Customer Cases

• Heat Pipe Performance Diagnosis: 30W To 60W Heatsink Optimization

  Our thermal engineering service identified a critical 30W limit in client's heatsink design. Through heat pipe upgrade & optimization, we achieved 60W stable performance, mitigating mass production risks. Partner with us for reliable OEM thermal solutions.

  Solar energy January 13, 2026
• 800W Data Center Switch Cooling Solution: 0.042°C/W with 3D Vapor Chamber

  Situation：Overcoming the 800W Thermal Barrier in 4U Core Switches
  Network equipment manufacturers face a critical challenge when developing next-generation data center core switches: dissipating 800W of thermal power from a single Broadcom Tomahawk 5 chip within a compact 4U form factor. The requirement to achieve ultra-low thermal resistance below 0.045°C/W under 500CFM forced air cooling represented a near-limit performance demand for air cooling technology, necessitating a partnership with an advanced thermal solution provider.

  Switch January 09, 2026
• QSFPDD Thermal Solution: Cold Forging Integration Case

  We are a professional QSFPDD optical module vapor chamber heatsink ODM supplier, with a complete R&D engineering team and advanced manufacturing capabilities, providing end-to-end optical module cooling and Cage integration solutions from design to mass production. The following is an actual project

  Optical Communication January 22, 2026
• CFP2 Thermal Optimization Solution: 9.6℃ Temperature Reduction with Thin Heat Pipe Technology

  A communication equipment manufacturer faced dual challenges in their CFP2 optical module system: insufficient thermal performance and structural interference. As a supplier specializing in optical communication thermal system optimization, we were engaged to address the following issues: uneven temperature distribution across optical modules resulted in a temperature rise of 36°C, exceeding the target of 30°C; meanwhile, the existing heatsink interfered with the system's mounting bracket, compromising integration reliability.

  Optical Communication January 20, 2026
• Miniature Heat Pipe Heatsink: 20W Laser Engraver Quiet Cooling Solution

  Situation
  A consumer electronics device manufacturer was developing a desktop laser engraver. They needed an efficient and low-noise thermal management solution for desktop laser equipment within an extremely compact mechanical space (103×56×56mm) for a 20W laser diode. They sought a thermal partner with integrated OEM/ODM cooling module development and manufacturing capabilities.
   

  Laser January 15, 2026
• High-Density GPU Server Thermal Balancing Solution

  A server manufacturer faced significant thermal challenges while developing its next-generation high-density GPU computing platform. The design required integrating four NVIDIA A-Series high-power chips in a 2×2 array layout within a confined space, with each chip dissipating 500W. The client stipulated that the case temperature (Tcase) of each chip must remain below 80°C, and the temperature differential between the front and rear chip groups must be controlled within 3°C to ensure system stability and computational consistency under sustained high loads.

  Server January 08, 2026
• Innovative Optical Cooling: Dual Solutions Beat Thermal Challenges

  A globally leading Tier-1 communications equipment client encountered critical thermal management challenges during the development of their next-generation coherent optical modules. The module contains two heat sources, each operating at 13W with a compact size of 27×13mm, while the system's permissible air cooling capacity is limited to only 10CFM. The client required the overall thermal resistance to be strictly maintained within 0.6°C/W and sought comprehensive thermal technology support spanning thermal design, prototype development, testing, and mass production.

  Optical Communication December 12, 2025