VC003 Vapor Chamber Heatsink for Broadcom Qumran 2C

Core Technology: Efficient Heat Conduction and Compact Structure Design

1. Innovative Zipper Fin Design

• Ultra-High-Density Cooling Area: Employs 0.15mm ultra-thin aluminum sheets in an interlocking zipper arrangement, achieving an effective cooling area exceeding 2800 cm² within a 26.3mm height, improving volumetric cooling efficiency by 45%.

• Optimized Aerodynamics: Fin orientation perfectly matches the standard front-to-back airflow path of data center switches, reducing airflow resistance by 25%, enabling the use of lower-power, longer-life fan systems.

• Enhanced Structural Stability: Innovative interlocking connection structure ensures the high-density fin array maintains structural stability during transportation and long-term operation, with MTBF exceeding 150,000 hours.

2. Large-Area Vapor Chamber Base

• Full-Coverage Heat Spreading: The 202×157mm large-area vapor chamber base fully covers the Qumran 2C chip and surrounding high-power components, eliminating local hotspots, controlling chip surface temperature delta (ΔT) to < 6°C.

• High-Strength Support Design: Employs a multi-point matrix support structure, ensuring baseplate deformation remains < 0.08mm under long-term high-load operation, maintaining a stable thermal interface.

• Rapid Thermal Response: Optimized working fluid ratio and capacity design quickly absorbs instantaneous power peaks during chip startup and load transients, providing excellent thermal buffering performance.

3. Nickel Plating Surface Treatment Process

• Data Center Environment Adaptability: Multi-layer electroplated nickel process forms an 8-10μm dense protective layer on the substrate surface, passing 96-hour salt spray tests, perfectly adapting to the temperature and humidity variations in data center environments.

• Stable Thermal Interface Performance: The treated surface flatness is < 0.05mm, with excellent chemical stability, ensuring stable thermal resistance at the chip interface over time, preventing performance degradation.

• Aesthetics and Durability Combined: The nickel-plated surface not only provides excellent corrosion protection but also gives the product a professional aesthetic quality, enhancing the overall product grade.

Target Application Scenarios and Value Proposition

Key Application Scenario Analysis

1. Data Center Spine/Leaf Switch Cooling

• Scenario Characteristics: Modern data center spine/leaf switches require high-density port configurations, with Qumran 2C chip power typically in the 150-250W range, and strict cooling space limitations.

• VC003 Value: 26.3mm ultra-low profile design enables efficient cooling within 1U chassis, supporting 48×25G or 16×100G high-density port configurations in switches, ensuring stable operation in high-temperature environments.

2. Enterprise Core Network Switch

• Scenario Characteristics: Enterprise network core equipment requires low noise and high reliability, often deployed in office environments with strict requirements for cooling solution noise control.

• VC003 Value: Optimized zipper fin design reduces airflow resistance by 25%, enabling the use of low-speed quiet fans, reducing system noise by 4-6 dBA, while ensuring long-term stable equipment operation.

3. Cloud Computing & Virtualization Platform Access Switch

• Scenario Characteristics: Switches in cloud computing environments need to adapt to load fluctuations caused by dynamic VM migration; cooling solutions require good transient thermal response capabilities.

• VC003 Value: Vapor chamber's rapid thermal response characteristic effectively buffers instantaneous heat from load transients, preventing drastic chip temperature fluctuations, improving system stability by over 30%.

Multi-Layered Value for Customers

For R&D Teams (Technical Value)

• Simplifies Thermal Design Process: Provides a comprehensively validated thermal solution, significantly shortening the thermal design verification cycle for switch products, accelerating time-to-market by 3-4 months.

• Increases Design Flexibility: Compact design provides more space for PCB layout, supporting more flexible signal routing and high-density component placement.

• Reduces R&D Risk: Adopts a mature and reliable thermal technology solution, avoiding product recall or field failure risks due to thermal issues.

For Product & Project Management (Business Value)

• Reduces Total Cost of Ownership: High-efficiency cooling solution lowers fan power consumption, saving approximately $80-120 per device annually, with significant benefits at large-scale deployment.

• Optimizes Supply Chain Management: A single component replaces a complex cooling system, reduces supplier count, simplifies procurement processes, improves supply chain stability.

• Enhances Product Competitiveness: Excellent cooling performance becomes a key product selling point, supporting commitments for wider operating temperature ranges in technical specifications.

For Data Center Operators (Long-Term Value)

• Improves Energy Efficiency Metrics: Reduces cooling system energy consumption, contributes to overall data center PUE optimization, supporting sustainability goals.

• Ensures Service Availability: High-reliability design reduces equipment failure rates, ensures network service SLA achievement, improves customer satisfaction.

• Extends Equipment Lifespan: Stable operating temperature extends chip and component service life, postpones equipment refresh cycles, protects infrastructure investment.

FAQs