3D Vapor Chamber Heatsink TVC007 Low Airflow Resistance Cooling for High Power 3U Switches

Application Scenario & Technological Breakthrough

• Application Scenario: High-Performance 3U Ethernet Switches Pursuing High Airflow and Low System Power Consumption.

• Traditional Challenge: Within the compact confines of a 3U-height switch, the airflow resistance (pressure drop) generated by the heatsink itself is a key factor limiting the system's cooling capacity. Traditional heatsinks, in pursuit of thermal conductivity, often employ dense or complex internal cavity structures, which significantly increase airflow resistance. This forces system fans to operate at higher speeds (leading to noise and power consumption) or results in higher chip temperatures at the same airflow rate.

• Our Breakthrough Solution: The 3D Vapor Chamber Heatsink TVC007 incorporates an innovative "flattened-tube 3DVC" core structure. This design optimizes both internal vapor flow channels and external aerodynamic shape, significantly reducing the resistance encountered by airflow passing through the cooling module while ensuring extremely high lateral thermal conductivity. It provides a thermal solution that achieves both "high thermal conductivity" and "low airflow resistance" for 3U switches equipped with high-performance chips like the Broadcom Tomahawk 5, helping network equipment manufacturers achieve better cooling performance and lower system PUE within limited thermal budgets (airflow/power).

Core Product Advantages

• Significantly Reduces System Air Pressure Drop: The streamlined flattened-tube design minimizes obstruction to system airflow, allowing for higher airflow at the same fan power, or enabling lower fan speed and noise for the same cooling demand.

• Maintains Excellent Thermal Conductivity: The phase-change heat transfer principle of the 3DVC is preserved, ensuring heat is rapidly and uniformly spread from the chip hotspot to the entire fin area, avoiding sacrificing conductive efficiency in pursuit of low resistance.

• Improves System Energy Efficiency and Reliability: By optimizing this key source of airflow resistance, it helps reduce the energy consumption of the entire system's thermal management and improves the cooling of other components due to better airflow distribution, enhancing long-term system reliability.

• Designed for High-Airflow Applications: An engineered solution developed specifically for high-power-density 3U equipment reliant on forced air cooling, meeting the dual stringent demands of data centers for efficiency and reliability.

Technical Specifications & Customization Services

• Product Model: 3D Vapor Chamber Heatsink TVC007

• Target Application: 3U Ethernet switches, converged gateway devices using high-performance chips like Broadcom Tomahawk 5

• Core Technology: Flattened-Tube Three-Dimensional Vapor Chamber (Flattened-Tube 3DVC) Structure

• Core Value: Breaks the traditional compromise where high thermal conductivity is inherently coupled with high airflow resistance, achieving system-level cooling efficiency optimization.

• Customization Capability: We can provide switch ODM/OEM manufacturers with custom development services based on the TVC007 flattened-tube technology, offering targeted optimization based on the customer's specific motherboard layout, duct dimensions, and airflow/pressure curves.

• Co-design and Validation: Provides Computational Fluid Dynamics (CFD) simulation analysis to predict and optimize the heatsink's performance within the complete system airflow path, offering one-stop engineering support from design to validation.

Optimize Your Switch Airflow Path, Unleash the Cooling Potential of Every Bit of Airflow

Is your 3U switch's overall cooling capacity limited by excessive heatsink airflow resistance? Our thermal design team can provide you with detailed airflow resistance vs. cooling performance curves for the TVC007. Contact us now to obtain a professional analysis report or apply for a sample for wind tunnel testing.

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