process

• Durable Nickel Plating Treatment: Utilizing 5-10μm uniform nickel plating surface treatment to ensure long-term operational reliability and stability.

• Corrosion Resistance and Thermal Performance Balance: Effectively resists data center environmental corrosion while maintaining excellent thermal interface performance.

• Professional Appearance Quality: Mirror plating enhances product professional image and facilitates maintenance.

Customer Value and Application Scenarios

Core Value for Server Manufacturers

1. Performance and Technical Advantages

• Comprehensive 500W TDP Support: Provides ample cooling headroom for the Intel Xeon 6 processor family.

• Reduce Data Center PUE: Optimized airflow design reduces system cooling power consumption by 18-25%.

• Increase Rack Density: Supports higher-performance configurations within 2U space, improving data center server deployment efficiency.

2. System Integration Advantages

• Precise Dimension Compatibility: 126.8×97.8×65.5mm dimensions perfectly match 2U chassis optimized design.

• Simplify Thermal Management Complexity: Provides comprehensively validated integrated solutions.

• Extend Equipment Lifespan: Stable thermal environment significantly enhances overall server reliability.

3. Commercial and Competitive Advantages

• Lower Total Cost of Ownership: Efficient cooling design enables rapid return on investment.

• Accelerate Product Time-to-Market: Mature cooling platform shortens system validation cycles.

• Establish Technological Differentiation: Advanced cooling technology becomes an important competitive advantage for products.

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