3D Vapor Chamber Heatsink TVC0010 Bent Design for Compact 1U/2U Switch Cooling
Product Description
Application & Problem Solved
Application Scenario：Thermal Management for Next-Generation, High-Density Ethernet Switches
Core Challenge：As network equipment evolves towards higher port density and performance within standardized rack units ， the height of the cooling solution becomes a critical bottleneck. Traditional heatsinks often force a trade-off between thermal performance and switch chassis thickness.
Our Solution：The 3D Vapor Chamber TVC0010 is specifically engineered to break this compromise. Its innovative bent 3DVC structure conducts heat from the high-power Broadcom Tomahawk 5 switch chip efficiently toward both sides, signantly reducing the required heatsink height. This enables our clients—OEM and ODM network hardware manufacturers—to develop slimmer, more compact switches without sacrificing thermal headroom or reliability.
Key Benefits & Value Proposition
Achieve Ultra-Compact Form Factors: Directly enables the design of thinner 1U and 2U top-of-rack (ToR) switches, maximizing port density per rack.
Superior Thermal Performance for Tomahawk 5: Optimized for the Broadcom Tomahawk 5 chip's thermal profile, ensuring efficient heat spreading and sustained high performance.
Design Freedom & Integration: The customizable bent structure offers flexibility for complex board layouts, serving as a key thermal innovation partner in your mechanical design process.
Manufacturing-Ready Reliability: Designed with DFM (Design for Manufacturability) principles, ensuring robust performance and consistent quality for volume production as your dedicated cooling component supplier.
Technical Specifications & Customization
Model: 3D Vapor Chamber TVC0010
Target Application:Broadcom Tomahawk 5-based Ethernet Switches, Routers
Key Technology: Bent 3D Vapor Chamber for Dual-Side Heat Spreading
Primary Advantage: Space-Saving Low-Profile Design
Customization: We provide B2B thermal engineering services for custom heatsink design. Dimensions, bend angles, and mounting interfaces can be adapted to your specific switch architecture.
Support: End-to-end thermal solution support from concept simulation to mass production delivery for OEM/ODM partners.
Ready to Shrink Your Switch Profile?
Contact our thermal engineering team today to discuss how the TVC00103D Vapor Chamber can integrate into your next-generation network hardware design. Request samples, detailed CAD models, or a customized thermal proposal.
FAQs
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |