VC002 Vapor Chamber Heatsink for QSFP-DD Modules

Core Technology: Ultra-Thin Cooling and Efficient Heat Diffusion Design

1. Ultra-Thin Vapor Chamber Structure Design

• Extreme Thinness: While maintaining a total thickness of only 11.4mm, innovative flat cavity design and micro support structures ensure a balance between structural strength and thermal performance of the vapor chamber in its ultra-thin form.

• Large-Area Heat Coverage: The 218×90mm (approx. 196 sq cm) cooling area is specifically optimized to cover multiple QSFP-DD optical modules (typically 4-8), providing ample space for heat diffusion.

• Multi-Heat Source Layout Optimization: Internal wick structure and vapor channels are designed based on the common heat source distribution of side-by-side multi-module arrangements, ensuring heat from each module is quickly and uniformly conducted to the cooling system.

2. Zipper Fin High-Efficiency Cooling Technology

• High-Density Cooling Area: Employs 0.12mm ultra-thin aluminum sheets in an interlocking zipper arrangement, achieving an effective cooling area exceeding 1800 cm² within the limited height, improving volumetric cooling efficiency by 50%.

• Optimized Vertical Airflow Path: Fin orientation perfectly matches the equipment's vertical cooling airflow path, reducing airflow resistance by 30%, making it especially suitable for optical communication equipment with front-to-back or top-to-bottom ventilation.

• Integrated Structure: Fins and vapor chamber are integrated via ultrasonic welding, reducing thermal resistance by 40% and avoiding performance degradation associated with traditional riveting or adhesive bonding.

3. Nickel Plating Surface Treatment Process

• Adaptability to Optical Communication Equipment Environments: Multi-layer electroplated nickel process forms a 6-8μm dense protective layer on the copper substrate, passing 48-hour salt spray tests, perfectly adapting to the temperature and humidity environment of telecom rooms.

• Stable Thermal Interface Performance: The treated surface flatness is < 0.03mm, roughness Ra < 0.8μm, ensuring stable thermal resistance at the interface with the optical module housing over time.

• Electromagnetic Compatibility (EMC) Optimization: The nickel-plated surface has good conductivity, helping to improve equipment EMC performance and reduce high-speed signal interference.

Target Application Scenarios and Value Proposition

Key Application Scenario Analysis

1. 400G/800G Optical Transmission Equipment Cooling

• Scenario Characteristics: Next-gen optical transmission equipment uses high-density QSFP-DD module configurations (typically 8-16), with small module spacing and concentrated heat, making traditional cooling solutions difficult to cover effectively.

• VC002 Value: 218mm ultra-long design can simultaneously cover 8 QSFP-DD modules, 11.4mm ultra-thin thickness enables dual-layer module stacking in 1U equipment, cooling efficiency improves by 50%, ensuring all modules operate stably in high-temperature environments.

2. Data Center Spine/Leaf Switch Optical Module Cooling

• Scenario Characteristics: High-speed data center switches deploy large numbers of QSFP-DD modules on both front and rear panels, with limited cooling space, requiring support for hot-swap operations.

• VC002 Value: Optimized ergonomic design ensures heatsink installation doesn't hinder module insertion/removal; nickel plating surface treatment reduces insertion/removal wear; high-efficiency cooling capability supports switch full-load operation at 45°C ambient temperature.

3. 5G Fronthaul/Midhaul Equipment Optical Module Cooling

• Scenario Characteristics: 5G base station equipment has extremely limited space, optical modules operate across a wide temperature range (-40°C to +70°C), requiring cooling solutions with excellent temperature adaptability.

• Space Efficiency: Ultra-thin compact design fits into the confined spaces of base station equipment.

• Thermal Responsiveness: Vapor chamber technology enables rapid thermal response, quickly balancing temperature differences between modules.

• Environmental Robustness: Nickel plating treatment ensures reliable performance under varying temperature and humidity conditions in outdoor base stations.

Multi-Layered Value for Customers

For R&D Teams (Technical Value)

• Breaks Space Limitations: Provides a ready-made solution to solve multi-module cooling challenges in extremely compact spaces, allowing hardware engineers to focus on core optical and circuit design.

• Simplifies Thermal Design Verification: Pre-validated cooling solution significantly shortens thermal simulation and testing cycles, reducing optical module cooling verification time by over 60%.

• Increases Design Flexibility: Ultra-thin design provides more possibilities for optical module layout, supporting higher-density module configurations, increasing single-device port capacity.

For Product & Project Management (Business Value)

• Reduces Material Cost: A single VC002 can replace 8 individual heatsinks + mounting brackets, reducing overall BOM cost by 25-30%, simplifying supply chain management.

• Improves Production Efficiency: Integrated design reduces production line installation time from 15-20 minutes to 3-5 minutes, improving production efficiency by 300%.

• Enhances Product Competitiveness: Excellent cooling performance supports commitments to wider operating temperature ranges and higher module deployment density in product promotion, creating a competitive market advantage.

For End Users & Operators (Long-Term Value)

• Reduces Operational & Maintenance Costs: Efficient cooling extends optical module lifespan, reduces module replacement frequency, saving O&M costs by 20-25%.

• Improves Network Reliability: Temperature uniformity ensures consistent performance across all modules, avoiding link speed reduction or interruption due to single module overheating, improving network availability.

• Supports Network Upgrades: Ample cooling headroom supports future upgrades to higher-power 800G or 1.6T optical modules, protecting equipment investment.

FAQs