VC006 Large Area Vapor Chamber Heatsink for High Power Telecom Chips

Core Technology: Large-Area Uniform Heat Spreading and High-Reliability Design

1. Large-Area Vapor Chamber Structure Design

• Extra-Large Effective Cooling Area: An optimized cooling area of 112×112mm (approx. 125 sq cm) designed specifically to cover large-format packaged communication chips or multi-chip modules, providing ample space for heat diffusion.

• Balance of Extreme Thinness and High Performance: While maintaining a total thickness of only 4mm, internal structural integrity and temperature uniformity across the large area are ensured through optimized cavity design and support structures.

• Layout Optimized for Large Heat Sources: The internal wick structure and vapor channels are designed based on common heat source distributions in large chips, ensuring rapid heat conduction from the center to the edges.

2. Efficient and Uniform Heat Diffusion Technology

• Eliminates "Hotspots" in Large Chips: Addresses concentrated heat in the central region of large chips by optimizing vapor flow paths, enabling efficient heat transfer to the peripheral edges, significantly reducing the temperature delta (ΔT) between the chip's center and edges.

• Supports Multiple Heat Sources and Chip Arrays: The large-area design effectively covers multiple adjacent chips or chip arrays, consolidating and uniformly spreading heat from multiple sources, simplifying system-level thermal design.

• Rapid Thermal Response and High Heat Capacity: The large internal working fluid capacity and phase-change surface area allow quick absorption of transient power spikes, providing thermal buffering for telecom equipment handling burst traffic.

3. Professional Passivation Surface Treatment Process

• Long-Term Protection for Harsh Telecom Environments: Passivation treatment forms a dense protective layer on the copper substrate, significantly enhancing resistance to moisture, salt spray, and atmospheric corrosion, making it suitable for outdoor base stations and industrial environments.

• Stable and Reliable Thermal Interface: The treated surface offers excellent flatness and chemical stability, ensuring stable thermal resistance at the interface with the chip or thermal interface material (TIM) over time, preventing performance degradation.

• Mature Process, Consistent Quality: Employs a mature and controlled passivation process, ensuring every VC006 unit possesses consistent and reliable surface characteristics.

Target Application Scenarios and Value Proposition

Key Application Scenario Analysis

1. 5G Core Network Equipment (CU/DU) Main Processor Cooling

• Scenario Characteristics: Core network processors exhibit high power (often 150-300W), large chip size, and stringent temperature uniformity requirements to sustain high computing performance.

• VC006 Value: The 112×112mm area can fully cover mainstream large-format packages, 4mm thickness fits compact chassis designs, and uniform heat spreading ensures efficient full-core operation of the processor.

2. High-End Router/Switch Switching Chip Cooling

• Scenario Characteristics: High-speed switching chips (e.g., 51.2T and above) see simultaneous increases in size and power, challenging traditional cooling methods with high heat flux density.

• VC006 Value: The large-area thermal equalization capability can uniformly spread heat from multiple high-speed SerDes channels distributed across the chip, preventing performance degradation in individual channels due to local overheating, safeguarding the system's switching capacity.

3. Telecom Server CPU & Accelerator Card Cooling

• Scenario Characteristics: Telecom servers used for edge computing or NFV feature high-power CPUs and potentially integrated multiple accelerator cards, creating intense competition for cooling space.

• VC006 Value: Acting as a large-size heat spreader, it can be directly attached to the CPU or serve as a thermal equalization base, combined with top-side air or liquid cooling, significantly enhancing the performance ceiling of a single cooling module.

Multi-Layered Value for Customers

For R&D Teams (Technical Value)

• Unlocks High-Performance Chip Potential: Provides ready-to-use solutions matching the cooling needs of the latest high-power communication chips, shortening R&D cycles.

• Enhances Design Freedom: Excellent temperature uniformity allows relaxed placement restrictions for components around high-heat chips during PCB layout.

• Improves System Reliability Predictability: Stable thermal interface and cooling performance lead to more accurate MTBF (Mean Time Between Failures) predictions for equipment.

For Product & Project Management (Business Value)

• Mitigates Overheating/Throttling Risk: Ensures equipment operates stably at its rated full power and performance, delivering on advertised product specifications.

• Reduces BOM Complexity and Cost: A single VC006 can potentially replace multiple traditional cooling components, simplifying supply chain management.

• Accelerates Market Entry: Provides proof of a cooling component meeting stringent telecom equipment environmental reliability requirements (e.g., NEBS), aiding product certification by operators.

For End-Use Network Operators (Long-Term Value)

• Improves Network Equipment Energy Efficiency (Indirectly lowers PUE): Efficient cooling reduces over-reliance on data center cooling systems, lowering operational costs.

• Ensures Network Service Quality (SLA): Reduces software/hardware failure rates caused by overheating, improving network availability.

• Supports Smooth Upgrades: Provides thermal headroom for future upgrades to higher-performance chips within existing equipment, protecting infrastructure investment.

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