 |
SH003
| Quantity: | |
|---|---|
The SH003 is a specialized ultra-thin active cooling solution designed for telecommunications equipment, featuring skived fin technology with integrated centrifugal fan to achieve efficient active cooling within an ultra-thin 14.3mm profile. As a telecom cooling specialist, we help communication equipment manufacturers solve thermal challenges for high-power components in space-constrained environments through innovative structural design.
Ultra-Thin Design: 14.3mm thickness adapts to compact telecom equipment
Active Cooling: Integrated centrifugal fan eliminates dependence on system airflow
Skived Fin Technology: High-density fins maximize cooling surface area
Telecom-Grade Reliability: Degreasing surface treatment for harsh environments
OEM Customization: Complete solutions for telecom equipment manufacturers
Skived Fin Process: Precision skiving technology enables high-density fin arrays within 14.3mm thickness. Compared to traditional extrusion, skiving achieves thinner fins and tighter fin spacing, significantly increasing cooling area per unit volume. Skived fins feature smooth surfaces with low airflow resistance, working optimally with centrifugal fans for maximum cooling efficiency.
Integrated Centrifugal Fan: The centrifugal fan is seamlessly integrated with the skived heatsink to form a complete active cooling unit. Centrifugal fans offer high static pressure and compact size, making them ideal for tight telecom equipment spaces. The fan features long-life dual ball bearings with MTBF >70,000 hours, meeting 7×24 continuous operation requirements of telecom equipment.
Integrated Structural Design: Precision fit between heatsink body and centrifugal fan ensures最短 airflow path and minimal resistance. Fan placement is optimized through CFD analysis to ensure uniform airflow across all fin areas, eliminating local hotspots.
Degreasing Surface Treatment: Professional degreasing process removes residual oil and contaminants from manufacturing. Degreasing ensures surface cleanliness for customer assembly and soldering processes. The treated surface has no residue and does not affect cooling performance.
Telecom Base Station Equipment Cooling: 5G base stations have extremely limited space, making traditional cooling solutions difficult to deploy. With its 14.3mm ultra-thin profile, SH003 flexibly installs in tight base station spaces. The integrated centrifugal fan eliminates dependence on system airflow, simplifying equipment structural design. Helps telecom equipment manufacturers achieve higher power density within limited space.
Optical Communication Module Cooling: Power consumption of high-speed optical modules continues to rise, exceeding the capability of passive cooling. SH003 provides active cooling for optical modules, ensuring stable operation in high-temperature environments. Ultra-thin design does not affect module density, supporting high-port-count configurations.
Network Switch Localized Cooling: Switches often have localized high-heat areas that system fans cannot adequately cover. SH003 serves as an auxiliary cooling unit for targeted hotspot cooling. The plug-and-play active solution requires no modification to system airflow design.
Space Savings: 14.3mm ultra-thin design adapts to various compact equipment.
Design Simplification: Integrated fan eliminates complex system airflow design.
Deployment Flexibility: Targeted cooling for specific hotspot areas.
High Reliability: Long-life fan design reduces maintenance frequency.
Fast Time-to-Market: Standardized solution shortens product development cycles.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
The SH003 is a specialized ultra-thin active cooling solution designed for telecommunications equipment, featuring skived fin technology with integrated centrifugal fan to achieve efficient active cooling within an ultra-thin 14.3mm profile. As a telecom cooling specialist, we help communication equipment manufacturers solve thermal challenges for high-power components in space-constrained environments through innovative structural design.
Ultra-Thin Design: 14.3mm thickness adapts to compact telecom equipment
Active Cooling: Integrated centrifugal fan eliminates dependence on system airflow
Skived Fin Technology: High-density fins maximize cooling surface area
Telecom-Grade Reliability: Degreasing surface treatment for harsh environments
OEM Customization: Complete solutions for telecom equipment manufacturers
Skived Fin Process: Precision skiving technology enables high-density fin arrays within 14.3mm thickness. Compared to traditional extrusion, skiving achieves thinner fins and tighter fin spacing, significantly increasing cooling area per unit volume. Skived fins feature smooth surfaces with low airflow resistance, working optimally with centrifugal fans for maximum cooling efficiency.
Integrated Centrifugal Fan: The centrifugal fan is seamlessly integrated with the skived heatsink to form a complete active cooling unit. Centrifugal fans offer high static pressure and compact size, making them ideal for tight telecom equipment spaces. The fan features long-life dual ball bearings with MTBF >70,000 hours, meeting 7×24 continuous operation requirements of telecom equipment.
Integrated Structural Design: Precision fit between heatsink body and centrifugal fan ensures最短 airflow path and minimal resistance. Fan placement is optimized through CFD analysis to ensure uniform airflow across all fin areas, eliminating local hotspots.
Degreasing Surface Treatment: Professional degreasing process removes residual oil and contaminants from manufacturing. Degreasing ensures surface cleanliness for customer assembly and soldering processes. The treated surface has no residue and does not affect cooling performance.
Telecom Base Station Equipment Cooling: 5G base stations have extremely limited space, making traditional cooling solutions difficult to deploy. With its 14.3mm ultra-thin profile, SH003 flexibly installs in tight base station spaces. The integrated centrifugal fan eliminates dependence on system airflow, simplifying equipment structural design. Helps telecom equipment manufacturers achieve higher power density within limited space.
Optical Communication Module Cooling: Power consumption of high-speed optical modules continues to rise, exceeding the capability of passive cooling. SH003 provides active cooling for optical modules, ensuring stable operation in high-temperature environments. Ultra-thin design does not affect module density, supporting high-port-count configurations.
Network Switch Localized Cooling: Switches often have localized high-heat areas that system fans cannot adequately cover. SH003 serves as an auxiliary cooling unit for targeted hotspot cooling. The plug-and-play active solution requires no modification to system airflow design.
Space Savings: 14.3mm ultra-thin design adapts to various compact equipment.
Design Simplification: Integrated fan eliminates complex system airflow design.
Deployment Flexibility: Targeted cooling for specific hotspot areas.
High Reliability: Long-life fan design reduces maintenance frequency.
Fast Time-to-Market: Standardized solution shortens product development cycles.
Q：Do you have your own brand? A：Yes. Our brand name is GREATMINDS. |
Q：Are you a manufacture or trading company？ A：We design and produce thermal products by ourselves. |
Q：Where is your plant? A：We have two plants. One is at Suzhou in eastern China, and the other is at Dongguan in southern China. |
Q：What thermal products do you supply? A：We have heatsink, fan, heapipe, vapor chamber, liquid cooling solution, and so on. |
Q：Which types of heatsinks do you supply? A：Our products cover many processes, extrusion, die casting, skived fin, zipper fin, soldering,friction stir welding, vaccum brazing, and so on. |
Q：What is the leadtime for prototype? A：It depends on different type of products. Usually it takes 2-3 weeks. |
Q：Do you have a NPI process in your company? A：Yes. Tooling samples and trial run will be strictly implemented before mass production. |
Q：What capabilities do you have in your plant? A：We have stamping, machining, and soldering production in house. |
