HP008 Heat Pipe Heatsink for Broadcom Tomahawk 3

Core Technology: Remote Heat Conduction and Space Optimization Design

1. Ultra-Long Heat Pipe Technology Design

• Remote Heat Conduction Capability: Employs 432.8mm ultra-long high-performance heat pipes, increasing heat conduction distance by 300%, enabling efficient heat transfer from the chip to ventilation zones 1.5-2 meters away, achieving true remote cooling.

• Multi-Stage Heat Pipe Array: Configures eight Ø8mm high-performance heat pipes, arranged in symmetrical distribution, with heat conduction capacity exceeding 400W, meeting the full-power operation requirements of Tomahawk 3 chips.

• Anti-Gravity Optimization: Internal wick structure uses composite sintered + groove composite design, ensuring over 95% heat conduction efficiency whether installed vertically, horizontally, or at an angle.

2. Copper Fin High-Efficiency Cooling Design

• Large-Area Cooling Array: The 145mm high dense copper fin array provides over 5500 cm² of effective cooling area, with fin spacing of 2.5mm, optimizing airflow efficiency.

• Multi-Layer Welding Process: Fins and heat pipes are joined using high-temperature vacuum brazing technology, with weld strength exceeding 150 MPa, reducing thermal resistance by 60% compared to traditional mechanical connection solutions.

• Modular Layout: The fin array employs a segmented modular design, Allowing flexible adjustment of installation positions based on actual chassis airflow layout for optimal cooling performance..

3. Dual Surface Treatment Process

• Nickel Plating Corrosion Protection: Electroplated nickel layer thickness of 10-15μm, passing 96-hour neutral salt spray tests, providing excellent protection for high-humidity data center environments.

• Passivation Treatment Enhancement: Chromate passivation treatment is applied on top of the nickel plating, forming a dense oxide protective film, further improving corrosion and oxidation resistance.

• Long-Term Stability Guarantee: Dual treatment ensures stable product performance in harsh environments of temperature -40°C to +120°C and humidity 5%-95%, with service life > 15 years.

Target Application Scenarios and Value Proposition

Key Application Scenario Analysis

1. High-Density Data Center Switch Cooling

• Scenario Characteristics: Modern data center switches pursue ultra-high port density, with Tomahawk 3 chip power reaching 250-350W, PCB board space is extremely tight, making traditional heatsink installation difficult.

• HP008 Value: 432.8mm ultra-long heat pipes can conduct heat to chassis sidewalls or top ventilation zones, completely freeing PCB board space, supporting 64×100G or 32×400G ultra-high density port configurations.

2. Modular Networking Equipment Cooling

• Scenario Characteristics: Modular switches, routers require flexible thermal management solutions; cooling systems must not interfere with module insertion/removal and maintenance operations.

• HP008 Value: Heat pipe flexible layout characteristics can route around obstacles, directing heat to designated areas; modular fin design supports adjustment of installation position based on actual airflow, improving overall system cooling efficiency by 40%.

3. Harsh Environment Network Equipment Cooling

• Scenario Characteristics: Industrial switches, Outdoor communication equipment operates in harsh environments, with strong equipment sealing and limited internal cooling space.

• HP008 Value: Remote cooling capability can conduct heat to specially designed cooling areas; dual surface treatment adapts to high-humidity, high-salt-spray environments; anti-vibration design ensures stable operation in harsh conditions.

Multi-Layered Value for Customers

For R&D Teams (Technical Value)

• Breaks Design Limitations: Provides an innovative solution to conduct heat remotely from the chip, allowing hardware engineers to design PCB layouts without being limited by heatsink space constraints.

• Simplifies Thermal Design: Prefabricated remote cooling solution significantly reduces system-level thermal simulation complexity, shortening thermal design verification time by over 50%.

• Increases Design Freedom: Allows deployment of high-power chips in locations with poor ventilation but optimal routing, improving signal integrity and system performance.

For Product & Project Management (Business Value)

• Reduces System Cost: A single HP008 can replace complex multi-fan cooling systems, reducing overall cooling costs by 25-35%, decreasing BOM part count.

• Accelerates Time-to-Market: Standardized remote cooling module shortens custom cooling system development cycles, advancing product launch by 2-3 months.

• Enhances Product Differentiation: Innovative remote cooling technology becomes a key product selling point, supporting promotion of higher power density and better cooling performance.

For Data Center Operators (Long-Term Value)

• Reduces Operational Costs: Optimized airflow design reduces fan power consumption, saving approximately 150-250 kWh per device annually, with significant benefits at large-scale deployment.

• Improves Equipment Reliability: Uniform chip temperature distribution extends electronic component lifespan, reducing equipment failure rate by over 30%.

• Supports Continuous Upgrades: Cooling solution provides ample headroom for future upgrades to higher-power switch chips, protecting infrastructure investment.

FAQs