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VC005
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Challenge: Dense arrangement of PA chips in Massive MIMO architecture, traditional cooling solutions struggle to meet uniform heat dissipation needs.
Solution: The 240×180mm large area of VC005 can cover multiple PA chips, reducing local hotspot temperature by 15-25°C.
Challenge: Baseband processor power continuously rising (200W+), increased chip size leads to uneven heat flux density.
Solution: Vapor chamber technology achieves chip surface temperature delta < 10°C, ensuring stable full-core operation.
Challenge: Heat concentration in 51.2T+ switching chips, SerDes channel temperature directly affects signal integrity.
Solution: Large-area heat spreading capability prevents temperature differences between channels, ensuring high-speed signal transmission quality.
Performance Guarantee: Ensures stable chip operation at full power, avoiding thermal throttling.
Design Simplification: Single component replaces complex cooling systems, reduces part count by >30%.
Enhanced Reliability: NEBS Level 3 certified, meets stringent operator requirements.
Energy Consumption Reduction: Improved cooling efficiency reduces fan power, improves PUE by 0.05-0.1.
Maintenance Cost: Maintenance-free design, expected lifespan > 10 years (25°C environment).
Investment Protection: Provides thermal headroom for future chip upgrades.
Fast Delivery: Standard product delivery in 30 days, custom designs in 60-90 days.
Technical Support: Provides thermal simulation models, integration guidance, and test validation.
Quality Assurance: Material certification reports and performance test data provided for each batch.
Scenario Characteristics: Massive antenna arrays lead to ultra-high integration density; power amplifiers and baseband chips exhibit extremely high power density (often 200-400W), cooling space is extremely limited, requiring ultimate temperature uniformity.
VC005 Value: The industry-leading 240×180mm area can fully cover and integrate multiple high-power chips, the extreme 4mm thickness perfectly fits the ultra-slim AAU design, and the top-tier uniform cooling capability ensures all channels maintain linear performance even under high temperatures.
Scenario Characteristics: 51.2Tbps and above switching chips are extremely large and high-power, with a massive number of internal SerDes channels. Temperature unevenness from traditional cooling directly impacts signal integrity, limiting the system's switching capacity.
VC005 Value: The ultra-large thermal equalization capability can thoroughly homogenize the heat from thousands of high-speed SerDes channels densely packed on the chip, eliminating any local hotspots, ensuring all channels operate at optimal temperatures, guaranteeing the stable release of the system's ultimate switching performance.
Scenario Characteristics: Telecom servers for edge AI and NFV feature CPUs and AI accelerator cards with power consumption breaking conventional limits. Multi-chip cooperation creates compounded thermal effects, presenting significant challenges for thermal design.
VC005 Value: As an ultra-large-size integrated thermal equalization spreader, it can be directly attached to the CPU or serve as a thermal equalization base for the entire compute unit, combined with top-side efficient air or liquid cooling, elevating the performance ceiling of a single cooling module to new heights.
Unlocks Future Chip Performance Potential: Provides forward-looking solutions matching the cooling needs of ultra-high-power communication chips in the next 3-5 years, significantly shortening high-end product R&D cycles.
Greatly Enhances System Design Freedom: Ultimate temperature uniformity allows PCB layout with minimal consideration for "thermal radiation" from high-heat chips, unleashing the full potential of hardware design.
Revolutionarily Improves System Reliability Prediction Accuracy: Unparalleled thermal interface stability and cooling performance lead to unprecedented accuracy in equipment MTBF (Mean Time Between Failures) predictions.
Completely Mitigates Overheating/Throttling and Downtime Risk: Ensures core telecom equipment operates stably 7x24 at its rated extreme power and performance, 100% delivering on top-tier product performance promises.
Significantly Reduces BOM Complexity and Total Cost of Ownership (TCO): A single VC005 can replace an entire complex traditional cooling system, significantly simplifying supply chain management and reducing overall cooling costs.
Accelerates High-End Product Market Entry & Certification: Provides a complete certification package for a cooling component meeting the most stringent telecom equipment environmental reliability standards (e.g., NEBS Level 3, ETSI), strongly propelling products through global top-tier operator certifications.
Significantly Improves Core Network Equipment Energy Efficiency: Extremely efficient cooling significantly reduces over-reliance on precision air conditioning in data centers. making a direct contribution to the continuous optimization of core data center PUE.
Absolutely Ensures Core Network Service Quality and SLA: Reduces the risk of unplanned outages caused by overheating to a minimum, achieving telecom-grade peak standards for network core layer availability and stability.
Powerfully Supports Network Smooth Evolution & Investment Protection: Provides ample thermal headroom for future seamless upgrades to higher-performance chips within existing core equipment platforms, maximizing the long-term investment value of infrastructure.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
Challenge: Dense arrangement of PA chips in Massive MIMO architecture, traditional cooling solutions struggle to meet uniform heat dissipation needs.
Solution: The 240×180mm large area of VC005 can cover multiple PA chips, reducing local hotspot temperature by 15-25°C.
Challenge: Baseband processor power continuously rising (200W+), increased chip size leads to uneven heat flux density.
Solution: Vapor chamber technology achieves chip surface temperature delta < 10°C, ensuring stable full-core operation.
Challenge: Heat concentration in 51.2T+ switching chips, SerDes channel temperature directly affects signal integrity.
Solution: Large-area heat spreading capability prevents temperature differences between channels, ensuring high-speed signal transmission quality.
Performance Guarantee: Ensures stable chip operation at full power, avoiding thermal throttling.
Design Simplification: Single component replaces complex cooling systems, reduces part count by >30%.
Enhanced Reliability: NEBS Level 3 certified, meets stringent operator requirements.
Energy Consumption Reduction: Improved cooling efficiency reduces fan power, improves PUE by 0.05-0.1.
Maintenance Cost: Maintenance-free design, expected lifespan > 10 years (25°C environment).
Investment Protection: Provides thermal headroom for future chip upgrades.
Fast Delivery: Standard product delivery in 30 days, custom designs in 60-90 days.
Technical Support: Provides thermal simulation models, integration guidance, and test validation.
Quality Assurance: Material certification reports and performance test data provided for each batch.
Scenario Characteristics: Massive antenna arrays lead to ultra-high integration density; power amplifiers and baseband chips exhibit extremely high power density (often 200-400W), cooling space is extremely limited, requiring ultimate temperature uniformity.
VC005 Value: The industry-leading 240×180mm area can fully cover and integrate multiple high-power chips, the extreme 4mm thickness perfectly fits the ultra-slim AAU design, and the top-tier uniform cooling capability ensures all channels maintain linear performance even under high temperatures.
Scenario Characteristics: 51.2Tbps and above switching chips are extremely large and high-power, with a massive number of internal SerDes channels. Temperature unevenness from traditional cooling directly impacts signal integrity, limiting the system's switching capacity.
VC005 Value: The ultra-large thermal equalization capability can thoroughly homogenize the heat from thousands of high-speed SerDes channels densely packed on the chip, eliminating any local hotspots, ensuring all channels operate at optimal temperatures, guaranteeing the stable release of the system's ultimate switching performance.
Scenario Characteristics: Telecom servers for edge AI and NFV feature CPUs and AI accelerator cards with power consumption breaking conventional limits. Multi-chip cooperation creates compounded thermal effects, presenting significant challenges for thermal design.
VC005 Value: As an ultra-large-size integrated thermal equalization spreader, it can be directly attached to the CPU or serve as a thermal equalization base for the entire compute unit, combined with top-side efficient air or liquid cooling, elevating the performance ceiling of a single cooling module to new heights.
Unlocks Future Chip Performance Potential: Provides forward-looking solutions matching the cooling needs of ultra-high-power communication chips in the next 3-5 years, significantly shortening high-end product R&D cycles.
Greatly Enhances System Design Freedom: Ultimate temperature uniformity allows PCB layout with minimal consideration for "thermal radiation" from high-heat chips, unleashing the full potential of hardware design.
Revolutionarily Improves System Reliability Prediction Accuracy: Unparalleled thermal interface stability and cooling performance lead to unprecedented accuracy in equipment MTBF (Mean Time Between Failures) predictions.
Completely Mitigates Overheating/Throttling and Downtime Risk: Ensures core telecom equipment operates stably 7x24 at its rated extreme power and performance, 100% delivering on top-tier product performance promises.
Significantly Reduces BOM Complexity and Total Cost of Ownership (TCO): A single VC005 can replace an entire complex traditional cooling system, significantly simplifying supply chain management and reducing overall cooling costs.
Accelerates High-End Product Market Entry & Certification: Provides a complete certification package for a cooling component meeting the most stringent telecom equipment environmental reliability standards (e.g., NEBS Level 3, ETSI), strongly propelling products through global top-tier operator certifications.
Significantly Improves Core Network Equipment Energy Efficiency: Extremely efficient cooling significantly reduces over-reliance on precision air conditioning in data centers. making a direct contribution to the continuous optimization of core data center PUE.
Absolutely Ensures Core Network Service Quality and SLA: Reduces the risk of unplanned outages caused by overheating to a minimum, achieving telecom-grade peak standards for network core layer availability and stability.
Powerfully Supports Network Smooth Evolution & Investment Protection: Provides ample thermal headroom for future seamless upgrades to higher-performance chips within existing core equipment platforms, maximizing the long-term investment value of infrastructure.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
