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VC008
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Uniform Heat Distribution Mechanism: VC008 employs advanced phase-change heat transfer principles to rapidly spread hotspots generated by heat-concentrated communication chips across the entire cooling plane, eliminating localized overheating.
High Heat Flux Density Handling Capability: The internal wick structure is optimized specifically for the typical high heat flux density characteristics of communication chips, improving heat dissipation efficiency per unit area.
Rapid Thermal Response Characteristics: The phase-change working fluid responds quickly to chip temperature fluctuations, maintaining the temperature stability of the communication system.
Compact Size Compatibility: The 60×60×62.4mm compact size is specifically designed for the space-constrained interiors of telecom equipment.
Multi-Orientation Installation Compatibility: Provides flexible mounting hole patterns and fixing solutions to adapt to different telecom equipment manufacturers' design requirements.
Low Airflow Resistance Design: Optimizes heatsink profile and airflow paths to minimize impact on the telecom equipment's system airflow channels.
Long-Term Corrosion Protection: Professional passivation treatment effectively resists various environmental corrosion factors telecom equipment may encounter.
Stable Thermal Interface Performance: The surface treatment ensures no degradation in thermal interface performance during long-term use, guaranteeing sustained cooling efficiency.
Electrical Insulation Safety: Complies with telecom equipment electrical safety requirements, avoiding potential electrical risks from the heatsink.
Application Location: Baseband processing unit, RF unit key chip cooling
Cooling Requirements: High heat flux density, compact space, high reliability
VC008 Value: Uniform heat spreading prevents localized overheating, ensuring continuous stable operation of 5G equipment.
Application Location: Switch chip, processor cooling
Cooling Requirements: Multi-heat source management, limited ventilation conditions
VC008 Value: Efficient heat spreading improves system cooling efficiency, reduces equipment failure rates.
Application Location: Optical module, signal processing chip cooling
Cooling Requirements: Precise temperature control, long-term stable operation
VC008 Value: Stable thermal environment ensures optical communication performance consistency.
Enhances Equipment Reliability: Uniform cooling reduces chip thermal stress, extending critical component lifespan.
Optimizes System Energy Efficiency: Efficient cooling reduces equipment cooling demands, lowering overall energy consumption.
Strengthens Product Competitiveness: Advanced cooling technology becomes a key differentiator for telecom equipment.
Reduces Maintenance Costs: High reliability decreases field maintenance frequency and spare parts requirements.
Accelerates Product Certification: Complies with relevant telecom industry thermal management standards and regulations.
Improves Customer Satisfaction: Stable equipment performance enhances end-user experience.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
Uniform Heat Distribution Mechanism: VC008 employs advanced phase-change heat transfer principles to rapidly spread hotspots generated by heat-concentrated communication chips across the entire cooling plane, eliminating localized overheating.
High Heat Flux Density Handling Capability: The internal wick structure is optimized specifically for the typical high heat flux density characteristics of communication chips, improving heat dissipation efficiency per unit area.
Rapid Thermal Response Characteristics: The phase-change working fluid responds quickly to chip temperature fluctuations, maintaining the temperature stability of the communication system.
Compact Size Compatibility: The 60×60×62.4mm compact size is specifically designed for the space-constrained interiors of telecom equipment.
Multi-Orientation Installation Compatibility: Provides flexible mounting hole patterns and fixing solutions to adapt to different telecom equipment manufacturers' design requirements.
Low Airflow Resistance Design: Optimizes heatsink profile and airflow paths to minimize impact on the telecom equipment's system airflow channels.
Long-Term Corrosion Protection: Professional passivation treatment effectively resists various environmental corrosion factors telecom equipment may encounter.
Stable Thermal Interface Performance: The surface treatment ensures no degradation in thermal interface performance during long-term use, guaranteeing sustained cooling efficiency.
Electrical Insulation Safety: Complies with telecom equipment electrical safety requirements, avoiding potential electrical risks from the heatsink.
Application Location: Baseband processing unit, RF unit key chip cooling
Cooling Requirements: High heat flux density, compact space, high reliability
VC008 Value: Uniform heat spreading prevents localized overheating, ensuring continuous stable operation of 5G equipment.
Application Location: Switch chip, processor cooling
Cooling Requirements: Multi-heat source management, limited ventilation conditions
VC008 Value: Efficient heat spreading improves system cooling efficiency, reduces equipment failure rates.
Application Location: Optical module, signal processing chip cooling
Cooling Requirements: Precise temperature control, long-term stable operation
VC008 Value: Stable thermal environment ensures optical communication performance consistency.
Enhances Equipment Reliability: Uniform cooling reduces chip thermal stress, extending critical component lifespan.
Optimizes System Energy Efficiency: Efficient cooling reduces equipment cooling demands, lowering overall energy consumption.
Strengthens Product Competitiveness: Advanced cooling technology becomes a key differentiator for telecom equipment.
Reduces Maintenance Costs: High reliability decreases field maintenance frequency and spare parts requirements.
Accelerates Product Certification: Complies with relevant telecom industry thermal management standards and regulations.
Improves Customer Satisfaction: Stable equipment performance enhances end-user experience.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
