HP006 Heat Pipe Heatsink for CFP DCO Optical Modules

Core Technology: Dual-Path Symmetrical Cooling and Cost-Optimized Design

1. Symmetrical Heat Pipe Layout Design

• Dual-Path Balanced Cooling Architecture: Employs a centrally symmetrical heat pipe layout, with four Ø5mm heat pipes distributed mirror-image style, providing completely symmetrical 80W per path cooling capacity for two CFP DCO modules, ensuring temperature uniformity ΔT < 3°C.

• Economies of Scale Manufacturing Optimization: Symmetrical design enables mold and fixture reuse, reducing manufacturing costs by 35% compared to independent cooling solutions, while increasing production efficiency by 40%.

• Modular Scalability: Design supports side-by-side installation of multiple units, achieving linear scaling of cooling capacity through shared heat pipes, supporting high-density configurations like 4-module, 6-module setups.

2. Integrated Copper Baseplate Technology

• High Thermal Conductivity Pure Copper Baseplate: Uses C1100 high-purity electrolytic copper plate (thermal conductivity 398 W/m·K), thickness 3mm, surface flatness < 0.03mm, ensuring perfect thermal contact with optical module housings.

• Dual Contact Surface Precision Machining: Both module contact surfaces use CNC precision machining, parallelism < 0.05mm, surface roughness Ra < 0.8μm, enabling direct installation without additional processing.

• Structural Strength Optimization: Internal reinforcement rib structure in the copper baseplate limits deformation to < 0.1mm under 50g vibration conditions, meeting telecom equipment anti-vibration requirements.

3. High-Efficiency Heat Pipe Array Configuration

• Short-Distance Efficient Heat Transfer: Heat pipe length optimized to 45mm effective heat transfer section, thermal resistance < 0.08°C/W, improving heat transfer efficiency by 25% over traditional solutions.

• Anti-Gravity Orientation Design: Heat pipe internal composite sintered wick structure supports any installation orientation, performance variation < 5% in vertical, horizontal, or tilted states.

• Redundant Heat Transfer Paths: Each module is served by 2 independent heat pipes + 1 shared heat pipe, maintaining > 70% cooling capacity even if a single heat pipe fails.

4. Professional Passivation Surface Treatment

• Telecom-Grade Environmental Protection: Chromate passivation treatment forms a 1-2μm dense oxide layer on the copper surface, passing 96-hour salt spray tests, meeting GR-487/GR-63 standards.

• Long-Term Thermal Stability: Passivation layer offers stable thermal resistance, performance degradation < 2% under temperature cycling from -40°C to +85°C, ensuring service life over 10 years.

• Installation Compatibility: Treated surface maintains good solderability, supporting customer needs to solder ground wires or mounting brackets at specific locations.

Target Application Scenarios and Customer Value

Key Application Scenario Analysis

1. 400G/800G Optical Transmission Equipment Cooling

• Scenario Characteristics: Next-gen optical transmission equipment uses CFP DCO modules for 400G/800G high-speed transmission, single module power 60-80W, equipment needs to support multi-module high-density deployment.

• HP006 Value: Symmetrical dual-path design meets cooling needs of adjacent modules; compact size adapts to internal chassis space constraints; economies of scale cost advantage supports equipment manufacturers in enhancing price competitiveness.

2. Data Center Interconnect Equipment Cooling

• Scenario Characteristics: Data center spine/leaf switches use CFP DCO modules for high-speed inter-rack interconnection, modules are densely deployed, cooling solutions must ensure long-term reliability.

• HP006 Value: Passivation treatment adapts to data center temperature/humidity environment; heat pipe redundancy design improves system reliability; modular scalability supports 8-16 module high-density configurations.

3. Telecom Core Router Cooling

• Scenario Characteristics: Telecom-grade core routers require 7x24 continuous operation, cooling solutions must meet NEBS Level 3 requirements, support ambient temperature range -5°C to +55°C.

• HP006 Value: Passes GR-63 vibration tests; supports wide temperature operating range; long-life design meets equipment lifespan requirements over 10 years.

Value Proposition for Customers

R&D & Design Value

• Shorten R&D Cycle: Provides complete thermal design package (including 3D models, thermal simulation data, installation guide), reducing customer thermal design time by over 50%.

• Reduce Design Risk: Field-validated cooling solution in telecom equipment, deployed in multiple operator networks, cumulative runtime exceeds 3 million hours.

• Technical Support System: Experienced telecom industry FAE team provides full-process support from concept design to mass production.

Production & Supply Chain Value

• Improve Production Efficiency: Symmetrical design simplifies installation process, assembly line time reduces by 30%; standardized packaging supports automated feeding.

• Optimize Procurement Cost: Compared to purchasing two independent heatsinks, material cost reduces by 25-30%; economies of scale purchasing enjoys further price advantages.

• Quality Assurance System: ISO9001:2015 certified, implements comprehensive SPC statistical process control, supports customer incoming inspection exemption.

Market & Commercial Value

• Product Differentiation: Supports customer promotion of "efficient dual-path cooling", "cost-optimized design" and other product advantages.

• Reduce Total Cost of Ownership: Through cooling solution optimization, customer equipment cooling system cost reduces by 20%, enhancing product price competitiveness.

• Support Global Certification: Provides complete RoHS, REACH, NEBS test reports, supporting customer product global market access.

FAQs