3D Vapor Chamber Heatsink TVC008 High-Density Cooling for 3U Tomahawk 5 Switches

Application Scenario & Technological Innovation

• Application Scenario: Thermal Design for High-Density 3U Form Factor Ethernet Switches.

• Technical Challenge: When integrating high-performance Broadcom Tomahawk 5 switch chips into standard 3U chassis, traditional standalone 3D Vapor Chambers (3DVC) often face issues of low space utilization and inability to fully exploit the limited vertical height. This leads to insufficient heat dissipation area or obstructed airflow, constraining the simultaneous improvement of port density and thermal performance in the system.

• Our Innovative Solution: The 3D Vapor Chamber Heatsink TVC008 employs a unique "3DVC + Skived-Fin" composite structure design. This design combines the efficient lateral heat-spreading capability of the 3DVC with the high-density, customizable fin array offered by skiving technology, effectively solving the space wastage problem of standalone 3DVCs. It maximizes the heat dissipation surface area and air-cooling contact efficiency within the strict 3U height limitation, providing a reliable thermal management solution for network equipment ODM/OEM manufacturers to achieve high-performance, high-density switch designs in compact spaces.

Core Product Advantages

• Achieve Ultimate Space Utilization in 3U Switches:The composite structure avoids the space wastage of traditional solutions, providing a larger effective cooling area within the same 3U space, helping customers increase port density and compute density per rack unit.

• Optimized for Tomahawk 5: Specifically designed for the heat flux density and layout of the Broadcom Tomahawk 5 chip, ensuring rapid heat extraction and uniform spreading from the chip.

• Enhanced Air-Cooling Efficiency: The carefully designed skived-fin layout works in synergy with the chassis airflow, significantly improving cooling efficiency and temperature uniformity under forced air conditions.

• Achieve Ultimate Space Utilization in 3U Switches : The structure offers good manufacturability, providing stability and cost controllability for mass production, making it an ideal choice for switch ODM partners.

Technical Specifications & Customization Services

• Product Model: 3D Vapor Chamber Heatsink TVC008

• Target Application: 3U Ethernet switches, Data Center TOR switches equipped with Broadcom Tomahawk 5 chips

• Core Technology: Composite cooling technology combining 3D Vapor Chamber and Skived Fin

• Core Value: Solves thermal bottlenecks in compact spaces, enhances system design freedom and performance ceiling

• Customization Capability: We can provide network equipment manufacturers with in-depth customization services based on TVC008 technology, adjusting the 3DVC size, skived-fin shape, and overall structure according to specific PCB layouts, heatsink height requirements, and airflow specifications.

• Full-Process Support: Offers one-stop technical services from thermal simulation analysis, sample prototyping, performance validation to mass production ramp-up, acting as your reliable thermal management technology partner in the product development process.

Call to Action 

Redefine Thermal Efficiency for 3U Switches 

Is your next-generation 3U switch design constrained by the balance between cooling and space? Our thermal design experts can provide a detailed technical evaluation of the TVC008 for you. Consult now to obtain 3D models, thermal performance data, or apply for a sample test.

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