Server

• 500W EPYC Air Cooling Achieved: A 3DVC Solution Replacing Liquid Cooling

  With AMD's 5th Gen EPYC processors surpassing the 500W Thermal Design Power , data centers face a critical choice: adopt complex liquid cooling systems with inherent leakage risks, or seek more reliable and cost-effective air-cooled alternatives. A leading global server manufacturer, while developing its next-generation high-performance computing platform, explicitly required achieving cooling performance comparable to liquid cooling through innovative air-cooling technology. This aimed to reduce Total Cost of Ownership and simplify operations for their end-customers, all while maintaining system stability.

  Server February 04, 2026
• 3D Vapor Chamber Cools 350W Xeon at 0.095°C/W

  Intel's 5th Gen Xeon Scalable Processors deliver powerful performance, but their sustained power of up to 350W on the Eagle Stream platform poses dual pressures on both thermal design and the Total Cost of Ownership for data center servers. A leading server manufacturer needed to find a thermal solution for its next-generation 1U/2U servers that not only met extreme cooling performance requirements but also offered excellent cost-effectiveness and manufacturability, all while ensuring long-term system reliability.

  Server January 30, 2026
• High-Density GPU Server Thermal Balancing Solution

  A server manufacturer faced significant thermal challenges while developing its next-generation high-density GPU computing platform. The design required integrating four NVIDIA A-Series high-power chips in a 2×2 array layout within a confined space, with each chip dissipating 500W. The client stipulated that the case temperature (Tcase) of each chip must remain below 80°C, and the temperature differential between the front and rear chip groups must be controlled within 3°C to ensure system stability and computational consistency under sustained high loads.

  Server January 08, 2026