SH002 Skived Heatsink Ultra-Thin Passive Cooling Solution for Telecom

Product Core: High-Performance Ultra-Thin Heatsink for Confined Spaces

The SH002 is a specialized ultra-thin passive heatsink designed for telecommunications equipment, featuring precision skived fin technology to deliver excellent cooling performance within an ultra-thin 13mm profile. As a telecom cooling specialist, we help communication equipment manufacturers solve thermal challenges for high-power components in space-constrained environments.

Core Values

• Ultra-Thin Design: 13mm thickness adapts to compact telecom equipment.

• Skived Fin Technology: High-density fins maximize cooling surface area.

• Passive Cooling: Zero power consumption, maintenance-free, and extremely high reliability.

• Telecom-Grade Reliability: Degreasing surface treatment for harsh environments.

• OEM Customization: Complete solutions for telecom equipment manufacturers.

Technology Innovation: Ultra-Thin Passive Cooling Design

• Precision Skived Fin Process: Advanced skiving technology enables high-density fin arrays within 13mm thickness. Compared to traditional extrusion, skiving achieves thinner fins and tighter fin spacing, increasing cooling area per unit volume by over 40%. Skived fins feature smooth surfaces with low airflow resistance, achieving optimal cooling efficiency under natural convection conditions.

• Ultra-Thin Structure Optimization: CFD fluid simulation optimizes fin height, spacing, and thickness ratios to maximize cooling performance within the 13mm height constraint. Fins are vertically arranged to leverage natural hot air rising, creating efficient natural convection cooling channels.

• Telecom-Grade Reliability Design: Fully passive cooling design with no moving parts achieves true zero power consumption and maintenance-free operation. Product service life is only limited by material aging, requiring no replacement within the 15-year design life of telecom equipment.

• Degreasing Surface Treatment: Professional degreasing process removes residual oil and contaminants from manufacturing. Degreasing ensures surface cleanliness for customer assembly and soldering processes. The treated surface has no residue and does not affect cooling performance.

Application Scenarios and Customer Value

• 5G Base Station Internal Module Cooling: 5G base stations have extremely limited space, making traditional heatsinks difficult to deploy. With its 13mm ultra-thin profile, SH002 flexibly installs in tight base station spaces. Passive cooling design with zero power consumption does not affect overall base station energy efficiency. Helps telecom equipment manufacturers achieve higher power density within limited space.

• Optical Communication Module Auxiliary Cooling: Power consumption of high-speed optical modules continues to rise, increasing demand for pure passive cooling. SH002 serves as an extended heatsink for module housings, expanding cooling area and reducing module operating temperature. Ultra-thin design does not affect module density, supporting high-port-count configurations.

• Telecom Chassis Internal Cooling: Telecom chassis have densely packed equipment with restricted airflow. SH002 serves as a localized heatsink for board-mounted chips, conducting heat to the chassis airflow. Standardized dimensions facilitate batch deployment and replacement.

• Edge Computing Equipment Cooling: Edge computing nodes have limited space and are often deployed in non-air-conditioned environments. SH002's passive cooling design requires no fans, avoiding maintenance issues caused by fan failure, making it suitable for remote deployment scenarios.

Core Customer Value:

• Space Savings: 13mm ultra-thin design adapts to various compact equipment.

• Zero Power Operation: Passive cooling does not affect system energy efficiency.

• Maintenance-Free Design: No moving parts, ideal for remote deployment.

• Ultra-High Reliability: Service life only limited by material aging, matching telecom equipment 15-year design life.

• Fast Integration: Standardized dimensions simplify product development.

FAQs